KR101813375B1 - 광전 센서 - Google Patents
광전 센서 Download PDFInfo
- Publication number
- KR101813375B1 KR101813375B1 KR1020160059542A KR20160059542A KR101813375B1 KR 101813375 B1 KR101813375 B1 KR 101813375B1 KR 1020160059542 A KR1020160059542 A KR 1020160059542A KR 20160059542 A KR20160059542 A KR 20160059542A KR 101813375 B1 KR101813375 B1 KR 101813375B1
- Authority
- KR
- South Korea
- Prior art keywords
- connector
- base
- cover
- photoelectric sensor
- light
- Prior art date
Links
- 229920005989 resin Polymers 0.000 description 27
- 239000011347 resin Substances 0.000 description 27
- 238000000465 moulding Methods 0.000 description 19
- 230000003014 reinforcing effect Effects 0.000 description 17
- 238000005452 bending Methods 0.000 description 12
- 238000001514 detection method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 229920001707 polybutylene terephthalate Polymers 0.000 description 6
- 238000003780 insertion Methods 0.000 description 5
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- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- -1 polybutylene terephthalate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/09—Devices sensitive to infrared, visible or ultraviolet radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Switches Operated By Changes In Physical Conditions (AREA)
- Manufacture Of Switches (AREA)
- Geophysics And Detection Of Objects (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2015-145770 | 2015-07-23 | ||
JP2015145770A JP6510347B2 (ja) | 2015-07-23 | 2015-07-23 | 光電センサ、光電センサの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170012008A KR20170012008A (ko) | 2017-02-02 |
KR101813375B1 true KR101813375B1 (ko) | 2017-12-28 |
Family
ID=57061660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020160059542A KR101813375B1 (ko) | 2015-07-23 | 2016-05-16 | 광전 센서 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6510347B2 (zh) |
KR (1) | KR101813375B1 (zh) |
CN (1) | CN205642399U (zh) |
TW (1) | TW201704794A (zh) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008098471A (ja) | 2006-10-13 | 2008-04-24 | Sharp Corp | 光結合装置およびその製造方法、並びに、光結合装置を用いた電子機器 |
US20080210952A1 (en) | 2006-10-24 | 2008-09-04 | Hideo Wada | Photo interrupter, method of manufacturing the same, and electronic equipment using the same |
JP2008270264A (ja) | 2007-04-16 | 2008-11-06 | Rohm Co Ltd | フォトインタラプタ |
JP2009050129A (ja) | 2007-08-22 | 2009-03-05 | Omron Corp | セーフティコントローラ |
JP2010062238A (ja) | 2008-09-02 | 2010-03-18 | Juki Corp | フォトインタラプタ |
JP2011027532A (ja) | 2009-07-24 | 2011-02-10 | Yamatake Corp | 光電センサ |
JP2015115186A (ja) | 2013-12-11 | 2015-06-22 | アズビル株式会社 | 光電スイッチ |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0935594A (ja) * | 1995-07-18 | 1997-02-07 | Omron Corp | 光センサ |
JPH11145505A (ja) * | 1997-11-11 | 1999-05-28 | Omron Corp | ホトセンサ及びその製造方法 |
JP3721887B2 (ja) * | 1999-10-01 | 2005-11-30 | オムロン株式会社 | 電子部品およびフォトマイクロセンサ |
-
2015
- 2015-07-23 JP JP2015145770A patent/JP6510347B2/ja active Active
-
2016
- 2016-04-28 CN CN201620371698.2U patent/CN205642399U/zh active Active
- 2016-05-16 KR KR1020160059542A patent/KR101813375B1/ko active IP Right Grant
- 2016-05-17 TW TW105115107A patent/TW201704794A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008098471A (ja) | 2006-10-13 | 2008-04-24 | Sharp Corp | 光結合装置およびその製造方法、並びに、光結合装置を用いた電子機器 |
US20080210952A1 (en) | 2006-10-24 | 2008-09-04 | Hideo Wada | Photo interrupter, method of manufacturing the same, and electronic equipment using the same |
JP2008270264A (ja) | 2007-04-16 | 2008-11-06 | Rohm Co Ltd | フォトインタラプタ |
JP2009050129A (ja) | 2007-08-22 | 2009-03-05 | Omron Corp | セーフティコントローラ |
JP2010062238A (ja) | 2008-09-02 | 2010-03-18 | Juki Corp | フォトインタラプタ |
JP2011027532A (ja) | 2009-07-24 | 2011-02-10 | Yamatake Corp | 光電センサ |
JP2015115186A (ja) | 2013-12-11 | 2015-06-22 | アズビル株式会社 | 光電スイッチ |
Also Published As
Publication number | Publication date |
---|---|
KR20170012008A (ko) | 2017-02-02 |
CN205642399U (zh) | 2016-10-12 |
JP2017027812A (ja) | 2017-02-02 |
TW201704794A (zh) | 2017-02-01 |
JP6510347B2 (ja) | 2019-05-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |