KR101246582B1 - Monitoring method and system for reflow oven using virtual temperature profile of SMT system - Google Patents

Monitoring method and system for reflow oven using virtual temperature profile of SMT system Download PDF

Info

Publication number
KR101246582B1
KR101246582B1 KR1020100138457A KR20100138457A KR101246582B1 KR 101246582 B1 KR101246582 B1 KR 101246582B1 KR 1020100138457 A KR1020100138457 A KR 1020100138457A KR 20100138457 A KR20100138457 A KR 20100138457A KR 101246582 B1 KR101246582 B1 KR 101246582B1
Authority
KR
South Korea
Prior art keywords
temperature profile
conveyor
temperature
specimen
virtual
Prior art date
Application number
KR1020100138457A
Other languages
Korean (ko)
Other versions
KR20120076758A (en
Inventor
김만섭
Original Assignee
김만섭
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김만섭 filed Critical 김만섭
Priority to KR1020100138457A priority Critical patent/KR101246582B1/en
Publication of KR20120076758A publication Critical patent/KR20120076758A/en
Application granted granted Critical
Publication of KR101246582B1 publication Critical patent/KR101246582B1/en

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0417Feeding with belts or tapes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting
    • H05K13/0465Surface mounting by soldering

Abstract

According to the present invention, a plurality of temperature sensors are installed on a conveyor to generate a temperature profile, and a conveyor temperature profile to which an error correction value is applied by matching with a specimen temperature profile generated by inserting a profiler is stored as a virtual temperature profile, thereby producing a product. Conveyor temperature profile is generated every time the product is transported in the process and compared with the virtual temperature profile to determine whether the process conditions are satisfied for every product transported in the continuous production process of the product.

Description

Monitoring method and system for reflow oven using virtual temperature profile of SMT system}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a monitoring control method for controlling a reflow oven of a surface mount (SMT) system. In particular, a plurality of sensors are installed on a conveyor on which a printed circuit board is moved and passed through a reflow oven. By measuring the temperature of the printed circuit board during the temperature change information of the printed circuit board and the temperature change information installed on the conveyor to generate a virtual profile, and to check the virtual profile to control the reflow oven A virtual profile monitoring method of a reflow oven of a surface mount system.

In general, when a printed circuit board is supplied through a substrate feeder (loader), a surface mount (SMT) system uses a screen printer to apply a solder face to a pattern on which surface mount components are mounted, and then surface mount through a component feeder. When the component is supplied to the device, the component is mounted on the solder paste-coated pattern, and the printed circuit board on which the component is mounted is put into a reflow oven to melt and harden the solder paste.

In the surface mount system as described above, the reflow oven functions to supply a printed circuit board on which a component is mounted in a pattern to a conveyor in a surface mount apparatus, to heat the melted solder paste to firmly attach the component, and to harden the component.

As a method of monitoring the operation state of the reflow oven, the state of the reflow oven is monitored by applying a profiler at a predetermined time or every cycle.

1 is a schematic diagram of a reflow oven monitoring system generally using a profiler. As shown here, in the line for feeding the printed circuit board 4 supplied from the surface mounter 1 into the reblow oven 3 through the conveyor 2, the printed circuit board 4 on which the parts are mounted. The temperature sensor 11 is attached to the profiler 10 by attaching a temperature sensor 11 to a plurality of test points set and experimentally obtained. 2) It is put on and passed through the reflow oven (3). At this time, the temperatures of the check points detected by the profiler 10 are stored for each travel time, and a temperature profile is generated and stored. Here, the monitoring apparatus 20 analyzes a temperature profile by a program normally using a PC.

The temperature profile from the profiler 10 passing through the reflow oven 3 is input from the monitoring device 20 to monitor the reflow oven 3 through a temperature profile analysis of each check point. This monitoring is performed at regular intervals or at regular intervals to control the operating state of the reflow oven 3 in the product production process.

Therefore, there was no way to confirm the process quality level during continuous mass production by one-time process quality check.

Accordingly, the present invention provides a method and system for monitoring a virtual profile of a reflow oven of a surface mount system, which enables the operator to continuously monitor and check a temperature profile, which is checked by a worker or periodically, in real time using a conventional profiler. It is to provide.

