KR101937717B1 - 지지체, 지지체 제조 방법, 배선 기판 제조 방법, 전자 부품 제조 방법, 및 배선 구조체 - Google Patents

지지체, 지지체 제조 방법, 배선 기판 제조 방법, 전자 부품 제조 방법, 및 배선 구조체 Download PDF

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Publication number
KR101937717B1
KR101937717B1 KR1020130084571A KR20130084571A KR101937717B1 KR 101937717 B1 KR101937717 B1 KR 101937717B1 KR 1020130084571 A KR1020130084571 A KR 1020130084571A KR 20130084571 A KR20130084571 A KR 20130084571A KR 101937717 B1 KR101937717 B1 KR 101937717B1
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South Korea
Prior art keywords
layer
support substrate
metal foil
wiring
adhesion
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Expired - Fee Related
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KR1020130084571A
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English (en)
Korean (ko)
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KR20140011963A (ko
Inventor
가즈히로 고바야시
Original Assignee
신꼬오덴기 고교 가부시키가이샤
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Publication of KR20140011963A publication Critical patent/KR20140011963A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020130084571A 2012-07-20 2013-07-18 지지체, 지지체 제조 방법, 배선 기판 제조 방법, 전자 부품 제조 방법, 및 배선 구조체 Expired - Fee Related KR101937717B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-162005 2012-07-20
JP2012162005A JP6054080B2 (ja) 2012-07-20 2012-07-20 支持体及びその製造方法、配線基板の製造方法、電子部品装置の製造方法、配線構造体

Publications (2)

Publication Number Publication Date
KR20140011963A KR20140011963A (ko) 2014-01-29
KR101937717B1 true KR101937717B1 (ko) 2019-01-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130084571A Expired - Fee Related KR101937717B1 (ko) 2012-07-20 2013-07-18 지지체, 지지체 제조 방법, 배선 기판 제조 방법, 전자 부품 제조 방법, 및 배선 구조체

Country Status (4)

Country Link
US (2) US9215812B2 (enExample)
JP (1) JP6054080B2 (enExample)
KR (1) KR101937717B1 (enExample)
TW (1) TWI592062B (enExample)

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CN105451471B (zh) * 2014-06-19 2018-03-27 健鼎（无锡）电子有限公司 多层电路板的制作方法
US10344567B2 (en) * 2014-06-23 2019-07-09 Rockwell Automation Asia Pacific Business Center Pte. Ltd. Systems and methods for cloud-based automatic configuration of remote terminal units
US20160073505A1 (en) * 2014-09-05 2016-03-10 Unimicron Technology Corp. Manufacturing method of multilayer flexible circuit structure
US10249561B2 (en) * 2016-04-28 2019-04-02 Ibiden Co., Ltd. Printed wiring board having embedded pads and method for manufacturing the same
CN109417055A (zh) * 2016-07-01 2019-03-01 三菱瓦斯化学株式会社 半导体元件搭载用封装体基板的制造方法和半导体元件安装基板的制造方法
CN106211638B (zh) * 2016-07-26 2018-07-24 上海美维科技有限公司 一种超薄多层印制电路板的加工方法
KR102396894B1 (ko) * 2016-08-05 2022-05-11 미츠비시 가스 가가쿠 가부시키가이샤 지지 기판, 지지 기판이 부착된 적층체 및 반도체 소자 탑재용 패키지 기판의 제조 방법
CN109788665B (zh) * 2017-11-14 2020-07-31 何崇文 含电子元件的线路基板及其制作方法
CN113243146B (zh) 2018-12-14 2024-11-19 三菱瓦斯化学株式会社 半导体元件搭载用封装基板的制造方法
US10624213B1 (en) * 2018-12-20 2020-04-14 Intel Corporation Asymmetric electronic substrate and method of manufacture
JP7521258B2 (ja) * 2020-05-26 2024-07-24 Ｔｏｐｐａｎホールディングス株式会社 基板ユニット、基板ユニットの製造方法及び半導体装置の製造方法
TW202211748A (zh) * 2020-09-11 2022-03-16 巨擘科技股份有限公司 能被精確剝除之多層基板結構及其製造方法
US11178774B1 (en) * 2021-03-23 2021-11-16 Chung W. Ho Method for manufacturing circuit board
JP2023069390A (ja) * 2021-11-05 2023-05-18 イビデン株式会社 配線基板

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JP2001127119A (ja) 1999-10-27 2001-05-11 Toray Ind Inc ファインパターン形成用フレキシブルテープおよびその製造方法
JP2005244124A (ja) 2004-02-27 2005-09-08 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2007158174A (ja) 2005-12-07 2007-06-21 Shinko Electric Ind Co Ltd 配線基板の製造方法及び電子部品実装構造体の製造方法
JP2008218450A (ja) 2007-02-28 2008-09-18 Shinko Electric Ind Co Ltd 配線基板の製造方法及び電子部品装置の製造方法
JP2010251690A (ja) 2009-04-14 2010-11-04 Samsung Electro-Mechanics Co Ltd 基板製造用キャリア部材及びこれを用いた基板製造方法

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KR100333627B1 (ko) * 2000-04-11 2002-04-22 구자홍 다층 인쇄회로기판 및 그 제조방법
US7001662B2 (en) * 2003-03-28 2006-02-21 Matsushita Electric Industrial Co., Ltd. Transfer sheet and wiring board using the same, and method of manufacturing the same
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JP4541763B2 (ja) * 2004-01-19 2010-09-08 新光電気工業株式会社 回路基板の製造方法
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JP5410660B2 (ja) 2007-07-27 2014-02-05 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置及びその製造方法
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JP2001127119A (ja) 1999-10-27 2001-05-11 Toray Ind Inc ファインパターン形成用フレキシブルテープおよびその製造方法
JP2005244124A (ja) 2004-02-27 2005-09-08 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2007158174A (ja) 2005-12-07 2007-06-21 Shinko Electric Ind Co Ltd 配線基板の製造方法及び電子部品実装構造体の製造方法
JP2008218450A (ja) 2007-02-28 2008-09-18 Shinko Electric Ind Co Ltd 配線基板の製造方法及び電子部品装置の製造方法
JP2010251690A (ja) 2009-04-14 2010-11-04 Samsung Electro-Mechanics Co Ltd 基板製造用キャリア部材及びこれを用いた基板製造方法

Also Published As

Publication number Publication date
JP2014022665A (ja) 2014-02-03
US9763332B2 (en) 2017-09-12
US20140020931A1 (en) 2014-01-23
TWI592062B (zh) 2017-07-11
KR20140011963A (ko) 2014-01-29
US9215812B2 (en) 2015-12-15
US20160066433A1 (en) 2016-03-03
JP6054080B2 (ja) 2016-12-27
TW201412201A (zh) 2014-03-16

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