CN104684270A - 用于监视和预测smt设备的故障的系统及其操作方法 - Google Patents
用于监视和预测smt设备的故障的系统及其操作方法 Download PDFInfo
- Publication number
- CN104684270A CN104684270A CN201410092513.XA CN201410092513A CN104684270A CN 104684270 A CN104684270 A CN 104684270A CN 201410092513 A CN201410092513 A CN 201410092513A CN 104684270 A CN104684270 A CN 104684270A
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- process error
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- smt production
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- 238000000034 method Methods 0.000 title claims abstract description 260
- 238000012544 monitoring process Methods 0.000 title claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims abstract description 133
- 230000008569 process Effects 0.000 claims description 218
- 238000012545 processing Methods 0.000 claims description 69
- 238000007726 management method Methods 0.000 claims description 31
- 230000007547 defect Effects 0.000 claims description 20
- 230000001186 cumulative effect Effects 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 10
- 238000005516 engineering process Methods 0.000 claims description 8
- 241001269238 Data Species 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 5
- 230000001788 irregular Effects 0.000 claims description 3
- 230000009471 action Effects 0.000 description 7
- 238000009825 accumulation Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 238000010606 normalization Methods 0.000 description 4
- 238000013480 data collection Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 238000004422 calculation algorithm Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000013036 cure process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B21/00—Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
-
- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B21/00—Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
- G08B21/18—Status alarms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130145361A KR101941936B1 (ko) | 2013-11-27 | 2013-11-27 | Smt 설비 이상 감시 및 예측 시스템 및 그의 동작 방법 |
KR10-2013-0145361 | 2013-11-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104684270A true CN104684270A (zh) | 2015-06-03 |
CN104684270B CN104684270B (zh) | 2019-05-10 |
Family
ID=53318674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410092513.XA Active CN104684270B (zh) | 2013-11-27 | 2014-03-13 | 用于监视和预测smt设备的故障的系统及其操作方法 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101941936B1 (zh) |
CN (1) | CN104684270B (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105346244A (zh) * | 2015-12-11 | 2016-02-24 | 江阴鑫辉太阳能有限公司 | 一种太阳能电池板的丝网印刷在线监控系统 |
CN106079892A (zh) * | 2016-07-12 | 2016-11-09 | 重庆大学 | 一种pcb锡膏印刷过程质量智能监控系统及方法 |
CN107889445A (zh) * | 2016-09-30 | 2018-04-06 | 松下知识产权经营株式会社 | 部件安装生产线控制系统 |
CN108780310A (zh) * | 2016-03-16 | 2018-11-09 | 株式会社石田 | 装置管理系统 |
CN109343493A (zh) * | 2018-11-09 | 2019-02-15 | 伟创力电子技术(苏州)有限公司 | 基于焊膏检测设备的控制系统 |
CN109709920A (zh) * | 2018-12-27 | 2019-05-03 | Oppo(重庆)智能科技有限公司 | 数据处理方法及相关产品 |
CN110600112A (zh) * | 2019-08-12 | 2019-12-20 | 东软医疗系统股份有限公司 | 一种用于发现零部件质量问题的方法、装置及设备 |
US20220104410A1 (en) * | 2020-09-28 | 2022-03-31 | Chunquan LI | Smt process prediction tool for intelligent decision making on pcb quality |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102524763B1 (ko) * | 2016-01-25 | 2023-04-21 | 한화정밀기계 주식회사 | Smt 공정 라인 에러 알림 장치 |
US11553632B2 (en) * | 2017-08-08 | 2023-01-10 | Fuji Corporation | Production system and production system control method |
CN108037739A (zh) * | 2017-11-09 | 2018-05-15 | 广州兴森快捷电路科技有限公司 | Pcb产品的过程管控方法和系统 |
KR102622144B1 (ko) * | 2021-09-06 | 2024-01-05 | 주식회사 한화 | 반도체 증착 시스템 및 이의 동작 방법 |
