KR101941936B1 - Smt 설비 이상 감시 및 예측 시스템 및 그의 동작 방법 - Google Patents

Smt 설비 이상 감시 및 예측 시스템 및 그의 동작 방법 Download PDF

Info

Publication number
KR101941936B1
KR101941936B1 KR1020130145361A KR20130145361A KR101941936B1 KR 101941936 B1 KR101941936 B1 KR 101941936B1 KR 1020130145361 A KR1020130145361 A KR 1020130145361A KR 20130145361 A KR20130145361 A KR 20130145361A KR 101941936 B1 KR101941936 B1 KR 101941936B1
Authority
KR
South Korea
Prior art keywords
process error
data
smt
smt line
occurrence
Prior art date
Application number
KR1020130145361A
Other languages
English (en)
Korean (ko)
Other versions
KR20150061351A (ko
Inventor
신승용
조철형
박석정
서정필
Original Assignee
한화에어로스페이스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한화에어로스페이스 주식회사 filed Critical 한화에어로스페이스 주식회사
Priority to KR1020130145361A priority Critical patent/KR101941936B1/ko
Priority to CN201410092513.XA priority patent/CN104684270B/zh
Publication of KR20150061351A publication Critical patent/KR20150061351A/ko
Application granted granted Critical
Publication of KR101941936B1 publication Critical patent/KR101941936B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B21/00—Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B21/00—Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
    • G08B21/18—Status alarms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Business, Economics & Management (AREA)
  • Emergency Management (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • General Factory Administration (AREA)
KR1020130145361A 2013-11-27 2013-11-27 Smt 설비 이상 감시 및 예측 시스템 및 그의 동작 방법 KR101941936B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020130145361A KR101941936B1 (ko) 2013-11-27 2013-11-27 Smt 설비 이상 감시 및 예측 시스템 및 그의 동작 방법
CN201410092513.XA CN104684270B (zh) 2013-11-27 2014-03-13 用于监视和预测smt设备的故障的系统及其操作方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130145361A KR101941936B1 (ko) 2013-11-27 2013-11-27 Smt 설비 이상 감시 및 예측 시스템 및 그의 동작 방법

Publications (2)

Publication Number Publication Date
KR20150061351A KR20150061351A (ko) 2015-06-04
KR101941936B1 true KR101941936B1 (ko) 2019-01-24

Family

ID=53318674

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130145361A KR101941936B1 (ko) 2013-11-27 2013-11-27 Smt 설비 이상 감시 및 예측 시스템 및 그의 동작 방법

Country Status (2)

Country Link
KR (1) KR101941936B1 (zh)
CN (1) CN104684270B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023033474A1 (ko) * 2021-09-06 2023-03-09 주식회사 한화 반도체 증착 시스템 및 이의 동작 방법

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105346244A (zh) * 2015-12-11 2016-02-24 江阴鑫辉太阳能有限公司 一种太阳能电池板的丝网印刷在线监控系统
KR102524763B1 (ko) * 2016-01-25 2023-04-21 한화정밀기계 주식회사 Smt 공정 라인 에러 알림 장치
JP6803145B2 (ja) * 2016-03-16 2020-12-23 株式会社イシダ 装置管理システム
CN106079892B (zh) * 2016-07-12 2019-01-25 重庆大学 一种pcb锡膏印刷过程质量智能监控系统及方法
JP6600819B2 (ja) * 2016-09-30 2019-11-06 パナソニックＩｐマネジメント株式会社 部品実装ライン制御システム
US11553632B2 (en) * 2017-08-08 2023-01-10 Fuji Corporation Production system and production system control method
CN108037739A (zh) * 2017-11-09 2018-05-15 广州兴森快捷电路科技有限公司 Pcb产品的过程管控方法和系统
CN109343493A (zh) * 2018-11-09 2019-02-15 伟创力电子技术(苏州)有限公司 基于焊膏检测设备的控制系统
CN109709920A (zh) * 2018-12-27 2019-05-03 Oppo（重庆）智能科技有限公司 数据处理方法及相关产品
CN110600112B (zh) * 2019-08-12 2023-04-07 东软医疗系统股份有限公司 一种用于发现零部件质量问题的方法、装置及设备
CN112261866A (zh) * 2020-09-28 2021-01-22 西南电子技术研究所（中国电子科技集团公司第十研究所） 智能决策pcb质量的smt工艺预测工具
KR102620421B1 (ko) * 2022-02-16 2024-01-25 주식회사 인큐에스엠티 생산 모델 변경에 적응적으로 대응하는 smt 시스템

