KR101941936B1 - System for diagnosiing and estimating facilities disorder of surface mount technology and thereof method - Google Patents

System for diagnosiing and estimating facilities disorder of surface mount technology and thereof method Download PDF

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KR101941936B1
KR101941936B1 KR1020130145361A KR20130145361A KR101941936B1 KR 101941936 B1 KR101941936 B1 KR 101941936B1 KR 1020130145361 A KR1020130145361 A KR 1020130145361A KR 20130145361 A KR20130145361 A KR 20130145361A KR 101941936 B1 KR101941936 B1 KR 101941936B1
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South Korea
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process error
data
smt
smt line
occurrence
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KR1020130145361A
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Korean (ko)
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KR20150061351A (en
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신승용
조철형
박석정
서정필
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한화에어로스페이스 주식회사
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Abstract

The present invention provides SMT equipment capable of leading to production and quality innovation by allowing the manager to take appropriate measures by generating real time notification and prediction notification on process problems using process data collected from the SMT line without installing any additional hardware An abnormal monitoring and prediction system and an operation method thereof.

Description

TECHNICAL FIELD [0001] The present invention relates to an SMT equipment abnormality monitoring and prediction system, and a method of operating the same. BACKGROUND ART < RTI ID = 0.0 >

The present invention relates to an SMT equipment abnormality surveillance and prediction system and an operation method thereof that induce a manager and a worker to take appropriate measures by generating real time notification and prediction notification on process problems using process data collected in the SMT line .

Korean Patent Laid-Open Publication No. 2003-0046607 discloses an alarm device used in a semiconductor manufacturing process. The alarm apparatus includes a plurality of LEDs and a buzzer of different colors for notifying an operator of a manufacturing apparatus where a process progress or a process error occurs in a work space provided with a plurality of manufacturing apparatuses, And / or the occurrence of an error. However, this requires a separate hardware.

The SMT line has many limitations on the installation of separate hardware, and the alarm system provides action guidelines for the problem in the process. However, due to the different working environment of the plant, You should verify that the action against the warning is appropriate by gathering separate data. Experienced workers can take appropriate action when a warning occurs, but inexperienced workers are likely to be unable to judge the warning in the event of a warning and take inappropriate measures. In particular, since the number of workers per line in the SMT line is not as large as 1-2, there is a disadvantage in that it is difficult to immediately know what action has been taken by an experienced operator in the event of a warning.

Korean Patent Publication No. 2003-0046607

The technical problem to be solved by the present invention is to provide real-time notification and prediction notification on process problems using process data collected from SMT line without installing any hardware, And to provide an SMT equipment abnormality monitoring and prediction system and an operation method thereof that can lead to innovation.

SUMMARY OF THE INVENTION The present invention is directed to a system and method for monitoring and forecasting an SMT equipment abnormality. The SMT equipment abnormality monitoring and forecasting system includes at least one of a plurality of equipment for printing solder paste on a printed circuit board SMT line over; Detecting the occurrence of the first process error by comparing the data collected from the equipment included in the SMT line and predetermined management data, comparing the collected data and accumulated data of a predetermined period of time, A monitoring unit for detecting occurrence of a second process error as a predicted process error and generating a warning signal according to the occurrence of the first or second process error and transmitting the alert signal to the corresponding equipment in the SMT line; And a user terminal for displaying the information generated by the monitoring unit.

In the present invention, the monitoring unit monitors the SMT operation status information according to data collected from the devices included in the SMT line, the process index information of the SMT line according to a predetermined period, and the solution information according to the occurrence of defects of the SMT line .

In the present invention, the monitoring unit sets the SMT line equipment information, model information, and part information, sets the management data for managing factors affecting production and quality in the SMT line, A UI providing module for setting a level setting condition; A collection module for obtaining data collected from each device of the SMT line; Processing the occurrence of the first process error by comparing the collected data and the management data, comparing the collected data and accumulated data of a predetermined period of time, and processing the occurrence of the second process error for the collected data Processing module; Setting a process error level for the first or second process error according to the process error level setting condition, generating the warning signal according to the process error level, and transmitting the generated process signal to the equipment where the process error in the SMT line has occurred Control module; And a storage module for storing information and data set by the UI providing module, and data generated by the processing module and the control module.