Virtual temperature profile monitoring method of the reflow oven of the surface mount system for achieving the object of the present invention,

A method of monitoring a reflow oven temperature profile of a surface mount system in which a profiler is used to generate a temperature profile of a specimen and monitor whether it meets an acceptable process condition.

The conveyor is installed with a plurality of temperature sensors on the conveyor for conveying the specimen in the reflow oven, and the conveyor has the same sampling time as the sampling time used to generate the specimen temperature profile while the profiler is introduced to generate the specimen temperature profile. A conveyor temperature profile generation process for generating a conveyor temperature profile with respect to a temperature measured from temperature sensors installed around the ambient temperature;

Generating a reference conveyor temperature profile by matching the specimen temperature profile with the conveyor temperature profile and applying an error correction value to the process conditions allowed for the conveyor temperature profile;

A virtual temperature profile generation step of generating a conveyor temperature profile each time a printed circuit board on which parts are mounted is transferred to the reflow oven during a product manufacturing process;

And matching the reference conveyor temperature profile applying the error correction value to the virtual temperature profile to monitor whether the process conditions are satisfied.

The virtual temperature profile monitoring system of the reflow oven of the surface mount system for achieving the object of the present invention,

A plurality of temperature sensors installed around the periphery of the conveyor for transferring the product in the reflow oven;

By measuring the temperature from the plurality of temperature sensors to create a conveyor temperature profile, and compared with the specimen temperature profile detected by the profiler to generate and store a virtual temperature profile in accordance with the accepted process conditions, and in the product production process When the product is transferred through the conveyor, the temperature is detected from the plurality of temperature sensors to generate a conveyor temperature profile, characterized in that it comprises a monitoring device for monitoring whether the process conditions are met by comparison analysis with the virtual temperature profile Do.

The monitoring device,

A conveyor temperature detector detecting a temperature from the plurality of temperature sensors;

A conveyor temperature profile generator for generating a conveyor temperature profile with respect to the temperature detected by the conveyor temperature detector;

A specimen temperature profile generator for inputting the profiler to generate a temperature profile of the specimen;

A sampling time controller which controls the sampling timing of the conveyor temperature profile generator and the specimen temperature profile generator to the same sampling timing;

A temperature profile analyzer for comparing and analyzing whether the conveyor temperature profile satisfies a process condition;

In the temperature profile analyzer, the conveyor temperature profile generated in the profiler input mode is matched to the specimen temperature profile to compare and analyze whether it meets the acceptable process conditions, thereby generating an error correction value, and virtualizing the conveyor temperature profile to which the error correction value is applied. A virtual temperature profile storage unit for generating and storing a temperature profile;

A fixed condition table in which the temperature profile analyzer stores reference information on processing allowance conditions for each sampling timing and temperature sensor channel, which are standards of temperature profile analysis;

The virtual temperature profile is created in the profiler input mode, and the conveyor temperature profile is controlled every time the product is transported in the product production mode to determine whether or not the process conditions are met by the comparative analysis with the virtual temperature profile and output the system. A main controller which controls each operation of the whole;

And a keyboard for inputting an operator's operation command to the main control unit, a temperature profile for analysis, and a monitor for outputting process conditions and analysis results.

The present invention can monitor the temperature profile for every product to be transported in real time in a continuous product production process has the effect of improving the production yield of the product.

1 is a block diagram of a temperature monitoring system of a typical reflow oven.
2 is a block diagram of a temperature monitoring system of a reflow oven according to the present invention.
Figure 3 is a flow chart of the profiler input mode of the temperature monitoring method of the reflow oven according to the present invention.
4 is a flowchart of a product production mode of the temperature monitoring method of the reflow oven according to the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a configuration diagram of a virtual temperature profile monitoring system of a reflow oven of a surface mount system according to the present invention.

As shown therein,

In a reflow oven temperature profile monitoring system of a surface mount system in which a profiler 10 is used to generate a temperature profile of a specimen 4 to monitor whether it meets an acceptable process condition,

A plurality of temperature sensors 101 installed around the periphery of the conveyor 2 for transferring products in the reflow oven 3;

By measuring the temperature from the plurality of temperature sensors 101 generates a conveyor temperature profile, and compares with the specimen temperature profile detected by the profiler 10 to generate and store a virtual temperature profile in accordance with the accepted process conditions When the product is transferred through the conveyor in the product production process, the temperature is detected from the plurality of temperature sensors 101 to generate a conveyor temperature profile, and whether the process conditions are met by comparative analysis with the virtual temperature profile. It is characterized by consisting of a monitoring device 100 for monitoring.

