KR101793366B1 - 본딩 장치 및 본딩 방법 - Google Patents

본딩 장치 및 본딩 방법 Download PDF

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Publication number
KR101793366B1
KR101793366B1 KR1020160024620A KR20160024620A KR101793366B1 KR 101793366 B1 KR101793366 B1 KR 101793366B1 KR 1020160024620 A KR1020160024620 A KR 1020160024620A KR 20160024620 A KR20160024620 A KR 20160024620A KR 101793366 B1 KR101793366 B1 KR 101793366B1
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South Korea
Prior art keywords
die
imaging
pick
detecting
reference mark
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Korean (ko)
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KR20160110110A (ko
Inventor
히로시 마끼
히데아끼 사까모또
게이따 야마모또
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파스포드 테크놀로지 주식회사
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    • H01L21/52—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H01L21/67712—
    • H01L21/681—
    • H01L22/12—
    • H01L23/488—
    • H01L23/544—
    • H01L24/02—
    • H01L24/26—
    • H01L24/74—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

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  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020160024620A 2015-03-11 2016-02-29 본딩 장치 및 본딩 방법 Active KR101793366B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015048178A JP6510838B2 (ja) 2015-03-11 2015-03-11 ボンディング装置及びボンディング方法
JPJP-P-2015-048178 2015-03-11

Publications (2)

Publication Number Publication Date
KR20160110110A KR20160110110A (ko) 2016-09-21
KR101793366B1 true KR101793366B1 (ko) 2017-11-02

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KR1020160024620A Active KR101793366B1 (ko) 2015-03-11 2016-02-29 본딩 장치 및 본딩 방법

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JP (1) JP6510838B2 (https=)
KR (1) KR101793366B1 (https=)
CN (1) CN105977184B (https=)
TW (1) TWI647767B (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6316340B2 (ja) * 2016-06-02 2018-04-25 株式会社カイジョー ボンディング装置、ボンディング方法及びボンディング制御プログラム
JP6705727B2 (ja) * 2016-09-26 2020-06-03 ファスフォードテクノロジ株式会社 フリップチップボンダおよび半導体装置の製造方法
US11031367B2 (en) * 2016-10-25 2021-06-08 Kulicke and Soffa Industries, In. Bond head assemblies including reflective optical elements, related bonding machines, and related methods
CN106373914B (zh) * 2016-11-10 2020-03-24 北京中电科电子装备有限公司 一种芯片键合装置
TWI662638B (zh) * 2017-04-21 2019-06-11 Asti Global Inc., Taiwan 半導體晶片修補方法以及半導體晶片修補裝置
JP7164314B2 (ja) 2017-04-28 2022-11-01 ベシ スウィッツァーランド エージー 部品を基板上に搭載する装置及び方法
KR102408524B1 (ko) * 2017-09-19 2022-06-14 삼성디스플레이 주식회사 표시 장치의 제조 장치 및 표시 장치의 제조 방법
JP7033878B2 (ja) * 2017-10-16 2022-03-11 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP7018341B2 (ja) 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
US11031368B2 (en) * 2018-05-14 2021-06-08 Panasonic Intellectual Property Management Co., Ltd. Bonding apparatus
US10861819B1 (en) * 2019-07-05 2020-12-08 Asm Technology Singapore Pte Ltd High-precision bond head positioning method and apparatus
JP7291586B2 (ja) * 2019-09-19 2023-06-15 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
KR102350557B1 (ko) * 2020-03-06 2022-01-14 세메스 주식회사 다이 본딩 방법 및 다이 본딩 장치
TWI792785B (zh) * 2020-12-31 2023-02-11 南韓商Ｔｅｓ股份有限公司 基板接合裝置及基板接合方法
KR102822141B1 (ko) 2021-09-24 2025-06-18 삼성전자주식회사 정렬 검사용 광학 어셈블리, 이를 포함한 광학 장치, 다이 본딩 시스템 및 이를 이용한 다이 본딩 방법
JPWO2023181346A1 (https=) * 2022-03-25 2023-09-28
JP7292463B1 (ja) 2022-03-29 2023-06-16 キヤノンマシナリー株式会社 位置合わせ装置、位置合わせ方法、ボンディング装置、ボンディング方法、および半導体装置製造方法
JP7842907B2 (ja) * 2023-01-31 2026-04-08 株式会社日立ハイテク 搬送方法、搬送装置および解析システム
TWI886997B (zh) * 2024-06-11 2025-06-11 梭特科技股份有限公司 封裝定位標記方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252303A (ja) * 1999-02-26 2000-09-14 Shibaura Mechatronics Corp ペレットボンディング方法
KR101303024B1 (ko) * 2012-02-23 2013-09-03 한미반도체 주식회사 플립칩 본딩장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1072398C (zh) * 1997-03-26 2001-10-03 财团法人工业技术研究院 芯片接合方法与装置
JP2003092313A (ja) * 2001-09-19 2003-03-28 Nec Machinery Corp チップ反転装置およびダイボンダ
JP2003249797A (ja) * 2002-02-25 2003-09-05 Toray Eng Co Ltd 実装装置および実装装置におけるアライメント方法
JP2007115851A (ja) * 2005-10-19 2007-05-10 Toshiba Corp 半導体部品の位置検査方法、位置検査装置および半導体装置の製造方法
CH698334B1 (de) * 2007-10-09 2011-07-29 Esec Ag Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat.
JP5989313B2 (ja) * 2011-09-15 2016-09-07 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252303A (ja) * 1999-02-26 2000-09-14 Shibaura Mechatronics Corp ペレットボンディング方法
KR101303024B1 (ko) * 2012-02-23 2013-09-03 한미반도체 주식회사 플립칩 본딩장치

Also Published As

Publication number Publication date
JP2016171107A (ja) 2016-09-23
TWI647767B (zh) 2019-01-11
TW201701379A (zh) 2017-01-01
KR20160110110A (ko) 2016-09-21
CN105977184A (zh) 2016-09-28
CN105977184B (zh) 2019-02-15
JP6510838B2 (ja) 2019-05-08

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