JP6600819B2 - 部品実装ライン制御システム - Google Patents
部品実装ライン制御システム Download PDFInfo
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- JP6600819B2 JP6600819B2 JP2016192821A JP2016192821A JP6600819B2 JP 6600819 B2 JP6600819 B2 JP 6600819B2 JP 2016192821 A JP2016192821 A JP 2016192821A JP 2016192821 A JP2016192821 A JP 2016192821A JP 6600819 B2 JP6600819 B2 JP 6600819B2
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- component mounting
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- Prior art date
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- 239000000758 substrate Substances 0.000 claims description 146
- 238000011084 recovery Methods 0.000 claims description 72
- 238000004519 manufacturing process Methods 0.000 claims description 55
- 238000012545 processing Methods 0.000 claims description 43
- 238000003860 storage Methods 0.000 claims description 43
- 230000005856 abnormality Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 21
- 230000008569 process Effects 0.000 description 21
- 238000004891 communication Methods 0.000 description 17
- 238000007689 inspection Methods 0.000 description 12
- 238000007639 printing Methods 0.000 description 12
- 238000011144 upstream manufacturing Methods 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 9
- 230000014759 maintenance of location Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 101000661807 Homo sapiens Suppressor of tumorigenicity 14 protein Proteins 0.000 description 3
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- 102100035353 Cyclin-dependent kinase 2-associated protein 1 Human genes 0.000 description 1
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- 230000002159 abnormal effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0495—Mounting of components, e.g. of leadless components having a plurality of work-stations
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32265—Waiting, queue time, buffer
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45029—Mount and solder parts on board
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
- General Factory Administration (AREA)
Description
1a 部品実装ライン
M1 基板供給装置
M2 基板受渡装置
M3 印刷装置
M4 印刷検査装置
M5 第1部品搭載装置
M6 第2部品搭載装置
M7 搭載状態検査装置
M8 リフロー装置
M9 基板回収装置
Claims (7)
- 部品を実装して実装基板を製造する複数の部品実装用装置と前記実装基板を回収する基板回収部とで構成される部品実装ラインを制御する部品実装ライン制御システムにおいて、
前記実装基板を回収する基板回収部から情報を取得する取得部と、
取得した情報に基づいて前記部品実装用装置を制御する制御部とを備え、
前記取得部が前記基板回収部から前記実装基板の収納限界に近い状態であることを知らせる第1警告情報を取得した場合、前記制御部は前記部品実装用装置における生産処理時間を遅延させる制御を実行する、部品実装ライン制御システム。 - 前記取得部が前記基板回収部から前記実装基板の収納限界状態であることを知らせる第2警告情報を取得した場合、前記制御部は前記部品実装用装置による生産を停止させる制御を実行する、請求項1に記載の部品実装ライン制御システム。
- 前記取得部が前記基板回収部から異常が発生したことを知らせる第3警告情報を取得した場合、前記制御部は前記部品実装用装置における生産処理時間を遅延させる制御を実行する、請求項1または2のいずれかに記載の部品実装ライン制御システム。
- 前記取得部が前記部品実装用装置から搬送詰りを知らせる第4警告情報を取得した場合、前記制御部は前記部品実装用装置による生産を停止させる制御を実行する、請求項1から3のいずれかに記載の部品実装ライン制御システム。
- 作業者に設備状態を報知する報知部をさらに備え、
前記取得部が前記基板回収部から前記実装基板の収納限界に近い状態であることを知らせる第1警告情報を取得した場合、前記報知部は作業者に前記実装基板の回収が必要な状態である旨を報知する、請求項1から4のいずれかに記載の部品実装ライン制御システム。 - 前記部品実装用装置における生産処理時間を遅延させる制御は、搬送速度の低減または
供給インターバルの時間の増加である請求項1から5のいずれかに記載の部品実装ライン制御システム。 - 前記作業者が携帯する携帯端末から作業者の位置情報を特定する位置情報特定部をさらに備え、
前記制御部は、前記第1警告情報を送信した部品実装ラインの近くに前記作業者がいるか否かを判断し、前記作業者の所在が確認されなかった場合に、前記制御部は前記部品実装用装置における生産処理時間を遅延させる制御を実行する請求項1から6のいずれかに記載の部品実装ライン制御システム。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016192821A JP6600819B2 (ja) | 2016-09-30 | 2016-09-30 | 部品実装ライン制御システム |
US15/700,401 US11086307B2 (en) | 2016-09-30 | 2017-09-11 | Component mounting line control system that increases manufacturing processing time in response to operator location and storage capacity information |
