JP5565482B2 - 液処理方法及びフィルタ内の気体の除去装置 - Google Patents

液処理方法及びフィルタ内の気体の除去装置 Download PDF

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Publication number
JP5565482B2
JP5565482B2 JP2013028247A JP2013028247A JP5565482B2 JP 5565482 B2 JP5565482 B2 JP 5565482B2 JP 2013028247 A JP2013028247 A JP 2013028247A JP 2013028247 A JP2013028247 A JP 2013028247A JP 5565482 B2 JP5565482 B2 JP 5565482B2
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liquid
filter
gas
chemical solution
chemical
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Japanese (ja)
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JP2013191843A (ja
Inventor
森　　拓也
成文 朴
孝介 吉原
裕一 寺下
克憲 一野
博史 竹口
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6534—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
    • B01D35/14—Safety devices specially adapted for filtration; Devices for indicating clogging
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Degasification And Air Bubble Elimination (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2013028247A 2012-02-16 2013-02-15 液処理方法及びフィルタ内の気体の除去装置 Active JP5565482B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013028247A JP5565482B2 (ja) 2012-02-16 2013-02-15 液処理方法及びフィルタ内の気体の除去装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012031626 2012-02-16
JP2012031626 2012-02-16
JP2013028247A JP5565482B2 (ja) 2012-02-16 2013-02-15 液処理方法及びフィルタ内の気体の除去装置

Related Child Applications (1)

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JP2014121599A Division JP5854087B2 (ja) 2012-02-16 2014-06-12 フィルタ内の気体の除去方法及びその装置

Publications (2)

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JP2013191843A JP2013191843A (ja) 2013-09-26
JP5565482B2 true JP5565482B2 (ja) 2014-08-06

Family

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Family Applications (2)

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JP2013028247A Active JP5565482B2 (ja) 2012-02-16 2013-02-15 液処理方法及びフィルタ内の気体の除去装置
JP2014121599A Active JP5854087B2 (ja) 2012-02-16 2014-06-12 フィルタ内の気体の除去方法及びその装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014121599A Active JP5854087B2 (ja) 2012-02-16 2014-06-12 フィルタ内の気体の除去方法及びその装置

Country Status (2)

Country Link
JP (2) JP5565482B2 (https=)
KR (2) KR101849799B1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5741549B2 (ja) * 2012-10-09 2015-07-01 東京エレクトロン株式会社 処理液供給方法、処理液供給装置及び記憶媒体
JP5967045B2 (ja) * 2013-10-02 2016-08-10 東京エレクトロン株式会社 処理液供給装置及び処理液供給方法
JP6020416B2 (ja) * 2013-11-01 2016-11-02 東京エレクトロン株式会社 処理液供給装置及び処理液供給方法
KR102320180B1 (ko) * 2014-05-30 2021-11-03 세메스 주식회사 필터 유닛 및 그것을 갖는 약액 공급 장치
JP5991403B2 (ja) * 2015-04-21 2016-09-14 東京エレクトロン株式会社 フィルタウエッティング方法、フィルタウエッティング装置及び記憶媒体
KR101819172B1 (ko) * 2016-06-29 2018-03-02 (주)지오엘리먼트 케미컬 회수 시스템
JP6740072B2 (ja) * 2016-09-27 2020-08-12 株式会社Ｓｃｒｅｅｎホールディングス 洗浄液カートリッジおよび該洗浄液カートリッジを用いた洗浄方法
JP6984431B2 (ja) * 2018-01-19 2021-12-22 東京エレクトロン株式会社 流路洗浄方法及び流路洗浄装置
TWI800623B (zh) * 2018-03-23 2023-05-01 日商東京威力科創股份有限公司 液處理裝置及液處理方法
JP6808696B2 (ja) * 2018-09-14 2021-01-06 株式会社Ｓｃｒｅｅｎホールディングス 供給装置、塗布装置、および供給方法
JP7208568B2 (ja) 2019-09-24 2023-01-19 ダイキン工業株式会社 溶着体
KR102572629B1 (ko) * 2020-09-10 2023-08-31 세메스 주식회사 탈기 장치, 기판 처리 장치 및 처리액 탈기 방법
JP7569692B2 (ja) * 2021-01-05 2024-10-18 東京エレクトロン株式会社 液供給装置、液供給方法及びコンピュータ記憶媒体
KR102310908B1 (ko) * 2021-04-30 2021-10-08 (주) 리노닉스 질소 가스의 단독 사용이 가능한 캐리어 가스 공급장치
KR102666440B1 (ko) 2021-12-02 2024-05-20 세메스 주식회사 감광액 공급 시스템 및 감광액 관리 방법
KR102666438B1 (ko) * 2021-12-27 2024-05-17 세메스 주식회사 기판 처리 장치 및 처리액 탈기 방법
JP7630458B2 (ja) * 2022-03-10 2025-02-17 芝浦メカトロニクス株式会社 処理液供給装置、基板処理装置及び処理液供給方法
WO2024080020A1 (ja) * 2022-10-12 2024-04-18 株式会社堀場エステック 流体供給機構及び流体供給方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63178843A (ja) * 1987-01-19 1988-07-22 Fuji Photo Film Co Ltd 感光性塗布液の処理方法
JP5231028B2 (ja) * 2008-01-21 2013-07-10 東京エレクトロン株式会社 塗布液供給装置
JP2009248513A (ja) * 2008-04-09 2009-10-29 Ulvac Japan Ltd 印刷装置
JP2010165757A (ja) 2009-01-13 2010-07-29 Mtk:Kk ウエット処理装置
JP5038378B2 (ja) * 2009-11-11 2012-10-03 株式会社コガネイ 薬液供給装置および薬液供給方法
JP2011238820A (ja) * 2010-05-12 2011-11-24 Toppan Printing Co Ltd 塗布装置

Also Published As

Publication number Publication date
JP2014222756A (ja) 2014-11-27
KR20180041100A (ko) 2018-04-23
JP2013191843A (ja) 2013-09-26
KR101907351B1 (ko) 2018-10-11
JP5854087B2 (ja) 2016-02-09
KR20130094755A (ko) 2013-08-26
KR101849799B1 (ko) 2018-04-17

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