In the present invention, the UI providing module may include: a monitoring unit for monitoring the operation status of the SMT line; A reporting unit for processing process index information of the SMT line for a predetermined period; A defect management unit for analyzing defects occurring in the SMT line to generate a solution; And a process error processing unit which processes the first or second process error so as to confirm the occurrence of the first or second process error.

In the present invention, the UI providing module may be included in the user terminal.

In the present invention, the process error processing unit may be included in each equipment of the SMT line.

In the present invention, the collecting module may further include a standardization module for standardizing the collected data.

In the present invention, it is preferable that the processing module compares the collected data with the management data to determine occurrence of the first process error, and transmits the first process error occurrence signal to the control module and the storage module 1 processor; A second processor for determining occurrence of an event when the collected data is irregular data for which the collected data is not set, and for transmitting the event generation signal to the storage module; And a control unit for comparing the collected data and accumulated data of a predetermined period of time to determine whether the second process error has occurred in the collected data and transmitting the second process error occurrence signal to the control module and the storage module 3 processing unit.

And a dump processing unit for deleting the collected data not included in the management data in the present invention.

The memory may further include a memory for accumulating data output from the first processing unit, the second processing unit, and the third processing unit, and resetting the data at predetermined intervals.

In the present invention, the control module may include a step of comparing the process error level setting condition with the first or second process error to set a process error level, and generating different warning signals according to the process error level And an error management unit.

In the present invention, the process error management unit may generate an alarm signal to display the occurrence of the process error on a monitor of the SMT line internal equipment in which the process error has occurred, generate an alarm signal to output a warning sound, Or generates a warning signal for inhibiting the inflow of the printed circuit board into the SMT line, or suspends the operation of the SMT line.

In the present invention, the process error management unit may generate at least two warning signals according to the process error level.

In order to solve the technical problem of the present invention, there is provided a method of operating an SMT equipment abnormality monitoring and prediction system, comprising the steps of printing a solder paste on a printed circuit board, The SMT equipment abnormality monitoring and predicting system operates to monitor at least one or more SMT lines constituting the SMT equipment line by comparing the data collected from the equipment included in the SMT line and predetermined management data, A first process error processing step; A second process error processing step of comparing the collected data and cumulative data of a predetermined period of time to determine occurrence of a second process error as a prediction process error on the collected data; And generating a warning signal according to the occurrence of the first or second process error and transmitting the alert signal to the corresponding equipment in the SMT line.

In the present invention, the operation status information of the SMT line according to data collected from the devices included in the SMT line, the process index information of the SMT line according to a predetermined period, and the solution information according to the defect occurrence of the SMT line are generated Further comprising the steps of:

The method may further include transmitting the alert signal and the information to a user terminal.

In the present invention, the SMT line equipment information, model information, and part information are set, the management data for managing factors affecting production and quality in the SMT line are set, and the process error level setting condition The method comprising the steps of:

In the present invention, the process error management step may include comparing the process error level setting condition with the first or second process error, setting a process error level, and generating different warning signals according to the process error level The method comprising the steps of:

In the present invention, an alarm signal is generated to indicate the occurrence of the process error on the monitor of the SMT line internal equipment in which the process error has occurred, an alarm signal to output a warning sound, or an alarm signal to display a warning light Generating a warning signal for preventing entry of the printed circuit board into the SMT line, or stopping the operation of the SMT line.

The method may further include generating at least two warning signals according to the process error level.

As described above, according to the present invention, it is possible to easily grasp the process problem of the SMT line in real time by generating real-time notification and prediction notification on process problems using the process data collected in the SMT line without installing any additional hardware, It is possible to share know-how on solving process problems among workers. From this, it is possible to contribute to increase of productivity and quality improvement.