The monitoring device 100,

A conveyor temperature detector (110) for detecting a temperature from the plurality of temperature sensors (101);

A conveyor temperature profile generator 120 generating a conveyor temperature profile with respect to the temperature detected by the conveyor temperature detector 110;

A specimen temperature profile generator 130 for inputting the profiler 10 to generate a temperature profile of the specimen 4;

A sampling time controller 140 for controlling the sampling timing of the conveyor temperature profile generator 120 and the specimen temperature profile generator 130 at the same sampling timing;

A temperature profile analyzer 150 for comparing and analyzing whether the conveyor temperature profile corresponds to process conditions;

In the temperature profile analyzer 150, the conveyor temperature profile generated in the profiler 10 input mode is matched to the specimen temperature profile to compare and analyze whether it meets the allowed process conditions, thereby generating an error correction value and an error correction value. A virtual temperature profile storage unit 160 for generating and storing the applied conveyor temperature profile as a virtual temperature profile;

A fixed condition table 180 which stores, by the temperature profile analyzer 150, reference information about process allowance conditions for each sampling timing and a temperature sensor channel, which are standards of temperature profile analysis;

The virtual temperature profile is created in the profiler input mode, and the conveyor temperature profile is controlled every time the product is transported in the product production mode to determine whether or not the process conditions are met by the comparative analysis with the virtual temperature profile and output the system. A main controller 170 for controlling each operation of the whole;

The main controller 170 includes a keyboard 190 for inputting an operator's operation command, a temperature profile for analysis, and a monitor 200 for outputting process conditions and analysis results.

Here, the profiler input mode refers to the conveyor temperature profile by inserting the profiler 10 into the conveyor 2 to measure the specimen temperature profile and simultaneously measuring the temperature from the temperature sensors 101 installed on the conveyor 2. Indicates the mode to create. In the product production mode, a virtual temperature profile is generated and stored in the profiler input mode, and then a product (printed circuit board on which parts are mounted) is reflowed through the conveyor 2 in an actual product production process. Indicates the mode to create the conveyor temperature profile in the process of transferring in the).

3 is a flowchart of a profiler input mode of a virtual temperature profile monitoring method of a reflow oven according to the present invention.

As shown therein,

Installing a plurality of temperature sensors 101 on the conveyor (2) for transporting the specimen (4) to the reflow oven (3), and the profiler (10) is introduced to generate a specimen temperature profile (S12) and At the same time, the process of generating a conveyor temperature profile for generating a conveyor temperature profile for the temperature measured from the temperature sensors 101 installed around the conveyor 2 at the same sampling time as the sampling time used to generate the specimen temperature profile (S11). )and;

A temperature profile comparison analysis step (S13) of matching the specimen temperature profile with the conveyor temperature profile to analyze whether the sampling timing of the conveyor temperature profile and the process conditions allowed for each temperature sensor are met;

An error correction value generating step (S14) of generating an error correction value of the conveyor temperature profile in the temperature profile comparison analysis step (S13);

A process of generating a virtual temperature profile to which the error correction value is applied is performed.

Thereafter, the virtual temperature profile is generated and stored as described above, and the process conditions are analyzed and compared by measuring the conveyor on-profile in the product production mode, which is the actual product production process.

4 is a flowchart of a temperature profile monitoring in a product production mode according to the present invention.

Whenever the product (printed circuit board on which the parts are mounted) is transferred through the conveyor 2 in the reflow oven 3, the temperature is measured by the temperature sensor 101 on the conveyor 2 to generate a conveyor temperature profile. Process (S21);

Comparing and analyzing the conveyor temperature profile with a previously stored virtual temperature profile (S23);

The process condition determination process (S24) is performed to determine whether or not the process conditions are met based on the comparison analysis result and to output an error message if the process conditions are not met.

