KR101814270B1 - 본딩 장치 및 본딩 방법 - Google Patents
본딩 장치 및 본딩 방법 Download PDFInfo
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- KR101814270B1 KR101814270B1 KR1020160024615A KR20160024615A KR101814270B1 KR 101814270 B1 KR101814270 B1 KR 101814270B1 KR 1020160024615 A KR1020160024615 A KR 1020160024615A KR 20160024615 A KR20160024615 A KR 20160024615A KR 101814270 B1 KR101814270 B1 KR 101814270B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015076049A JP6470088B2 (ja) | 2015-04-02 | 2015-04-02 | ボンディング装置及びボンディング方法 |
JPJP-P-2015-076049 | 2015-04-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20160118925A KR20160118925A (ko) | 2016-10-12 |
KR101814270B1 true KR101814270B1 (ko) | 2018-01-02 |
Family
ID=57173883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020160024615A Active KR101814270B1 (ko) | 2015-04-02 | 2016-02-29 | 본딩 장치 및 본딩 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6470088B2 (enrdf_load_stackoverflow) |
KR (1) | KR101814270B1 (enrdf_load_stackoverflow) |
CN (1) | CN106057704B (enrdf_load_stackoverflow) |
TW (1) | TWI598967B (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230039542A (ko) * | 2021-09-14 | 2023-03-21 | 파스포드 테크놀로지 주식회사 | 실장 장치 및 반도체 장치의 제조 방법 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6316340B2 (ja) * | 2016-06-02 | 2018-04-25 | 株式会社カイジョー | ボンディング装置、ボンディング方法及びボンディング制御プログラム |
JP6643197B2 (ja) * | 2016-07-13 | 2020-02-12 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
US10882298B2 (en) * | 2016-11-07 | 2021-01-05 | Asm Technology Singapore Pte Ltd | System for adjusting relative positions between components of a bonding apparatus |
JP6820189B2 (ja) * | 2016-12-01 | 2021-01-27 | 東京エレクトロン株式会社 | 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体 |
JP6818608B2 (ja) * | 2017-03-28 | 2021-01-20 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
JP6868471B2 (ja) * | 2017-05-31 | 2021-05-12 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
TWI684235B (zh) * | 2017-07-12 | 2020-02-01 | 日商新川股份有限公司 | 相對於第二物體來定位第一物體的裝置和方法 |
TWI823598B (zh) * | 2018-01-23 | 2023-11-21 | 日商東京威力科創股份有限公司 | 接合系統及接合方法 |
JP7018341B2 (ja) | 2018-03-26 | 2022-02-10 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
US11069555B2 (en) * | 2018-09-03 | 2021-07-20 | Assembleon B.V. | Die attach systems, and methods of attaching a die to a substrate |
SG11202104308TA (en) | 2018-11-01 | 2021-05-28 | Yamaha Motor Robotics Holdings Co Ltd | Electronic component mounting apparatus |
TWI744849B (zh) * | 2019-04-15 | 2021-11-01 | 日商新川股份有限公司 | 接合裝置以及接合頭的移動量補正方法 |
US10861819B1 (en) * | 2019-07-05 | 2020-12-08 | Asm Technology Singapore Pte Ltd | High-precision bond head positioning method and apparatus |
CN112435955B (zh) * | 2019-08-26 | 2024-04-16 | 合肥晶合集成电路股份有限公司 | 一种晶圆裂片的支撑装置及其固定方法 |
TWI727853B (zh) * | 2020-07-15 | 2021-05-11 | 歆熾電氣技術股份有限公司 | 晶片移轉系統與晶片移轉方法 |
CN114388418B (zh) * | 2021-12-28 | 2022-12-13 | 凌波微步半导体设备(常熟)有限公司 | 一种半导体焊线机的闭环位置补偿方法及系统 |
JP7292463B1 (ja) * | 2022-03-29 | 2023-06-16 | キヤノンマシナリー株式会社 | 位置合わせ装置、位置合わせ方法、ボンディング装置、ボンディング方法、および半導体装置製造方法 |
CN117238834B (zh) * | 2023-10-25 | 2024-08-02 | 天芯电子科技(江阴)有限公司 | 一种用于芯片质量检测的抓取设备 |
KR20250076287A (ko) * | 2023-11-22 | 2025-05-29 | 한화세미텍 주식회사 | 픽앤플레이스 장치 및 픽앤플레이스 장치의 헤드 위치 확인 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000252303A (ja) | 1999-02-26 | 2000-09-14 | Shibaura Mechatronics Corp | ペレットボンディング方法 |
KR101303024B1 (ko) * | 2012-02-23 | 2013-09-03 | 한미반도체 주식회사 | 플립칩 본딩장치 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4232511B2 (ja) | 2003-04-03 | 2009-03-04 | 日本電気株式会社 | 半導体製造装置 |
JP4111160B2 (ja) * | 2004-03-26 | 2008-07-02 | 松下電器産業株式会社 | 電子部品搭載装置および電子部品搭載方法 |
CH698334B1 (de) * | 2007-10-09 | 2011-07-29 | Esec Ag | Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat. |
US7851346B2 (en) * | 2008-07-21 | 2010-12-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bonding metallurgy for three-dimensional interconnect |
JP5344145B2 (ja) * | 2008-12-25 | 2013-11-20 | 澁谷工業株式会社 | ボンディング装置における電子部品と基板の位置合わせ方法 |
CN102623299A (zh) * | 2011-01-31 | 2012-08-01 | 洲磊科技股份有限公司 | 一种晶圆接合的晶粒制程方法 |
JP5989313B2 (ja) * | 2011-09-15 | 2016-09-07 | ファスフォードテクノロジ株式会社 | ダイボンダ及びボンディング方法 |
EP3373328A1 (de) * | 2012-06-06 | 2018-09-12 | EV Group E. Thallner GmbH | Vorrichtung und verfahren zur ermittlung von ausrichtungsfehlern |
JP6166069B2 (ja) * | 2013-03-15 | 2017-07-19 | ファスフォードテクノロジ株式会社 | ダイボンダ及びコレット位置調整方法 |
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2015
- 2015-04-02 JP JP2015076049A patent/JP6470088B2/ja active Active
-
2016
- 2016-02-22 TW TW105105116A patent/TWI598967B/zh active
- 2016-02-29 KR KR1020160024615A patent/KR101814270B1/ko active Active
- 2016-03-03 CN CN201610121473.6A patent/CN106057704B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000252303A (ja) | 1999-02-26 | 2000-09-14 | Shibaura Mechatronics Corp | ペレットボンディング方法 |
KR101303024B1 (ko) * | 2012-02-23 | 2013-09-03 | 한미반도체 주식회사 | 플립칩 본딩장치 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230039542A (ko) * | 2021-09-14 | 2023-03-21 | 파스포드 테크놀로지 주식회사 | 실장 장치 및 반도체 장치의 제조 방법 |
KR102808948B1 (ko) * | 2021-09-14 | 2025-05-20 | 파스포드 테크놀로지 주식회사 | 실장 장치 및 반도체 장치의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
TW201642363A (zh) | 2016-12-01 |
CN106057704A (zh) | 2016-10-26 |
CN106057704B (zh) | 2019-01-18 |
TWI598967B (zh) | 2017-09-11 |
KR20160118925A (ko) | 2016-10-12 |
JP2016197630A (ja) | 2016-11-24 |
JP6470088B2 (ja) | 2019-02-13 |
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