KR102620421B1 (ko) * | 2022-02-16 | 2024-01-25 | 주식회사 인큐에스엠티 | 생산 모델 변경에 적응적으로 대응하는 smt 시스템 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1096587A (zh) * | 1993-06-07 | 1994-12-21 | 先得利科技发展有限公司 | 测试装置 |
US5607097A (en) * | 1993-06-17 | 1997-03-04 | Matsushita Electric Industrial Co., Ltd. | Component-mounted circuit board production system |
JP2011187797A (ja) * | 2010-03-10 | 2011-09-22 | Fuji Mach Mfg Co Ltd | 部品実装機の部品実装方法 |
KR20120076758A (ko) * | 2010-12-30 | 2012-07-10 | 김만섭 | 표면 실장 시스템의 리플로우 오븐의 가상 프로파일 모니터링 방법 및 시스템 |
CN103313590A (zh) * | 2013-06-25 | 2013-09-18 | 无锡商业职业技术学院 | 一种smt生产线 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003110288A (ja) * | 2001-07-23 | 2003-04-11 | Fuji Mach Mfg Co Ltd | 対回路基板作業システムおよび電子回路製造方法 |
KR20030046607A (ko) | 2001-12-06 | 2003-06-18 | 삼성전자주식회사 | 반도체 제조 공정에 사용되는 경보 장치 |
JP5098227B2 (ja) * | 2006-06-15 | 2012-12-12 | オムロン株式会社 | 要因推定装置、要因推定プログラム、要因推定プログラムを記録した記録媒体、および要因推定方法 |
-
2013
- 2013-11-27 KR KR1020130145361A patent/KR101941936B1/ko active IP Right Grant
-
2014
- 2014-03-13 CN CN201410092513.XA patent/CN104684270B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1096587A (zh) * | 1993-06-07 | 1994-12-21 | 先得利科技发展有限公司 | 测试装置 |
US5607097A (en) * | 1993-06-17 | 1997-03-04 | Matsushita Electric Industrial Co., Ltd. | Component-mounted circuit board production system |
JP2011187797A (ja) * | 2010-03-10 | 2011-09-22 | Fuji Mach Mfg Co Ltd | 部品実装機の部品実装方法 |
KR20120076758A (ko) * | 2010-12-30 | 2012-07-10 | 김만섭 | 표면 실장 시스템의 리플로우 오븐의 가상 프로파일 모니터링 방법 및 시스템 |
CN103313590A (zh) * | 2013-06-25 | 2013-09-18 | 无锡商业职业技术学院 | 一种smt生产线 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105346244A (zh) * | 2015-12-11 | 2016-02-24 | 江阴鑫辉太阳能有限公司 | 一种太阳能电池板的丝网印刷在线监控系统 |
CN108780310A (zh) * | 2016-03-16 | 2018-11-09 | 株式会社石田 | 装置管理系统 |
CN106079892A (zh) * | 2016-07-12 | 2016-11-09 | 重庆大学 | 一种pcb锡膏印刷过程质量智能监控系统及方法 |
CN106079892B (zh) * | 2016-07-12 | 2019-01-25 | 重庆大学 | 一种pcb锡膏印刷过程质量智能监控系统及方法 |
CN107889445A (zh) * | 2016-09-30 | 2018-04-06 | 松下知识产权经营株式会社 | 部件安装生产线控制系统 |
CN107889445B (zh) * | 2016-09-30 | 2021-05-07 | 松下知识产权经营株式会社 | 部件安装生产线控制系统 |
CN109343493A (zh) * | 2018-11-09 | 2019-02-15 | 伟创力电子技术(苏州)有限公司 | 基于焊膏检测设备的控制系统 |
CN109709920A (zh) * | 2018-12-27 | 2019-05-03 | Oppo(重庆)智能科技有限公司 | 数据处理方法及相关产品 |
CN110600112A (zh) * | 2019-08-12 | 2019-12-20 | 东软医疗系统股份有限公司 | 一种用于发现零部件质量问题的方法、装置及设备 |
US20220104410A1 (en) * | 2020-09-28 | 2022-03-31 | Chunquan LI | Smt process prediction tool for intelligent decision making on pcb quality |
US11825606B2 (en) * | 2020-09-28 | 2023-11-21 | Chengdu Aeronautic Polytechnic | SMT process prediction tool for intelligent decision making on PCB quality |
Also Published As
Publication number | Publication date |
---|---|
KR101941936B1 (ko) | 2019-01-24 |
KR20150061351A (ko) | 2015-06-04 |
CN104684270B (zh) | 2019-05-10 |
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Address after: Gyeongnam Changwon City, South Korea Applicant after: HANWHA TECHWIN Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Applicant before: Samsung Techwin Co.,Ltd. |
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Address after: Gyeongnam Changwon City, South Korea Applicant after: HANWHA AEROSPACE Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Applicant before: HANWHA TECHWIN Co.,Ltd. |
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Effective date of registration: 20190412 Address after: Gyeongnam Changwon City, South Korea Applicant after: HANWHA TECHWIN Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Applicant before: HANWHA AEROSPACE Co.,Ltd. |
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