A method of generating a specimen temperature profile using the profiler 10 and comparing and analyzing the specimen temperature file to meet process conditions is a well-known technique, and includes components to be mounted, samples such as solder paste, solder bumps, and the like. Test the temperature conditions and time conditions when passing through the reflow oven by the manufacturer and present them as standard process conditions.In accordance with these standard process conditions, each position (temperature sensor channel), time zone, passing time, etc. This program provides graphic information on the screen while comparing and analyzing the temperature profile. For example, compared with the reference information for the temperature / time (℃ / sec) for each specimen temperature sensor for the initial rise rate section, and the reference information for the temperature / time (℃ / sec) for each temperature sensor in the preheating section By comparison, various process conditions set for the detected temperature profile of the main heating section, cooling oil, and so forth.

Therefore, the present invention applies the monitoring method by such a temperature profile analysis.

In the present invention, a plurality of temperature sensors 101 are provided on the conveyor 2. The installation position of the temperature sensor 101 is obtained experimentally, which is to match the specimen temperature profile and the conveyor temperature profile to match the temperature change trend of each position of the product in the most efficient position or most efficiently. Set up the temperature sensor and install the temperature sensor. That is, the interval between the temperature sensor, the number of temperature sensors and the position of the temperature sensor are experimentally obtained and installed.

The conveyor temperature detector 110 detects the temperature from the temperature sensor 101 on the conveyor 2 provided in this way.

First, in order to generate a virtual temperature profile, the specimen temperature profile generator 130 generates the specimen temperature profile while feeding the profiler 10 and transferring it once. At this time, the conveyor temperature profile generator 120 generates the conveyor temperature profile with the same sampling time as the sampling time used when generating the specimen temperature profile. The sampling time controller 140 may match the temperature profile by controlling the timing of starting the temperature measurement and the temperature measurement time interval in order to generate the temperature profile.

This creates a specimen temperature profile while simultaneously creating a conveyor temperature profile and matching the two temperature profiles together. The matching method is matched with each other so as to be analyzed as information for comparing process conditions such as temperature sensor channels and time zones. This is to match the value of the conveyor temperature profile with respect to the comparison point at which the specimen temperature profile compares the process conditions stored in the process conditions table 180. For example, when the first temperature sensor of the specimen temperature profile satisfies the conditions of 30 to 60 seconds at a temperature of 130 ° C. to 150 ° C. during the initial preheating time, the corresponding conveyor temperature sensor may be a conveyor first temperature sensor, 200 If a condition of 30 to 60 seconds is detected at a temperature of ℃ ~ 250 ℃, since the temperature profile information of the corresponding conveyor first temperature sensor corresponds to the first temperature sensor of the specimen profile, it is for comparing the process conditions at this time.

Accordingly, the specimen temperature profile and the conveyor temperature profile are matched with each other to generate an error correction value for the process condition for each comparative analysis point, and apply the same to generate a virtual temperature profile.

After storing the virtual temperature profile in the virtual temperature profile storage unit 160, a conveyor temperature profile is generated every time the product is transported in the product production mode as shown in FIG. 4, and the generated conveyor temperature profile and the pre-stored virtual temperature profile are stored. Comparative analysis is to determine whether the process conditions are satisfied.

1: surface mounter 2: conveyor
3: reflow oven 4: specimen
10: profiler 100: monitoring device
101: conveyor temperature sensor 110: conveyor temperature detector
120: conveyor temperature profile generator 130: specimen temperature profile generator
140: sampling time control unit 150: temperature profile analysis unit
160: virtual temperature profile storage unit 170: main control unit
180: process conditions table 190: keyboard
200: monitor

Claims (4)

