KR101849799B1 - 액 처리 방법 및 필터 내의 기체의 제거 장치 - Google Patents

액 처리 방법 및 필터 내의 기체의 제거 장치 Download PDF

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Publication number
KR101849799B1
KR101849799B1 KR1020130016257A KR20130016257A KR101849799B1 KR 101849799 B1 KR101849799 B1 KR 101849799B1 KR 1020130016257 A KR1020130016257 A KR 1020130016257A KR 20130016257 A KR20130016257 A KR 20130016257A KR 101849799 B1 KR101849799 B1 KR 101849799B1
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South Korea
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liquid
filter
gas
chemical liquid
chemical
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KR1020130016257A
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English (en)
Korean (ko)
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KR20130094755A (ko
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다쿠야 모리
성문 박
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도쿄엘렉트론가부시키가이샤
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6534Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a liquid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D35/00Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
    • B01D35/14Safety devices specially adapted for filtration; Devices for indicating clogging
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00Cleaning of wafers, substrates or parts of devices
    • H10P70/10Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0402Apparatus for fluid treatment
    • H10P72/0406Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0448Apparatus for applying a liquid, a resin, an ink or the like

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Degasification And Air Bubble Elimination (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1020130016257A 2012-02-16 2013-02-15 액 처리 방법 및 필터 내의 기체의 제거 장치 Active KR101849799B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012031626 2012-02-16
JPJP-P-2012-031626 2012-02-16

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020180041680A Division KR101907351B1 (ko) 2012-02-16 2018-04-10 액 처리 방법 및 필터 내의 기체의 제거 장치

Publications (2)

Publication Number Publication Date
KR20130094755A KR20130094755A (ko) 2013-08-26
KR101849799B1 true KR101849799B1 (ko) 2018-04-17

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ID=49218411

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KR1020130016257A Active KR101849799B1 (ko) 2012-02-16 2013-02-15 액 처리 방법 및 필터 내의 기체의 제거 장치
KR1020180041680A Active KR101907351B1 (ko) 2012-02-16 2018-04-10 액 처리 방법 및 필터 내의 기체의 제거 장치

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KR1020180041680A Active KR101907351B1 (ko) 2012-02-16 2018-04-10 액 처리 방법 및 필터 내의 기체의 제거 장치

Country Status (2)

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JP (2) JP5565482B2 (https=)
KR (2) KR101849799B1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5741549B2 (ja) * 2012-10-09 2015-07-01 東京エレクトロン株式会社 処理液供給方法、処理液供給装置及び記憶媒体
JP5967045B2 (ja) * 2013-10-02 2016-08-10 東京エレクトロン株式会社 処理液供給装置及び処理液供給方法
JP6020416B2 (ja) * 2013-11-01 2016-11-02 東京エレクトロン株式会社 処理液供給装置及び処理液供給方法
KR102320180B1 (ko) * 2014-05-30 2021-11-03 세메스 주식회사 필터 유닛 및 그것을 갖는 약액 공급 장치
JP5991403B2 (ja) * 2015-04-21 2016-09-14 東京エレクトロン株式会社 フィルタウエッティング方法、フィルタウエッティング装置及び記憶媒体
KR101819172B1 (ko) * 2016-06-29 2018-03-02 (주)지오엘리먼트 케미컬 회수 시스템
JP6740072B2 (ja) * 2016-09-27 2020-08-12 株式会社Screenホールディングス 洗浄液カートリッジおよび該洗浄液カートリッジを用いた洗浄方法
JP6984431B2 (ja) * 2018-01-19 2021-12-22 東京エレクトロン株式会社 流路洗浄方法及び流路洗浄装置
TWI800623B (zh) * 2018-03-23 2023-05-01 日商東京威力科創股份有限公司 液處理裝置及液處理方法
JP6808696B2 (ja) * 2018-09-14 2021-01-06 株式会社Screenホールディングス 供給装置、塗布装置、および供給方法
JP7208568B2 (ja) 2019-09-24 2023-01-19 ダイキン工業株式会社 溶着体
KR102572629B1 (ko) * 2020-09-10 2023-08-31 세메스 주식회사 탈기 장치, 기판 처리 장치 및 처리액 탈기 방법
JP7569692B2 (ja) * 2021-01-05 2024-10-18 東京エレクトロン株式会社 液供給装置、液供給方法及びコンピュータ記憶媒体
KR102310908B1 (ko) * 2021-04-30 2021-10-08 (주) 리노닉스 질소 가스의 단독 사용이 가능한 캐리어 가스 공급장치
KR102666440B1 (ko) 2021-12-02 2024-05-20 세메스 주식회사 감광액 공급 시스템 및 감광액 관리 방법
KR102666438B1 (ko) * 2021-12-27 2024-05-17 세메스 주식회사 기판 처리 장치 및 처리액 탈기 방법
JP7630458B2 (ja) * 2022-03-10 2025-02-17 芝浦メカトロニクス株式会社 処理液供給装置、基板処理装置及び処理液供給方法
WO2024080020A1 (ja) * 2022-10-12 2024-04-18 株式会社堀場エステック 流体供給機構及び流体供給方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010165757A (ja) 2009-01-13 2010-07-29 Mtk:Kk ウエット処理装置
JP2011101851A (ja) 2009-11-11 2011-05-26 Koganei Corp 薬液供給装置および薬液供給方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63178843A (ja) * 1987-01-19 1988-07-22 Fuji Photo Film Co Ltd 感光性塗布液の処理方法
JP5231028B2 (ja) * 2008-01-21 2013-07-10 東京エレクトロン株式会社 塗布液供給装置
JP2009248513A (ja) * 2008-04-09 2009-10-29 Ulvac Japan Ltd 印刷装置
JP2011238820A (ja) * 2010-05-12 2011-11-24 Toppan Printing Co Ltd 塗布装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010165757A (ja) 2009-01-13 2010-07-29 Mtk:Kk ウエット処理装置
JP2011101851A (ja) 2009-11-11 2011-05-26 Koganei Corp 薬液供給装置および薬液供給方法

Also Published As

Publication number Publication date
JP2014222756A (ja) 2014-11-27
KR20180041100A (ko) 2018-04-23
JP2013191843A (ja) 2013-09-26
KR101907351B1 (ko) 2018-10-11
JP5854087B2 (ja) 2016-02-09
KR20130094755A (ko) 2013-08-26
JP5565482B2 (ja) 2014-08-06

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