JPWO2023181346A1 - - Google Patents
Info
- Publication number
- JPWO2023181346A1 JPWO2023181346A1 JP2024509650A JP2024509650A JPWO2023181346A1 JP WO2023181346 A1 JPWO2023181346 A1 JP WO2023181346A1 JP 2024509650 A JP2024509650 A JP 2024509650A JP 2024509650 A JP2024509650 A JP 2024509650A JP WO2023181346 A1 JPWO2023181346 A1 JP WO2023181346A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/014381 WO2023181346A1 (ja) | 2022-03-25 | 2022-03-25 | 検査支援装置、生産管理システム、および検査支援方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023181346A1 true JPWO2023181346A1 (https=) | 2023-09-28 |
Family
ID=88100244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024509650A Pending JPWO2023181346A1 (https=) | 2022-03-25 | 2022-03-25 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023181346A1 (https=) |
| WO (1) | WO2023181346A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08335609A (ja) * | 1995-06-05 | 1996-12-17 | Toray Eng Co Ltd | チップボンディング装置 |
| JPH11163047A (ja) * | 1997-11-27 | 1999-06-18 | Toshiba Corp | 半導体装置の製造方法及びその装置 |
| JPH11274240A (ja) * | 1998-03-26 | 1999-10-08 | Matsushita Electric Ind Co Ltd | 電子部品の実装装置および実装方法 |
| JP2016171107A (ja) * | 2015-03-11 | 2016-09-23 | ファスフォードテクノロジ株式会社 | ボンディング装置及びボンディング方法 |
| WO2019097675A1 (ja) * | 2017-11-17 | 2019-05-23 | ヤマハ発動機株式会社 | 部品実装機、部品検査方法、部品検査プログラム、記録媒体 |
-
2022
- 2022-03-25 JP JP2024509650A patent/JPWO2023181346A1/ja active Pending
- 2022-03-25 WO PCT/JP2022/014381 patent/WO2023181346A1/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08335609A (ja) * | 1995-06-05 | 1996-12-17 | Toray Eng Co Ltd | チップボンディング装置 |
| JPH11163047A (ja) * | 1997-11-27 | 1999-06-18 | Toshiba Corp | 半導体装置の製造方法及びその装置 |
| JPH11274240A (ja) * | 1998-03-26 | 1999-10-08 | Matsushita Electric Ind Co Ltd | 電子部品の実装装置および実装方法 |
| JP2016171107A (ja) * | 2015-03-11 | 2016-09-23 | ファスフォードテクノロジ株式会社 | ボンディング装置及びボンディング方法 |
| WO2019097675A1 (ja) * | 2017-11-17 | 2019-05-23 | ヤマハ発動機株式会社 | 部品実装機、部品検査方法、部品検査プログラム、記録媒体 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023181346A1 (ja) | 2023-09-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250206 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260106 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260306 |