CN201710870862.3A CN107889445B (zh) | 2016-09-30 | 2017-09-22 | 部件安装生产线控制系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016192821A JP6600819B2 (ja) | 2016-09-30 | 2016-09-30 | 部品実装ライン制御システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018056449A JP2018056449A (ja) | 2018-04-05 |
JP6600819B2 true JP6600819B2 (ja) | 2019-11-06 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016192821A Active JP6600819B2 (ja) | 2016-09-30 | 2016-09-30 | 部品実装ライン制御システム |
Country Status (3)
Country | Link |
---|---|
US (1) | US11086307B2 (ja) |
JP (1) | JP6600819B2 (ja) |
CN (1) | CN107889445B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110168458B (zh) * | 2017-01-10 | 2023-03-14 | 株式会社富士 | 管理装置、安装关联装置及安装系统 |
Family Cites Families (24)
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US4667403A (en) * | 1984-05-16 | 1987-05-26 | Siemens Aktiengesellschaft | Method for manufacturing electronic card modules |
CA2038939C (en) * | 1989-08-10 | 1997-06-17 | Satomi Furukawa | Production control system |
JPH076939A (ja) * | 1992-12-02 | 1995-01-10 | Hitachi Ltd | 生産管理システム |
JP3562450B2 (ja) * | 2000-08-07 | 2004-09-08 | 松下電器産業株式会社 | 電子部品実装用装置および電子部品実装方法 |
WO2006132282A1 (ja) * | 2005-06-10 | 2006-12-14 | Matsushita Electric Industrial Co., Ltd. | 生産管理方法、生産管理装置、部品実装機 |
CN101208640A (zh) | 2005-06-10 | 2008-06-25 | 松下电器产业株式会社 | 生产管理方法、生产管理装置以及元件安装机 |
DE102008048723A1 (de) * | 2007-09-25 | 2009-05-14 | Panasonic Corp., Kadoma | Bauelement-Montagevorrichtung, Warnungsausgabevorrichtung und Warnungsausgabeverfahren |
EP2075659A1 (en) * | 2007-12-31 | 2009-07-01 | Tetra Laval Holdings & Finance SA | Integrated packaging system architecture |
JP2009182160A (ja) * | 2008-01-31 | 2009-08-13 | Yamaha Motor Co Ltd | 表面実装機の部品供給管理システムおよび表面実装機 |
EP2363768B1 (de) * | 2010-01-27 | 2012-10-10 | Umberto Calliari | Sicherheitsbremseinrichtung für bewegte Maschinenelemente |
JP5223881B2 (ja) * | 2010-04-19 | 2013-06-26 | パナソニック株式会社 | 部品実装装置における部品供給方法 |
EP2676405A4 (en) * | 2011-02-16 | 2016-06-22 | Kortek Ind Pty Ltd | CONTROL OF AUTOMATION, LIGHT AND WIRELESS POWER |
CA2890612A1 (en) * | 2011-11-07 | 2013-05-16 | Kortek Industries Pty Ltd | Adaptable wireless power, light and automation system |
JP5916357B2 (ja) * | 2011-11-28 | 2016-05-11 | 富士機械製造株式会社 | 電子部品実装システム |
JP5877314B2 (ja) * | 2012-05-08 | 2016-03-08 | パナソニックIpマネジメント株式会社 | 電子部品実装システムおよび電子部品実装方法 |
JP6108413B2 (ja) * | 2012-10-30 | 2017-04-05 | 富士機械製造株式会社 | 部品実装ラインの生産監視システム |
JP5909651B2 (ja) * | 2012-12-12 | 2016-04-27 | パナソニックIpマネジメント株式会社 | 電子部品実装システム |
JP5887497B2 (ja) * | 2013-02-26 | 2016-03-16 | パナソニックIpマネジメント株式会社 | 部品供給装置 |
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KR101941936B1 (ko) * | 2013-11-27 | 2019-01-24 | 한화에어로스페이스 주식회사 | Smt 설비 이상 감시 및 예측 시스템 및 그의 동작 방법 |
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EP2988583B1 (en) | 2014-06-20 | 2018-10-10 | Yamaha Hatsudoki Kabushiki Kaisha | Substrate working device, substrate working method, and substrate working system |
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-
2016
- 2016-09-30 JP JP2016192821A patent/JP6600819B2/ja active Active
-
2017
- 2017-09-11 US US15/700,401 patent/US11086307B2/en active Active
- 2017-09-22 CN CN201710870862.3A patent/CN107889445B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2018056449A (ja) | 2018-04-05 |
US11086307B2 (en) | 2021-08-10 |
CN107889445A (zh) | 2018-04-06 |
US20180095453A1 (en) | 2018-04-05 |
CN107889445B (zh) | 2021-05-07 |
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