  1. A method of monitoring a reflow oven temperature profile of a surface mount system in which a profiler is used to generate a temperature profile of a specimen and monitor whether it meets an acceptable process condition.
    Install a plurality of temperature sensors around the conveyor for product transfer in the reflow oven, and at the same sampling time as the sampling time used to create the specimen temperature profile while the profiler is turned on to create the specimen temperature profile. A conveyor temperature profile generation process for generating a conveyor temperature profile with respect to a temperature measured from temperature sensors installed around the conveyor;
    Generating a reference conveyor temperature profile by matching the specimen temperature profile with the conveyor temperature profile and applying an error correction value to the process conditions allowed for the conveyor temperature profile;
    A virtual temperature profile generation step of generating a conveyor temperature profile each time a printed circuit board on which parts are mounted is transferred to the reflow oven during a product manufacturing process;
    And matching a reference conveyor temperature profile to which the error correction value is applied to the virtual temperature profile to monitor whether the process conditions are satisfied.
  2. In a reflow oven temperature profile monitoring system of a surface mount system in which a profiler 10 is used to generate a temperature profile of a specimen 4 to monitor whether it meets an acceptable process condition,
    A plurality of temperature sensors 101 installed around the conveyor 2 for transferring products in the reflow oven 3;
    By measuring the temperature from the plurality of temperature sensors 101 generates a conveyor temperature profile, and compares with the specimen temperature profile detected by the profiler 10 to generate and store a virtual temperature profile in accordance with the accepted process conditions When the product is transferred through the conveyor in the product production process, the temperature is detected from the plurality of temperature sensors 101 to generate a conveyor temperature profile, and whether the process conditions are met by comparative analysis with the virtual temperature profile. Virtual temperature profile monitoring system of the reflow oven of the surface-mounting system, characterized in that consisting of a monitoring device for monitoring (100).
  3. The method of claim 2, wherein the monitoring device 100,
    A conveyor temperature detector (110) for detecting a temperature from the plurality of temperature sensors (101);
    A conveyor temperature profile generator 120 generating a conveyor temperature profile with respect to the temperature detected by the conveyor temperature detector 110;
    A specimen temperature profile generator 130 for inputting the profiler 10 to generate a temperature profile of the specimen 4;
    A sampling time controller 140 for controlling the sampling timing of the conveyor temperature profile generator 120 and the specimen temperature profile generator 130 at the same sampling timing;
    A temperature profile analyzer 150 for comparing and analyzing whether the conveyor temperature profile corresponds to process conditions;
    In the temperature profile analyzer 150, the conveyor temperature profile generated in the profiler 10 input mode is matched to the specimen temperature profile to compare and analyze whether it meets the allowed process conditions, thereby generating an error correction value and an error correction value. A virtual temperature profile storage unit 160 for generating and storing the applied conveyor temperature profile as a virtual temperature profile;
    A fixed condition table 180 which stores, by the temperature profile analyzer 150, reference information about process allowance conditions for each sampling timing and a temperature sensor channel, which are standards of temperature profile analysis;
    The virtual temperature profile is created in the profiler input mode, and the conveyor temperature profile is controlled every time the product is transported in the product production mode to determine whether or not the process conditions are met by the comparative analysis with the virtual temperature profile and output the system. A main controller 170 for controlling each operation of the whole;
    Surface mounting system comprising a keyboard 190 for inputting the operator's operation command to the main control unit 170 and a monitor 200 for outputting the process conditions and analysis results and the temperature profile for the analysis Virtual temperature profile monitoring system of reflow oven.
  4. In the reflow oven temperature profile monitoring method of the surface mount system,
    Installing a plurality of temperature sensors 101 on the conveyor (2) for transporting the specimen (4) to the reflow oven (3), and the profiler (10) is introduced to generate a specimen temperature profile (S12) and At the same time, the process of generating a conveyor temperature profile for generating a conveyor temperature profile for the temperature measured from the temperature sensors 101 installed around the conveyor 2 at the same sampling time as the sampling time used to generate the specimen temperature profile (S11). )and;
    A temperature profile comparison analysis step (S13) of matching the specimen temperature profile with the conveyor temperature profile to analyze whether the sampling timing of the conveyor temperature profile and the process conditions allowed for each temperature sensor are met;
    An error correction value generating step (S14) of generating an error correction value of the conveyor temperature profile in the temperature profile comparison analysis step (S13);
    Generating a virtual temperature profile to which the error correction value is applied (S15);
    Generating a conveyor temperature profile by measuring a temperature through the temperature sensor 101 on the conveyor 2 each time the product is transferred to the reflow oven 3 through the conveyor 2;
    Comparing and analyzing the conveyor temperature profile with a previously stored virtual temperature profile (S23);
    The reflow oven of the surface mount system, characterized in that the process conditions determination process (S24) to determine whether or not meet the process conditions based on the comparative analysis results and outputs an error message if the process conditions are not met. How to monitor a virtual temperature profile.
KR1020100138457A 2010-12-30 2010-12-30 Monitoring method and system for reflow oven using virtual temperature profile of SMT system KR101246582B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100138457A KR101246582B1 (en) 2010-12-30 2010-12-30 Monitoring method and system for reflow oven using virtual temperature profile of SMT system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100138457A KR101246582B1 (en) 2010-12-30 2010-12-30 Monitoring method and system for reflow oven using virtual temperature profile of SMT system