FIG. 1 is a block diagram showing a configuration of an SMT equipment abnormality monitoring and prediction system according to an embodiment of the present invention.
2 is a detailed block diagram of Fig.
FIG. 3 is a view showing an example of process index information of an SMT line generated by a UI providing module in FIG. 2 according to a predetermined period.
FIG. 4 is a diagram showing an example in which a corresponding device of the SMT line in which a process error occurs under the control of the control module in FIG. 2 outputs a warning signal.
5 is a flowchart illustrating an operation method of the SMT equipment abnormality monitoring and prediction system according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by terms. Terms are used only for the purpose of distinguishing one component from another.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

The present invention may be represented by functional block configurations and various processing steps. These functional blocks may be implemented in a wide variety of hardware and / or software configurations that perform particular functions. For example, the present invention may include integrated circuit configurations, such as memory, processing, logic, look-up tables, etc., that may perform various functions by control of one or more microprocessors or other control devices Can be adopted. Similar to the components of the present invention that may be implemented with software programming or software components, the present invention may be implemented as a combination of C, C ++, and C ++, including various algorithms implemented with data structures, processes, routines, , Java (Java), assembler, and the like. Functional aspects may be implemented with algorithms running on one or more processors. Further, the present invention can employ conventional techniques for electronic environment setting, signal processing, and / or data processing. Terms such as mechanisms, elements, means, and configurations are widely used and are not limited to mechanical and physical configurations. The term may include the meaning of a series of routines of software in conjunction with a processor or the like.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Referring to the accompanying drawings, the same or corresponding components are denoted by the same reference numerals, do.

FIG. 1 is a block diagram showing a configuration of an SMT equipment abnormality monitoring and prediction system according to an embodiment of the present invention, and FIG. 2 is a detailed block diagram of FIG.

Referring to FIGS. 1 and 2, an SMT equipment abnormality monitoring and prediction system may include an SMT line 100, a monitoring unit 200, and a user terminal 300.

The SMT line 100 includes a loader 110 solder paste inspector 120, a chip mounter 130 including at least one chip mounter 131, 132, 133, An automated optical inspector 140, a variant mounter 150, a reflow oven 160, and a second vision inspector 170. The first vision checker 170 may include a first vision checker 170,

The surface mount technology (SMT) process involves printing solder paste on a printed circuit board (PCB) and mounting various surface mount devices (SMD) thereon using a mounter And then passing through a reflow oven to bond the leads of the surface mount components to the PCB. Thus, the SMT process is a technique for producing a PCB that is completed by the organic combination of a plurality of devices. And may include at least one SMT line 100 including a plurality of equipment depending on the working environment.

The loader 110 is a device for automatically feeding a PCB, and supplies the substrate using a medium called a magazine.

The printing tester 120 is a device for applying solder paste to a component mounting position on the surface of the PCB, which is loaded through the loader 110. [

The chip mounter 130 is a device for arranging and fixing various components and chips on a land portion on the PCB to which the solder paste is applied. According to the arrangement, at least one chip mounter 131, 132 , 133). Each of the chip mounters 131 or 132 or 133 is not shown in the drawing, but includes a feeder, a head part, a suction nozzle, and a camera. First, the component is sucked from the component supply section to the suction nozzle of the head section. Then, in order to accurately ascertain the suction state and the center position of the parts, the head part moves to the upper part of the camera and confirms the suction state and the center position of the parts through the camera. Once verification is complete, rotate the part to the correct angle to correct the mounting position and mount it on the PCB.

The first vision checker 140 compares the image of the chip mounter 130 mounted with the stored reference image to determine whether the chip mounter 130 has correctly mounted the component.

The deformable mounter 150 mounts on the PCB a special part that can not be mounted by the chip mounter 130 or a part that requires precise work.

The reflow oven 160 is a device that heats and melts the solder paste under the components mounted on the PCB, and fixes the components on the PCB through the curing process.

The second vision inspector 170 compares the cured PCB image with the stored reference image to determine whether the finished PCB is good or defective.

In the SMT line (100), a number of fine parts are used for PCB production. Various defects occur in mounting the parts on the feeder and mounting the parts of the feeder on the PCB using the head and nozzle of the chip mounter. It is necessary to suppress the occurrence of defects as much as possible due to the difficulty of defective repair and rework due to the miniaturization of parts, and it is easy to grasp the process information on components, feeders, heads, do. The various defects arising from each piece of equipment in the SMT line 100 will be referred to as process errors.

The monitoring unit 200 detects the occurrence of the first process error through comparison between the data collected from the devices included in the at least one SMT line 100 and predetermined management data, Accumulation data are compared with each other to detect occurrence of a second process error as a prediction process error with respect to the collected data, and a warning signal according to the occurrence of the first or second process error is generated and transmitted to the corresponding equipment in the SMT line. The monitoring unit 200 monitors the operation status information of the SMT line 100 according to the data collected from the devices included in the SMT line 100 and the process index information of the SMT line according to the predetermined period, And transmits the solution information to the user terminal 300 at the request of the user terminal 300.