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110288A (ja) * 2001-07-23 2003-04-11 Fuji Mach Mfg Co Ltd 対回路基板作業システムおよび電子回路製造方法
JP2007334694A (ja) * 2006-06-15 2007-12-27 Omron Corp 要因推定装置、要因推定プログラム、要因推定プログラムを記録した記録媒体、および要因推定方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2278965B (en) * 1993-06-07 1997-08-27 Centalic Tech Dev Ltd Testing Apparatus
JP3441111B2 (ja) * 1993-06-17 2003-08-25 松下電器産業株式会社 実装基板生産システムおよびメンテナンス指示システム
KR20030046607A (ko) 2001-12-06 2003-06-18 삼성전자주식회사 반도체 제조 공정에 사용되는 경보 장치
JP5506465B2 (ja) * 2010-03-10 2014-05-28 富士機械製造株式会社 部品実装機の部品実装方法
KR101246582B1 (ko) * 2010-12-30 2013-03-25 김만섭 표면 실장 시스템의 리플로우 오븐의 가상 프로파일 모니터링 방법 및 시스템
CN103313590A (zh) * 2013-06-25 2013-09-18 无锡商业职业技术学院 一种smt生产线

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110288A (ja) * 2001-07-23 2003-04-11 Fuji Mach Mfg Co Ltd 対回路基板作業システムおよび電子回路製造方法
JP2007334694A (ja) * 2006-06-15 2007-12-27 Omron Corp 要因推定装置、要因推定プログラム、要因推定プログラムを記録した記録媒体、および要因推定方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023033474A1 (ko) * 2021-09-06 2023-03-09 주식회사 한화 반도체 증착 시스템 및 이의 동작 방법

Also Published As

Publication number Publication date
CN104684270B (zh) 2019-05-10
CN104684270A (zh) 2015-06-03
KR20150061351A (ko) 2015-06-04

Similar Documents

Publication Publication Date Title
KR101941936B1 (ko) Smt 설비 이상 감시 및 예측 시스템 및 그의 동작 방법
KR101883483B1 (ko) Smt 설비 이상 감시 및 예측 시스템 및 그의 동작 방법
JP6812660B2 (ja) 生産ラインの管理装置
JPWO2015114828A1 (ja) 基板生産モニタリング装置および基板生産モニタリング方法
CN110045688B (zh) 检查管理系统、检查管理装置及检查管理方法
JP6319813B2 (ja) 生産システム
CN104200316A (zh) 一种smt闭环集成优化系统及其优化方法
US7174233B1 (en) Quality/reliability system and method in multilevel manufacturing environment
CN111844029A (zh) 机器人预警监控方法及装置
JP6922694B2 (ja) 管理システム、管理装置、管理方法、及びプログラム
CN108966631A (zh) 应用于表面贴装技术的产线技术方案
US11550293B2 (en) Board production management device and board production management method to determine a countermeasure to a board production device error
JP2007053264A (ja) 実装品質の不良検出装置及び実装品質の不良検出方法
JP2006332461A (ja) 情報処理装置、情報処理方法、プログラム、および、プログラムを記録したコンピュータ読み取り可能な記録媒体
CN103426785B (zh) 芯片贴装机的安装不良跟踪方法及装置
KR102022470B1 (ko) Smt 생산라인의 이상 감시 및 예측 시스템의 기준 정보 설정 시스템
CN109661166B (zh) 制造系统以及授予权限的方法
KR101581894B1 (ko) 표면 실장 통합 관리 장치
CN109478054A (zh) 基板生产管理装置及基板生产管理方法
KR102524763B1 (ko) Smt 공정 라인 에러 알림 장치
KR102484211B1 (ko) 전자부품 실장라인들의 통합유지보수방법
KR20150104766A (ko) 검사공정에서의 불량 이력 추적 방법
KR101278999B1 (ko) 표면실장라인 모니터링 시스템
JPWO2018016018A1 (ja) 部品実装ラインの生産管理システム
CN116784009A (zh) 管理系统、管理装置、管理方法以及程序

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment
E90F Notification of reason for final refusal
AMND Amendment
X701 Decision to grant (after re-examination)