CN102544257B - 树脂分配设备及使用其制造发光装置封装件的方法 - Google Patents

树脂分配设备及使用其制造发光装置封装件的方法 Download PDF

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Publication number
CN102544257B
CN102544257B CN201110380876.XA CN201110380876A CN102544257B CN 102544257 B CN102544257 B CN 102544257B CN 201110380876 A CN201110380876 A CN 201110380876A CN 102544257 B CN102544257 B CN 102544257B
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CN
China
Prior art keywords
resin
emitting device
light emitting
dispensing apparatus
device package
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Active
Application number
CN201110380876.XA
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English (en)
Chinese (zh)
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CN102544257A (zh
Inventor
金辏湧
崔昇基
洪智勋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Publication of CN102544257A publication Critical patent/CN102544257A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/44—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
    • B65B3/04—Methods of, or means for, filling the material into the containers or receptacles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/042—Feeding of the material to be moulded, e.g. into a mould cavity using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN201110380876.XA 2010-11-22 2011-11-22 树脂分配设备及使用其制造发光装置封装件的方法 Active CN102544257B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0116371 2010-11-22
KR1020100116371A KR101743918B1 (ko) 2010-11-22 2010-11-22 발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법

Publications (2)

Publication Number Publication Date
CN102544257A CN102544257A (zh) 2012-07-04
CN102544257B true CN102544257B (zh) 2015-01-21

Family

ID=45093397

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110380876.XA Active CN102544257B (zh) 2010-11-22 2011-11-22 树脂分配设备及使用其制造发光装置封装件的方法

Country Status (5)

Country Link
US (2) US8546153B2 (https=)
EP (1) EP2455204B1 (https=)
JP (1) JP5944142B2 (https=)
KR (1) KR101743918B1 (https=)
CN (1) CN102544257B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012129325A1 (en) 2011-03-22 2012-09-27 The General Hospital Corporation Molecular analysis of tumor samples
US9490402B2 (en) * 2012-08-17 2016-11-08 Zhiqiang Qian LED light-emitting device for white light
KR101436456B1 (ko) 2013-07-30 2014-09-01 (주)위시스 Ehd 펌프를 이용한 led 소자 제조 방법
DE102014106020A1 (de) * 2014-04-29 2015-10-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
KR102493202B1 (ko) * 2016-01-25 2023-01-30 주식회사 두오텍 칩패키지 와이어 접촉감지 시스템

Citations (6)

* Cited by examiner, † Cited by third party
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CN2537070Y (zh) * 2002-03-18 2003-02-19 佘孝平 拉链式防盗报警器
CN1424772A (zh) * 2001-12-13 2003-06-18 诠兴开发科技股份有限公司 短波长的发光二极管封装方法
CN2618683Y (zh) * 2003-05-09 2004-06-02 黄清文 点胶机
CN201067733Y (zh) * 2007-07-06 2008-06-04 周明华 一种点胶机
CN201143480Y (zh) * 2007-09-17 2008-11-05 黄清文 三维自动点胶机
CN201562330U (zh) * 2009-11-11 2010-08-25 连龙 防盗自动报警器

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JPH01284364A (ja) * 1988-05-11 1989-11-15 Seiwa Denki Kk ディスペンサー
JPH01288363A (ja) * 1988-05-13 1989-11-20 Seiwa Denki Kk ディスペンサー
JP2856881B2 (ja) * 1990-10-08 1999-02-10 株式会社東芝 半導体封止装置
JPH0766539A (ja) 1993-08-25 1995-03-10 Toyota Motor Corp 電極における接着用樹脂の塗布方法及びその塗布装置
JPH07161743A (ja) * 1993-12-02 1995-06-23 Hitachi Ltd 樹脂モールド装置
DE69521648T2 (de) * 1994-05-20 2001-10-25 Vlt Corp., San Antonio Formenabfüllverfahren
JPH0831851A (ja) * 1994-07-13 1996-02-02 Hitachi Cable Ltd ダイボンディング装置
JPH0878452A (ja) * 1994-09-06 1996-03-22 Hitachi Ltd 樹脂封止装置
JPH08131813A (ja) * 1994-11-07 1996-05-28 Horiba Ltd 粘性流体供給装置
JP2002096013A (ja) * 2000-09-26 2002-04-02 Fujitsu Ltd 樹脂塗布方法
JP2002118271A (ja) * 2000-10-11 2002-04-19 Fujitsu Ltd 光素子の樹脂封止構造
US6814110B2 (en) * 2002-12-12 2004-11-09 Stainless Steel Coatings, Inc. Method of and apparatus for improved pressurized fluid dispensing for the guaranteed filling of cavities and/or the generating of guaranteed uniform gasket beads and the like
JP2005152826A (ja) * 2003-11-27 2005-06-16 Matsushita Electric Ind Co Ltd 吐出装置および封止装置
JP2006086408A (ja) * 2004-09-17 2006-03-30 Stanley Electric Co Ltd Ｌｅｄ装置
JP2008034443A (ja) * 2006-07-26 2008-02-14 Sharp Corp 樹脂塗布方法および光半導体装置
KR100863203B1 (ko) 2006-09-01 2008-10-13 주식회사 탑 엔지니어링 반도체 소자 제조용 도포장비의 노즐 충돌 인식장치
JP4903179B2 (ja) * 2007-04-23 2012-03-28 サムソン エルイーディー カンパニーリミテッド． 発光装置及びその製造方法
JP2011187810A (ja) * 2010-03-10 2011-09-22 Renesas Electronics Corp 樹脂塗布装置、及び樹脂塗布方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1424772A (zh) * 2001-12-13 2003-06-18 诠兴开发科技股份有限公司 短波长的发光二极管封装方法
CN2537070Y (zh) * 2002-03-18 2003-02-19 佘孝平 拉链式防盗报警器
CN2618683Y (zh) * 2003-05-09 2004-06-02 黄清文 点胶机
CN201067733Y (zh) * 2007-07-06 2008-06-04 周明华 一种点胶机
CN201143480Y (zh) * 2007-09-17 2008-11-05 黄清文 三维自动点胶机
CN201562330U (zh) * 2009-11-11 2010-08-25 连龙 防盗自动报警器

Also Published As

Publication number Publication date
EP2455204A3 (en) 2014-12-24
EP2455204B1 (en) 2016-04-27
US20140014682A1 (en) 2014-01-16
KR20120054954A (ko) 2012-05-31
CN102544257A (zh) 2012-07-04
US20120129281A1 (en) 2012-05-24
US8546153B2 (en) 2013-10-01
KR101743918B1 (ko) 2017-06-07
JP5944142B2 (ja) 2016-07-05
EP2455204A2 (en) 2012-05-23
US9056690B2 (en) 2015-06-16
JP2012114430A (ja) 2012-06-14

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SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: SAMSUNG ELECTRONICS CO., LTD.

Free format text: FORMER OWNER: SAMSUNG LED CO., LTD.

Effective date: 20121122

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20121122

Address after: Gyeonggi Do Korea Suwon

Applicant after: Samsung Electronics Co., Ltd.

Address before: Gyeonggi Do Korea Suwon

Applicant before: Samsung LED Co., Ltd.

C14 Grant of patent or utility model
GR01 Patent grant