The monitoring unit 200 may include a UI providing module 210, a collecting module 220, a processing module 230, a control module 240, and a storage module 250.

Here, each of the modules 210 to 250 included in the monitoring unit 200 can be easily installed and used anywhere there is an IT solution, that is, a software terminal for software installation, and informs a worker of a process problem in real time. Each of the modules 210 to 250 included in the monitoring unit 200 may be installed in any one of the terminals and each module may be installed in another terminal or two or more modules may be installed in another terminal, 100), the terminals can operate organically. In this manner, the monitoring unit 200 is composed of software and requires no additional hardware for monitoring the SMT line 100, in addition to the terminal for mounting the software.

Hereinafter, each module included in the monitoring unit 200 will be described in detail with reference to FIG.

The user interface (UI) providing module 210 includes a setting unit 211, a monitoring unit 212, a reporting unit 213, a defect management unit 214, and a process error processing unit 215.

The setting unit 211 sets facility information, model information, and part information of the SMT line 100 and stores them in the storage module 250. The setting unit 211 also sets a reference value including a lower limit value and an upper limit value for the management data for managing elements (for example, parts, heads, nozzles, etc.) affecting production and quality in the SMT line 100 And stores it in the storage module 250. Also, the setting unit 211 sets the process error level setting condition and stores it in the storage module 250. Here, the process error level setting condition includes a default level setting condition according to the occurrence of a process error and a level adjusted at a default level when the same process error occurs repeatedly for a predetermined period. Furthermore, the setting unit 211 may generate user information capable of accessing the information generated by the monitoring unit 200, and may store the generated user information in the storage module 250.

The monitoring unit 212 monitors the operation status of the SMT line 100 using the data stored in the storage module 250.

The reporting unit 213 processes the process index information of the SMT line 100 for a predetermined period by using the data stored in the storage module 250. FIG. 3 shows an example of processing process index information of the SMT line 100. Fig. 3A shows a process of processing the nozzles in order of many defects, for example. FIG. 3B shows the chip mounter 130 including at least one chip mounter 131, 132, and 133, for example, processed in order of many defects. FIG. 3C shows a graphical representation of the error states of the nozzles. In this way, the reporting unit 213 can process the data stored in the storage module 250 and generate various process index information.

The defect management unit 214 statistically analyzes the occurrence of defects using the data stored in the storage module 250 to provide a solution.

The process error processing unit 215 processes such that the occurrence of a process error can be confirmed.

Here, the UI providing module 210 may be installed in the user terminal 300. Accordingly, the user can set predetermined information and data, monitor the operation status of the SMT line 100, confirm the process index information of the desired SMT line 100, confirm the solution of the defect occurrence , And the occurrence of a process error can be confirmed. Further, the process error processing unit 215 may be installed in each of the devices of the SMT line 100. Therefore, each of the devices can output a process error level and a warning signal according to the occurrence of a process error through the process error processing unit 215.

The collection module 220 obtains the data collected from each piece of equipment in the SMT line 100. The collecting module 220 may include a data collecting unit 221 and a data normalizing unit 222.

The data collecting unit 221 collects data from each equipment of the SMT line 100. The data collected by the data collecting unit 221 includes, for example, position information for each of the head, the nozzle, and the feeder, the job file name, the PCB order, the number of parts picked up, the vision error, The total PCB production time of the SMT line 100, the processing time of each equipment, the working file change time, the total temperature / humidity of the SMT line 100, the temperature / humidity of each equipment, And may include various data generated in the line 100.

The data normalization unit 222 normalizes the data collected for each model. Here, the data normalization unit 222 may be included in the collection module 220 as a data normalization module or may be separately provided outside the collection module 220.

The processing module 230 processes the process error occurrence for the collected data, stores it in the storage module 250, and outputs it to the control module 240. The processing module 230 includes an input interface unit 231, a dump processing unit 232, a first processing unit 233, a second processing unit 234, a third processing unit 235, a memory 236, and an output interface 237 ).