Publications (2)

Publication Number Publication Date
KR20120076758A KR20120076758A (en) 2012-07-10
KR101246582B1 true KR101246582B1 (en) 2013-03-25

Family

ID=46710337

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100138457A KR101246582B1 (en) 2010-12-30 2010-12-30 Monitoring method and system for reflow oven using virtual temperature profile of SMT system

Country Status (1)

Country Link
KR (1) KR101246582B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101941936B1 (en) * 2013-11-27 2019-01-24 한화에어로스페이스 주식회사 System for diagnosiing and estimating facilities disorder of surface mount technology and thereof method
KR101883483B1 (en) * 2013-11-27 2018-07-31 한화에어로스페이스 주식회사 System for diagnosiing and estimating facilities disorder of surface mount technology and thereof method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621643A (en) * 1992-07-01 1994-01-28 Matsushita Electric Works Ltd Reflow furnace
JP2002045961A (en) 2000-08-04 2002-02-12 Denso Corp Heating evaluating method for heating furnace, and method for estimating temperature of body to be heated using the method
JP2002248561A (en) 2001-02-26 2002-09-03 Mitsubishi Electric Corp Profile measuring device for temperature in reflow furnace and diagnosis method for heating capability of reflow furnace using it
JP2006013418A (en) 2004-05-25 2006-01-12 Sony Corp Reflow temperature control method and reflow temperature control device, reflow temperature control program and computer-readable recording medium recorded with the program

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621643A (en) * 1992-07-01 1994-01-28 Matsushita Electric Works Ltd Reflow furnace
JP2002045961A (en) 2000-08-04 2002-02-12 Denso Corp Heating evaluating method for heating furnace, and method for estimating temperature of body to be heated using the method
JP2002248561A (en) 2001-02-26 2002-09-03 Mitsubishi Electric Corp Profile measuring device for temperature in reflow furnace and diagnosis method for heating capability of reflow furnace using it
JP2006013418A (en) 2004-05-25 2006-01-12 Sony Corp Reflow temperature control method and reflow temperature control device, reflow temperature control program and computer-readable recording medium recorded with the program

Also Published As

Publication number Publication date
KR20120076758A (en) 2012-07-10

Similar Documents

Publication Publication Date Title
CN1066608C (en) Device recognizing method and apparatus for surface mounting device mounter
US6799712B1 (en) Conveyor oven profiling system
AU2017201941A1 (en) Method in manual welding
EP2688180B1 (en) Control device, control method, program, and recording medium
EP2211601B1 (en) Information display system and information display method for quality control of component-mounted substrate
EP2964449B1 (en) Method and device for evaluating the quality of a component produced by means of an additive laser sintering and/or laser melting method
CN1198498C (en) Element mounting system and mounting method
US20160343122A1 (en) Method and device for sealant coating inspection
DE102009007520A1 (en) Power supply for welding with neural network controls
AU2012245484B2 (en) Apparatus and method for cure monitoring and process control in glass fiber forming operation
KR20080068645A (en) Viscous material dispensing systems with parameter monitoring and methods of operating such systems
US20050033464A1 (en) Real time closed-loop process control system for defect prevention
US20110218754A1 (en) Method for supporting analytical work of solder printing state and solder printing inspection machine
WO2009111156A3 (en) Advanced process sensing and control using near infrared spectral reflectometry
JP6264072B2 (en) Quality control device and control method thereof
KR20080037652A (en) Method for monitoring and/or controlling the melt filling of at least one cavity
JP3562450B2 (en) Electronic component mounting apparatus and electronic component mounting method
US6275750B1 (en) Apparatus for setting heating condition in heating furnace and thermal analyzer for object to be heated in heating furnace
EP1874107B1 (en) Method, device and program for setting a reference value for substrate inspection
US5971249A (en) Method and apparatus for controlling a time/temperature profile inside of a reflow oven
JP4389195B2 (en) Thermal spray system and thermal spray method
JP3656542B2 (en) Electronic component mounting system and electronic component mounting method
US20150051728A1 (en) Detecting method of abnormality of machine tool operation
US9453872B2 (en) Apparatus and method for power cycle test
JP2008537637A (en) Temperature detection and prediction in IC sockets

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee