KR101807382B1 - 임프린트 장치 및 물품의 제조 방법 - Google Patents

임프린트 장치 및 물품의 제조 방법 Download PDF

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Publication number
KR101807382B1
KR101807382B1 KR1020157037060A KR20157037060A KR101807382B1 KR 101807382 B1 KR101807382 B1 KR 101807382B1 KR 1020157037060 A KR1020157037060 A KR 1020157037060A KR 20157037060 A KR20157037060 A KR 20157037060A KR 101807382 B1 KR101807382 B1 KR 101807382B1
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KR
South Korea
Prior art keywords
substrate
mold
imprint
releasing
detector
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English (en)
Korean (ko)
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KR20160015312A (ko
Inventor
겐키 무라야마
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캐논 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020157037060A 2013-12-09 2014-11-14 임프린트 장치 및 물품의 제조 방법 Active KR101807382B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-254490 2013-12-09
JP2013254490A JP6315963B2 (ja) 2013-12-09 2013-12-09 インプリント装置、及び物品の製造方法
PCT/JP2014/080833 WO2015087687A1 (en) 2013-12-09 2014-11-14 Imprint apparatus, and method of manufacturing article

Publications (2)

Publication Number Publication Date
KR20160015312A KR20160015312A (ko) 2016-02-12
KR101807382B1 true KR101807382B1 (ko) 2017-12-08

Family

ID=53371001

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157037060A Active KR101807382B1 (ko) 2013-12-09 2014-11-14 임프린트 장치 및 물품의 제조 방법

Country Status (4)

Country Link
US (1) US10611063B2 (enExample)
JP (1) JP6315963B2 (enExample)
KR (1) KR101807382B1 (enExample)
WO (1) WO2015087687A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6700777B2 (ja) * 2015-12-24 2020-05-27 キヤノン株式会社 インプリント装置、情報処理装置および物品製造方法
JP6748461B2 (ja) * 2016-03-22 2020-09-02 キヤノン株式会社 インプリント装置、インプリント装置の動作方法および物品製造方法
JP6706983B2 (ja) 2016-07-12 2020-06-10 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6978877B2 (ja) 2017-09-04 2021-12-08 キヤノン株式会社 インプリント装置および物品製造方法
JP7100485B2 (ja) * 2018-04-26 2022-07-13 キヤノン株式会社 インプリント装置およびデバイス製造方法
JP7091138B2 (ja) * 2018-05-15 2022-06-27 キヤノン株式会社 インプリント装置、インプリント方法、および物品製造方法
JP7383450B2 (ja) 2019-10-23 2023-11-20 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP7657631B2 (ja) * 2021-03-29 2025-04-07 キヤノン株式会社 評価装置、プログラム、評価方法、成形システム、および物品製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007081048A (ja) 2005-09-13 2007-03-29 Canon Inc ナノインプリント用型、装置および方法
JP2011100952A (ja) * 2009-11-09 2011-05-19 Canon Inc インプリント装置及び物品の製造方法
WO2011118006A1 (ja) * 2010-03-25 2011-09-29 パイオニア株式会社 転写装置及び方法、並びにコンピュータプログラム
JP2012060074A (ja) * 2010-09-13 2012-03-22 Toshiba Corp インプリント装置及び方法

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US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
TW571087B (en) * 2003-06-02 2004-01-11 Chen-Hung He Method and system for monitoring the mold strain in nanoimprint lithography technique
TWI235628B (en) * 2004-03-26 2005-07-01 Ind Tech Res Inst Monitoring system and method for imprint process
US7798801B2 (en) * 2005-01-31 2010-09-21 Molecular Imprints, Inc. Chucking system for nano-manufacturing
JP4810319B2 (ja) * 2006-06-09 2011-11-09 キヤノン株式会社 加工装置及びデバイス製造方法
JP5196743B2 (ja) * 2006-06-29 2013-05-15 キヤノン株式会社 加工方法及び装置、並びに、デバイス製造方法
WO2008129962A1 (ja) * 2007-04-19 2008-10-30 Konica Minolta Holdings, Inc. 成形装置及びその制御方法
US20100101493A1 (en) * 2008-10-27 2010-04-29 Molecular Imprints, Inc. Dispense System
US8432548B2 (en) * 2008-11-04 2013-04-30 Molecular Imprints, Inc. Alignment for edge field nano-imprinting
US8747092B2 (en) * 2010-01-22 2014-06-10 Nanonex Corporation Fast nanoimprinting apparatus using deformale mold
JP5833636B2 (ja) 2010-04-27 2015-12-16 モレキュラー・インプリンツ・インコーポレーテッド ナノインプリント・リソグラフィのテンプレート製作方法およびそのシステム
JP6200135B2 (ja) * 2012-07-24 2017-09-20 キヤノン株式会社 インプリント装置、インプリント方法、および、物品製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007081048A (ja) 2005-09-13 2007-03-29 Canon Inc ナノインプリント用型、装置および方法
JP2011100952A (ja) * 2009-11-09 2011-05-19 Canon Inc インプリント装置及び物品の製造方法
WO2011118006A1 (ja) * 2010-03-25 2011-09-29 パイオニア株式会社 転写装置及び方法、並びにコンピュータプログラム
JP2012060074A (ja) * 2010-09-13 2012-03-22 Toshiba Corp インプリント装置及び方法

Also Published As

Publication number Publication date
JP6315963B2 (ja) 2018-04-25
JP2015115370A (ja) 2015-06-22
US20160052179A1 (en) 2016-02-25
KR20160015312A (ko) 2016-02-12
US10611063B2 (en) 2020-04-07
WO2015087687A1 (en) 2015-06-18

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