The input interface unit 231 loads management data for managing elements affecting production and quality in the SMT line 100 from the storage module 250 and a reference value including a lower limit value and an upper limit value for the management data. Also, the input interface unit 231 receives the data collected from the collection module 220.

The dump processing unit 232 erases the data that is not included in the management data loaded in the input interface 231. Through the dump processing process, processing of unnecessary data is excluded so that data processing can be performed quickly.

The first processing unit 233 compares the collected data and the management data that have been subjected to the dumped processing and determines whether the first process error has occurred when the collected data is out of the reference value set in the management data. For example, when the collected data to be dumped is 11 in number of pick-up errors of the nozzle 10 and the reference value set in the management data therefor is 10, the first processing unit 233 generates a first process error.

The second processing unit 234 judges occurrence of an event when it is irregular data for which the collected data is not set. For example, at the time of replacing the feeder, new feeder information is collected. When the new feeder information is not included in the management data, the second processing unit 234 generates an event.

The third processing unit 235 compares the accumulated data collected by the dumped processing and the cumulative data stored in the memory 236 to determine whether or not a second process error has occurred as a predicted process error to be generated in the collected data. For example, when a first process error occurs at a specific time in the pick-up error data for the heads cumulatively stored in the memory 236 for an arbitrary first period, the third processing unit 235 performs, for the dumped collected data, A second process error occurs as a predicted process error that the first process error will occur at the specific time of the second cycle.

Here, under the condition that the first processing section 233 determines the occurrence of a process error in the collected data of one item, the third processing section 235 determines the occurrence of a process error in the collected data including two or more items . Also, the third processor 235 can determine the occurrence of a process error with the accumulated data.

For example, when the third processing unit 235 determines that a process error has occurred at an accumulated loss rate, the management data related to the loss rate (total error number (pickup error + vision error) / total pickup amount) It is assumed that the set reference value is set to a loss rate of less than 0.5% per printed circuit board and a cumulative loss rate is set to less than 0.2%. The first processing unit 233 calculates the loss rate per one printed circuit board and determines whether the loss rate is less than 0.5% and accumulates the result in the memory 236. The third processing unit 235 accumulates the result in the memory 236, If the loss rate is more than 0.2%, it is possible to judge occurrence of process error.

As another example, it is assumed that the third processing unit 235 determines the occurrence of a process error at the accumulated temperature. Assume that the reference value for the average temperature is set to less than 5 degrees Celsius for a certain period of time. The first processor 233 receives the result of the temperature check per unit time and accumulates the result in the memory 236 and the third processor 235 generates a process error when the average temperature accumulated in the memory 236 is equal to or higher than 5 degrees Celsius Can be determined.

Further, when the third processing unit 235 determines the occurrence of a process error in the collected data including two items (loss rate and temperature), the reference value set in the management data related to the loss rate is divided into two items , And the cumulative loss rate is set to less than 0.3% when the temperature is 5 degrees or higher. The first processing unit 233 calculates the loss rate per printed circuit board and accumulates the result in the memory 236. The first processing unit 233 receives the temperature check result per unit time and outputs the result to the memory 236. [ . The third processing unit 235 can determine occurrence of a process error when the accumulated loss rate is 0.3% or more when the temperature is 5 ° C or more, using the temperature and loss rate accumulated in the memory 236.

The memory 236 cumulatively stores data output from the first processing section 233, the second processing section 234, and the third processing section 235, and is reset every predetermined period.

The output interface unit 237 outputs the data output from the first processing unit 233, the second processing unit 234 and the third processing unit 235, that is, the first process error occurrence signal, the event occurrence signal, To the storage module 250, and transmits a first process error occurrence signal and a second process error occurrence signal to the control module 240.

The control module 240 controls the entire monitoring unit 200, sets a process error level for the first or second process error according to the process error level setting condition, generates a warning signal according to the process error level, To the equipment where the process error in the line 100 has occurred. The control module 240 may include an input interface unit 241, a control unit 242, a process error management unit 243, and an output interface 242.

The input interface unit 241 loads a condition for setting a default level according to the occurrence of a process error from the storage module 250 and a condition for setting a level of process error when the same process error occurs repeatedly for a predetermined period. Also, the input interface unit 431 receives the first process error occurrence signal and / or the second process error occurrence signal from the processing module 230.

The control unit 242 controls operations of the UI providing module 210, the collecting module 220 processing module 230, and the storage module 250.

The process error management unit 243 compares the process error level setting condition with the first or second process error, sets a process error level, and generates different warning signals according to the process error level. Here, the process error management unit 243 generates a warning signal to indicate the occurrence of a process error in a monitor of the SMT line 100 internal equipment where a process error has occurred, generates an alarm signal to output a warning sound, Or to generate an alarm signal to prevent the inflow of the printed circuit board into the SMT line, or to stop the operation of the SMT line. Also, at least two warning signals can be generated simultaneously according to the process error level.

For example, the process error management unit 243 may generate the first to third warning signals according to the set process error level. Where the first warning signal may include displaying that a process error has occurred in the monitor of the SMT line 100 internal equipment where a process error has occurred. The second warning signal may include outputting a warning light and / or an audible warning while displaying the first warning signal on the SMT line 100 internal equipment where a process error has occurred. The third warning signal may include outputting a first warning signal and a second warning signal to the SMT line 100 internal equipment in which a process error has occurred and blocking the entry of the printed circuit board into the SMT line 100 . Here, the process error management unit 243 may generate a third warning signal when the set process error level is the highest, and may generate the first warning signal when the set process error level is the lowest.

For example, if it is assumed that the process error management unit 243 generates the first to third warning signals and the process error level setting for the number of times the nozzle drops the part during the movement after the component is adsorbed, Is assumed to be set to "1 hour", the number of repetition of the process errors in the time condition is set to "3 times", and the adjustment level is set to "the third step process error level". At this time, when the default level and the same process error occur repeatedly for a predetermined period, the input interface unit 241 is already loaded with the level adjusted at the default level.

If the number of times that the nozzle drops parts is less than three, the process error management unit 243 does not generate a warning signal. However, if the number of times that the nozzle drops the parts for one hour, that is, the number of repetitions of the process error is three or more, the process is set to the third step process error level, which is the adjustment level, and the warning signal is generated.

The output interface unit 244 stores the warning signal in the storage module 250 and transmits the warning signal to the SMT line 100 internal equipment in which the process error has occurred.

Referring to FIG. 4, an example in which the chip mounter 133 of the SMT line in which a process error has occurred outputs the second warning signal in the above example. Referring to FIG. 4, a monitor of the chip mounter 132 displays that a process error has occurred in the nozzle 11 and outputs a beep.

The storage module 250 stores the information / data set by the UI providing module 210, the processing module 230, and the data generated by the control module 240, and is updated in real time.

The user terminal 300 displays the information generated by the monitoring unit 200 upon a request. The user terminal 300 may be a mobile terminal such as a laptop, a handheld device, a smart phone, a tap, a tablet PC, a desk top computer, or any other suitable device that utilizes or is directly or indirectly connected to such a device. Also, the user terminal 300 may install the UI providing module 210 of the monitoring unit 200.

5 is a flowchart illustrating an operation method of the SMT equipment abnormality monitoring and prediction system according to an embodiment of the present invention. The operation method of the SMT equipment abnormality monitoring and prediction system according to the present invention can be performed in the monitoring unit 200 with the help of peripheral components as shown in FIG. 1 and FIG. In the following description, the description of the parts overlapping with the description of FIG. 1 to FIG. 4 will be omitted.

5, the monitoring unit 200 sets SMT line 100 facility information, model information, and part information, and controls the SMT line 100 to transmit an element (for example, a part, Head, nozzles, and the like), and sets a process error level setting condition (S100). Here, the process error level setting condition may include a default level setting condition according to the occurrence of a process error and a level adjusted at a default level when the same process error occurs repeatedly for a predetermined period.

When the setting is completed, the monitoring unit 200 determines whether a first process error has occurred through comparison between the data collected from the devices included in the SMT line 100 and the management data, or collects the collected data and the pre- A step S200 of comparing the accumulated data and judging occurrence of a second process error as a predicted process error with respect to the collected data is performed. The monitoring unit 200 monitors the operation status of the SMT line 100 according to the data collected from the devices included in the SMT line 100 in addition to the first or second process errors, The index information and the solution information according to the occurrence of defects in the SMT line 100 can be generated.

If it is determined that the first or second process error has occurred, the monitoring unit 200 generates a warning signal according to the occurrence of the first or second process error and transmits the alert signal to the corresponding equipment in the SMT line 100 (step 300) . Here, the monitoring unit 200 compares the process error level setting condition with the first or second process error, sets the process error level, and generates different warning signals according to the process error level. The monitoring unit 200 generates a warning signal to indicate the occurrence of a process error in a monitor of the SMT line 100 internal equipment in which a process error has occurred, generates an alarm signal to output a warning sound, or generates an alarm signal to display a warning light Or to generate an alarm signal to prevent the inflow of the printed circuit board into the SMT line, or to stop the operation of the SMT line. At least two warning signals can be generated according to the process error level.

Thereafter, the information and data generated by the monitoring unit 200 are transmitted to the user terminal 300 at the request of the user (S400).

Meanwhile, the present invention can be embodied in computer readable code on a computer readable recording medium. A computer-readable recording medium includes all kinds of recording apparatuses in which data that can be read by a computer system is stored.

Examples of the computer-readable recording medium include a ROM, a RAM, a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device and the like, and also a carrier wave (for example, transmission via the Internet) . In addition, the computer-readable recording medium may be distributed over network-connected computer systems so that computer readable codes can be stored and executed in a distributed manner. In addition, functional programs, codes, and code segments for implementing the present invention can be easily deduced by programmers skilled in the art to which the present invention belongs.

The present invention has been described above with reference to preferred embodiments. It will be understood by those skilled in the art that the present invention may be embodied in various other forms without departing from the spirit or essential characteristics thereof. Therefore, the above-described embodiments should be considered in an illustrative rather than a restrictive sense. The scope of the present invention is indicated by the appended claims rather than by the foregoing description, and all differences within the scope of equivalents thereof should be construed as being included in the present invention.

100: SMT line 200: Monitoring section
210: UI providing module 220: collection module
230: processing module 240: control module
250: storage module 300: user terminal

Claims (20)

  1. At least one SMT line consisting of a plurality of equipment for printing solder paste on a printed circuit board and mounting and curing various surface mount components thereon;
    The first process error is determined through comparison between the data collected from the equipment included in the SMT line and predetermined management data, and the accumulated data and accumulated data of a predetermined period are compared with each other, And generates a warning signal according to the occurrence of the first or second process error and transmits the alert signal to the corresponding equipment in the SMT line, A monitoring unit for dumping the collected data and determining the first process error and the second process error; And
    And a user terminal for displaying information generated by the monitoring unit,
    The monitoring unit sets a process error level setting condition including a default level setting condition according to a process error occurrence and a level setting condition adjusted by default when the same process error occurs repeatedly for a predetermined period, Setting a process error level for the first process error or the second process error, generating different warning signals according to the process error level,
    Wherein the warning signal is indicative of a process error in the monitor, outputting at least one of a warning light and an audible alarm, inhibiting the entry of the printed circuit board into the SMT line, And stopping the SMT equipment abnormality monitoring and prediction system.
  2. The apparatus according to claim 1,
    Line status information of the SMT line according to data collected from the devices included in the SMT line, process index information of the SMT line according to a predetermined period, and solution information according to occurrence of a defect in the SMT line. Equipment fault monitoring and forecasting system.
  3. The apparatus according to claim 2,
    A UI providing module for setting the SMT line equipment information, model information, and part information, and setting the management data for managing elements affecting production and quality in the SMT line;
    A collection module for obtaining data collected from each device of the SMT line;
    Processing the occurrence of the first process error by comparing the collected data and the management data, comparing the collected data and accumulated data of a predetermined period of time, and processing the occurrence of the second process error for the collected data Processing module;
    Setting a process error level for the first or second process error according to the process error level setting condition, generating the warning signal according to the process error level, and transmitting the generated process signal to the equipment where the process error in the SMT line has occurred Control module; And
    And a storage module for storing the information and data set by the UI providing module and the data generated by the processing module and the control module.
  4. The system of claim 3, wherein the UI providing module comprises:
    A monitoring unit monitoring the operation status of the SMT line;
    A reporting unit for processing process index information of the SMT line for a predetermined period;
    A defect management unit for analyzing defects occurring in the SMT line to generate a solution; And
    Further comprising a process error processor for processing the first or second process error so as to confirm the occurrence of the first or second process error.
  5. ◈ Claim 5 is abandoned due to the registration fee.
    The method of claim 4, wherein the UI providing module comprises:
    Wherein the SMT equipment abnormality monitoring and prediction system is included in the user terminal.
  6. ◈ Claim 6 is abandoned due to the registration fee.
    5. The apparatus according to claim 4,
    Wherein the SMT equipment abnormality monitoring and prediction system is included in each equipment of the SMT line.
  7. ◈ Claim 7 is abandoned due to registration fee.
    4. The system of claim 3,
    Further comprising: a standardization module for standardizing the collected data.
  8. 4. The apparatus of claim 3,
    A first processing unit for comparing the collected data with the management data to determine occurrence of the first process error, and transmitting the first process error occurrence signal to the control module and the storage module;
    A second processor for determining occurrence of an event when the collected data is irregular data for which the collected data is not set, and for transmitting the event generation signal to the storage module; And
    Comparing the collected data and cumulative data of a predetermined period of time to determine whether the second process error has occurred in the collected data, and transmitting the second process error occurrence signal to the control module and the storage module, Wherein the SMT equipment abnormality monitoring and prediction system comprises:
  9. ◈ Claim 9 is abandoned upon payment of registration fee.
    9. The method of claim 8,
    And a dump processor for erasing the collected data not included in the management data.
  10. ◈ Claim 10 is abandoned due to the registration fee.
    9. The method of claim 8,
    Further comprising a memory for cumulatively storing data output from the first processing unit, the second processing unit, and the third processing unit, and resetting the data at predetermined intervals.
  11. delete
  12. delete
  13. delete
  14. ◈ Claim 14 is abandoned due to registration fee.
    An operation method of an SMT equipment abnormality monitoring and predicting system for monitoring at least one SMT line composed of a plurality of equipment for printing a solder paste on a printed circuit board and mounting and curing various surface mounting parts thereon,
    A first process error processing step of determining occurrence of a first process error by comparing data collected from equipment included in the SMT line and predetermined management data;
    A second process error processing step of comparing the collected data and cumulative data of a predetermined period of time to determine occurrence of a second process error as a prediction process error on the collected data;
    Setting a process error level setting condition including a default level setting condition according to the occurrence of a process error and a level setting condition adjusted by default when the same process error repeatedly occurs for a predetermined period;
    Setting a process error level for the first process error or the second process error according to the process error level setting condition; And
    And generating a different warning signal according to the occurrence of the first or second process error according to the process error level and transmitting the generated alert signal to the corresponding equipment in the SMT line,
    A first process error and a second process error are determined after a dump process of the collected data not included in the management data,
    Wherein the warning signal is indicative of a process error in the monitor, outputting at least one of a warning light and an audible alarm, inhibiting the entry of the printed circuit board into the SMT line, And stopping the SMT equipment abnormality monitoring and prediction system.
  15. ◈ Claim 15 is abandoned due to registration fee.
    15. The method of claim 14,
    Generating information on the operation status of the SMT line in accordance with data collected from the devices included in the SMT line, process index information on the SMT line according to a predetermined period, and solution information on the occurrence of a defect in the SMT line Wherein the SMT equipment abnormality monitoring and prediction system operates.
  16. ◈ Claim 16 is abandoned due to registration fee.
    16. The method of claim 15,
    And transmitting the alert signal and the information to a user terminal. ≪ Desc / Clms Page number 19 >
  17. ◈ Claim 17 is abandoned due to registration fee.
    15. The method of claim 14,
    Setting SMT line equipment information, model information, and part information, and setting the management data for managing factors affecting production and quality in the SMT line. Method of operation of monitoring and prediction system.
  18. delete
  19. delete
  20. delete
KR1020130145361A 2013-11-27 2013-11-27 System for diagnosiing and estimating facilities disorder of surface mount technology and thereof method KR101941936B1 (en)

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CN201410092513.XA CN104684270B (en) 2013-11-27 2014-03-13 For monitoring and predicting the system and its operating method of the failure of SMT equipment

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CN106079892B (en) * 2016-07-12 2019-01-25 重庆大学 A kind of PCB paste solder printing procedure quality intelligent monitor system and method
CN109709920A (en) * 2018-12-27 2019-05-03 Oppo(重庆)智能科技有限公司 Data processing method and Related product

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