KR101743918B1 - 발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법 - Google Patents

발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법 Download PDF

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Publication number
KR101743918B1
KR101743918B1 KR1020100116371A KR20100116371A KR101743918B1 KR 101743918 B1 KR101743918 B1 KR 101743918B1 KR 1020100116371 A KR1020100116371 A KR 1020100116371A KR 20100116371 A KR20100116371 A KR 20100116371A KR 101743918 B1 KR101743918 B1 KR 101743918B1
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South Korea
Prior art keywords
resin
light emitting
emitting device
device package
package
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Application number
KR1020100116371A
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English (en)
Korean (ko)
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KR20120054954A (ko
Inventor
김주용
최승기
홍지훈
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삼성전자주식회사
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Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020100116371A priority Critical patent/KR101743918B1/ko
Priority to JP2011243464A priority patent/JP5944142B2/ja
Priority to US13/295,411 priority patent/US8546153B2/en
Priority to EP11190027.0A priority patent/EP2455204B1/en
Priority to CN201110380876.XA priority patent/CN102544257B/zh
Publication of KR20120054954A publication Critical patent/KR20120054954A/ko
Priority to US14/029,350 priority patent/US9056690B2/en
Application granted granted Critical
Publication of KR101743918B1 publication Critical patent/KR101743918B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
    • B65B3/04—Methods of, or means for, filling the material into the containers or receptacles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/44—Measuring, controlling or regulating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/042—Feeding of the material to be moulded, e.g. into a mould cavity using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020100116371A 2010-11-22 2010-11-22 발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법 Active KR101743918B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020100116371A KR101743918B1 (ko) 2010-11-22 2010-11-22 발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법
JP2011243464A JP5944142B2 (ja) 2010-11-22 2011-11-07 発光素子パッケージの樹脂塗布装置、及びこれを用いる発光素子パッケージの製造方法
US13/295,411 US8546153B2 (en) 2010-11-22 2011-11-14 Resin dispensing apparatus for light emitting device package and method of manufacturing light emitting device package using the same
EP11190027.0A EP2455204B1 (en) 2010-11-22 2011-11-22 Resin dispensing apparatus for light emitting device package and method of manufacturing light emitting device package
CN201110380876.XA CN102544257B (zh) 2010-11-22 2011-11-22 树脂分配设备及使用其制造发光装置封装件的方法
US14/029,350 US9056690B2 (en) 2010-11-22 2013-09-17 Resin dispensing apparatus for light emitting device package and method of manufacturing light emitting device package using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100116371A KR101743918B1 (ko) 2010-11-22 2010-11-22 발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법

Publications (2)

Publication Number Publication Date
KR20120054954A KR20120054954A (ko) 2012-05-31
KR101743918B1 true KR101743918B1 (ko) 2017-06-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100116371A Active KR101743918B1 (ko) 2010-11-22 2010-11-22 발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법

Country Status (5)

Country Link
US (2) US8546153B2 (https=)
EP (1) EP2455204B1 (https=)
JP (1) JP5944142B2 (https=)
KR (1) KR101743918B1 (https=)
CN (1) CN102544257B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012129325A1 (en) 2011-03-22 2012-09-27 The General Hospital Corporation Molecular analysis of tumor samples
US9490402B2 (en) * 2012-08-17 2016-11-08 Zhiqiang Qian LED light-emitting device for white light
KR101436456B1 (ko) 2013-07-30 2014-09-01 (주)위시스 Ehd 펌프를 이용한 led 소자 제조 방법
DE102014106020A1 (de) * 2014-04-29 2015-10-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
KR102493202B1 (ko) * 2016-01-25 2023-01-30 주식회사 두오텍 칩패키지 와이어 접촉감지 시스템

Citations (1)

* Cited by examiner, † Cited by third party
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JP2006086408A (ja) * 2004-09-17 2006-03-30 Stanley Electric Co Ltd Ｌｅｄ装置

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JPH01284364A (ja) * 1988-05-11 1989-11-15 Seiwa Denki Kk ディスペンサー
JPH01288363A (ja) * 1988-05-13 1989-11-20 Seiwa Denki Kk ディスペンサー
JP2856881B2 (ja) * 1990-10-08 1999-02-10 株式会社東芝 半導体封止装置
JPH0766539A (ja) 1993-08-25 1995-03-10 Toyota Motor Corp 電極における接着用樹脂の塗布方法及びその塗布装置
JPH07161743A (ja) * 1993-12-02 1995-06-23 Hitachi Ltd 樹脂モールド装置
DE69521648T2 (de) * 1994-05-20 2001-10-25 Vlt Corp., San Antonio Formenabfüllverfahren
JPH0831851A (ja) * 1994-07-13 1996-02-02 Hitachi Cable Ltd ダイボンディング装置
JPH0878452A (ja) * 1994-09-06 1996-03-22 Hitachi Ltd 樹脂封止装置
JPH08131813A (ja) * 1994-11-07 1996-05-28 Horiba Ltd 粘性流体供給装置
JP2002096013A (ja) * 2000-09-26 2002-04-02 Fujitsu Ltd 樹脂塗布方法
JP2002118271A (ja) * 2000-10-11 2002-04-19 Fujitsu Ltd 光素子の樹脂封止構造
CN1424772A (zh) * 2001-12-13 2003-06-18 诠兴开发科技股份有限公司 短波长的发光二极管封装方法
CN2537070Y (zh) * 2002-03-18 2003-02-19 佘孝平 拉链式防盗报警器
US6814110B2 (en) * 2002-12-12 2004-11-09 Stainless Steel Coatings, Inc. Method of and apparatus for improved pressurized fluid dispensing for the guaranteed filling of cavities and/or the generating of guaranteed uniform gasket beads and the like
CN2618683Y (zh) * 2003-05-09 2004-06-02 黄清文 点胶机
JP2005152826A (ja) * 2003-11-27 2005-06-16 Matsushita Electric Ind Co Ltd 吐出装置および封止装置
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KR100863203B1 (ko) 2006-09-01 2008-10-13 주식회사 탑 엔지니어링 반도체 소자 제조용 도포장비의 노즐 충돌 인식장치
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Also Published As

Publication number Publication date
EP2455204A3 (en) 2014-12-24
EP2455204B1 (en) 2016-04-27
US20140014682A1 (en) 2014-01-16
KR20120054954A (ko) 2012-05-31
CN102544257A (zh) 2012-07-04
US20120129281A1 (en) 2012-05-24
CN102544257B (zh) 2015-01-21
US8546153B2 (en) 2013-10-01
JP5944142B2 (ja) 2016-07-05
EP2455204A2 (en) 2012-05-23
US9056690B2 (en) 2015-06-16
JP2012114430A (ja) 2012-06-14

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