KR101925813B1 - 착색 조성물, 막, 컬러 필터, 패턴 형성 방법, 컬러 필터의 제조 방법, 고체 촬상 소자 및 적외선 센서 - Google Patents
착색 조성물, 막, 컬러 필터, 패턴 형성 방법, 컬러 필터의 제조 방법, 고체 촬상 소자 및 적외선 센서 Download PDFInfo
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- KR101925813B1 KR101925813B1 KR1020167032230A KR20167032230A KR101925813B1 KR 101925813 B1 KR101925813 B1 KR 101925813B1 KR 1020167032230 A KR1020167032230 A KR 1020167032230A KR 20167032230 A KR20167032230 A KR 20167032230A KR 101925813 B1 KR101925813 B1 KR 101925813B1
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- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
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- QGVNJRROSLYGKF-UHFFFAOYSA-N thiobarbital Chemical class CCC1(CC)C(=O)NC(=S)NC1=O QGVNJRROSLYGKF-UHFFFAOYSA-N 0.000 description 1
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- 229950003937 tolonium Drugs 0.000 description 1
- HNONEKILPDHFOL-UHFFFAOYSA-M tolonium chloride Chemical compound [Cl-].C1=C(C)C(N)=CC2=[S+]C3=CC(N(C)C)=CC=C3N=C21 HNONEKILPDHFOL-UHFFFAOYSA-M 0.000 description 1
- DWWMSEANWMWMCB-UHFFFAOYSA-N tribromomethylsulfonylbenzene Chemical compound BrC(Br)(Br)S(=O)(=O)C1=CC=CC=C1 DWWMSEANWMWMCB-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
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Images
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- G02B5/20—Filters
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
- G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials For Photolithography (AREA)
- Optical Filters (AREA)
- Polymerisation Methods In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Solid State Image Pick-Up Elements (AREA)
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JPJP-P-2014-109205 | 2014-05-27 | ||
JP2014109205 | 2014-05-27 | ||
PCT/JP2015/061804 WO2015182277A1 (ja) | 2014-05-27 | 2015-04-17 | 着色組成物、膜、カラーフィルタ、パターン形成方法、カラーフィルタの製造方法、固体撮像素子および赤外線センサ |
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KR20160146873A KR20160146873A (ko) | 2016-12-21 |
KR101925813B1 true KR101925813B1 (ko) | 2018-12-06 |
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JP (1) | JP6325097B2 (zh) |
KR (1) | KR101925813B1 (zh) |
TW (1) | TWI660238B (zh) |
WO (1) | WO2015182277A1 (zh) |
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JP6777996B2 (ja) * | 2016-02-10 | 2020-10-28 | 東洋インキScホールディングス株式会社 | 固体撮像素子向け赤外線透過フィルタ用感光性着色組成物、固体撮像素子向けカラーフィルタ、及び固体撮像素子 |
WO2018043218A1 (ja) * | 2016-08-30 | 2018-03-08 | 富士フイルム株式会社 | 感光性組成物、硬化膜、光学フィルタ、積層体、パターン形成方法、固体撮像素子、画像表示装置および赤外線センサ |
JP7167429B2 (ja) * | 2017-01-16 | 2022-11-09 | 東洋インキScホールディングス株式会社 | 感光性着色組成物、カラーフィルタ用感光性着色組成物、およびカラーフィルタ |
TW201827507A (zh) * | 2017-01-25 | 2018-08-01 | 日商富士軟片股份有限公司 | 硬化性組成物、化合物、硬化膜、硬化膜之製造方法、濾色器之製造方法、固態攝影元件及紅外線感測器 |
TWI756347B (zh) * | 2017-01-30 | 2022-03-01 | 日商富士軟片股份有限公司 | 組成物、膜、紅外線透過濾波器、固體攝像元件、圖像顯示裝置及紅外線感測器 |
KR102252721B1 (ko) * | 2017-06-02 | 2021-05-17 | 후지필름 가부시키가이샤 | 경화성 조성물, 막, 근적외선 차단 필터, 고체 촬상 소자, 화상 표시 장치 및 적외선 센서 |
EP3805822A4 (en) * | 2018-06-01 | 2022-05-11 | Toray Industries, Inc. | COLORED RESIN COMPOSITION, METHOD FOR PREPARING IT, PROTECTIVE FILM AGAINST NEAR INFRARED TRANSMISSION LIGHT AND DECORATIVE SUBSTRATE |
WO2021029195A1 (ja) * | 2019-08-13 | 2021-02-18 | 富士フイルム株式会社 | 組成物、膜、光学フィルタ及びその製造方法、固体撮像素子、赤外線センサ、カメラモジュール、並びに、化合物 |
JP7494481B2 (ja) * | 2020-02-17 | 2024-06-04 | artience株式会社 | 赤外線透過型着色組成物、赤外線透過フィルタ、赤外線カメラ、および赤外線センサ |
JP7512673B2 (ja) * | 2020-05-21 | 2024-07-09 | artience株式会社 | 赤外線透過型着色組成物、赤外線フィルタ、赤外線カメラ、および赤外線センサ |
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JPH05202109A (ja) * | 1991-07-10 | 1993-08-10 | Seiko Epson Corp | 透明プラスチック材料 |
JPH0860044A (ja) * | 1994-08-25 | 1996-03-05 | Three Bond Co Ltd | 光硬化型パテ材 |
JPH09302265A (ja) * | 1996-05-16 | 1997-11-25 | Toppan Printing Co Ltd | 遮光膜形成用着色樹脂組成物、アレイ基板素子及び液晶表示装置 |
EP1219684B1 (en) * | 2000-12-26 | 2005-10-12 | Dainichiseika Color & Chemicals Mfg. Co. Ltd. | Near-infrared transmitting black azo pigments |
JP4084023B2 (ja) * | 2001-03-22 | 2008-04-30 | 大日精化工業株式会社 | 近赤外線透過性黒色アゾ顔料および顔料組成物 |
JP4348872B2 (ja) * | 2001-03-28 | 2009-10-21 | 住友金属鉱山株式会社 | 積層体と可視光吸収膜を有する構造体および可視光吸収インク |
WO2004019084A1 (ja) * | 2001-03-28 | 2004-03-04 | Sumitomo Metal Mining Co.,Ltd. | 可視光吸収膜とこの可視光吸収膜を有する構造体および可視光吸収膜を形成する可視光吸収インク |
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- 2015-04-17 KR KR1020167032230A patent/KR101925813B1/ko active IP Right Grant
- 2015-04-17 WO PCT/JP2015/061804 patent/WO2015182277A1/ja active Application Filing
- 2015-04-17 JP JP2016523375A patent/JP6325097B2/ja active Active
- 2015-04-24 TW TW104113134A patent/TWI660238B/zh active
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JP2013054079A (ja) * | 2011-08-31 | 2013-03-21 | Fujifilm Corp | 光硬化性組成物、カラーフィルタ及びその製造方法、並びに固体撮像素子 |
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TW201544900A (zh) | 2015-12-01 |
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