KR101729599B1 - 감광성 수지 조성물, 이것을 사용한 패턴의 제조 방법 - Google Patents

감광성 수지 조성물, 이것을 사용한 패턴의 제조 방법 Download PDF

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KR101729599B1
KR101729599B1 KR1020157006313A KR20157006313A KR101729599B1 KR 101729599 B1 KR101729599 B1 KR 101729599B1 KR 1020157006313 A KR1020157006313 A KR 1020157006313A KR 20157006313 A KR20157006313 A KR 20157006313A KR 101729599 B1 KR101729599 B1 KR 101729599B1
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South Korea
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group
resin composition
photosensitive resin
alkyl group
compound
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KR1020157006313A
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English (en)
Korean (ko)
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KR20150043421A (ko
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신지 후지모토
다이스케 카시와기
료 사타케
요시히사 마사키
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후지필름 가부시키가이샤
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/02Monomers containing only one unsaturated aliphatic radical
    • C08F12/04Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F12/14Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing heteroatoms
    • C08F12/22Oxygen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10Esters
    • C08F20/26Esters containing oxygen in addition to the carboxy oxygen
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • H01L51/0015
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/211Changing the shape of the active layer in the devices, e.g. patterning by selective transformation of an existing layer

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Emergency Medicine (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020157006313A 2012-09-28 2013-08-08 감광성 수지 조성물, 이것을 사용한 패턴의 제조 방법 KR101729599B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012217500 2012-09-28
JPJP-P-2012-217500 2012-09-28
PCT/JP2013/071473 WO2014050324A1 (ja) 2012-09-28 2013-08-08 感光性樹脂組成物、これを用いたパターンの製造方法

Publications (2)

Publication Number Publication Date
KR20150043421A KR20150043421A (ko) 2015-04-22
KR101729599B1 true KR101729599B1 (ko) 2017-04-24

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KR1020157006313A KR101729599B1 (ko) 2012-09-28 2013-08-08 감광성 수지 조성물, 이것을 사용한 패턴의 제조 방법

Country Status (5)

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JP (1) JP6096202B2 (ja)
KR (1) KR101729599B1 (ja)
CN (1) CN104662476B (ja)
TW (1) TWI588605B (ja)
WO (1) WO2014050324A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6209617B2 (ja) * 2013-10-28 2017-10-04 富士フイルム株式会社 感光性樹脂組成物、パターンの製造方法、硬化膜、有機el表示装置の製造方法、および液晶表示装置の製造方法
JP6216801B2 (ja) * 2013-10-28 2017-10-18 富士フイルム株式会社 感光性樹脂組成物、パターンの製造方法、硬化膜、有機el表示装置の製造方法、および液晶表示装置の製造方法
JP6783540B2 (ja) * 2015-03-31 2020-11-11 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
TWI696891B (zh) * 2015-12-09 2020-06-21 日商住友化學股份有限公司 光阻組成物及光阻圖案之製造方法
JP6894749B2 (ja) * 2016-07-20 2021-06-30 東京応化工業株式会社 マイクロレンズパターン製造用ポジ型感光性樹脂組成物及びその用途
TWI743132B (zh) * 2016-07-20 2021-10-21 日商東京應化工業股份有限公司 微透鏡圖型製造用正型感光性樹脂組成物及其之用途
JP2020076945A (ja) * 2018-09-21 2020-05-21 旭化成株式会社 感光性樹脂組成物
CN114207525A (zh) * 2019-08-02 2022-03-18 富士胶片株式会社 感光性转印部件、树脂图案的制造方法、电路配线的制造方法、触摸面板的制造方法
JP6827572B2 (ja) * 2020-01-20 2021-02-10 昭和電工株式会社 感光性樹脂組成物、有機el素子隔壁、及び有機el素子
CN113816929A (zh) * 2021-09-29 2021-12-21 西安瑞联新材料股份有限公司 脂肪族环氧化合物及其制备的灌封胶
CN114276239B (zh) * 2021-12-29 2023-10-27 徐州博康信息化学品有限公司 一种含缩酮结构酸敏感光刻胶树脂单体的制备方法
WO2023228661A1 (ja) * 2022-05-24 2023-11-30 日産化学株式会社 薬液耐性保護膜

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010152068A (ja) * 2008-12-25 2010-07-08 Tokyo Ohka Kogyo Co Ltd レジスト組成物、およびレジストパターン形成方法

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JP4979963B2 (ja) * 2006-03-10 2012-07-18 株式会社Adeka 光学材料用硬化性組成物及び光導波路
KR20090010044A (ko) * 2006-05-16 2009-01-28 닛산 가가쿠 고교 가부시키 가이샤 포지티브형 감광성 수지 조성물 및 이로부터 얻어지는 다공질막
JP4403174B2 (ja) * 2006-12-25 2010-01-20 Azエレクトロニックマテリアルズ株式会社 パターン形成方法およびそれに用いる感光性樹脂組成物
TWI431426B (zh) * 2007-03-27 2014-03-21 Fujifilm Corp 正型感光性樹脂組成物及使用它之硬化薄膜形成法
JP2010139171A (ja) * 2008-12-12 2010-06-24 Hitachi Appliances Inc 冷媒圧縮機及び冷凍サイクル装置
JP5486521B2 (ja) * 2010-03-15 2014-05-07 富士フイルム株式会社 ポジ型感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機el表示装置、及び、液晶表示装置
CN102193316B (zh) * 2010-03-15 2015-11-18 富士胶片株式会社 正型感光性树脂组合物、固化膜的形成方法、固化膜、有机el显示装置以及液晶显示装置
JP5495991B2 (ja) * 2010-07-12 2014-05-21 富士フイルム株式会社 着色感光性樹脂組成物、硬化膜及びその製造方法、カラーフィルタ、並びに、表示装置
JP5814012B2 (ja) * 2011-01-19 2015-11-17 富士フイルム株式会社 感光性樹脂組成物、及びパターンの製造方法
JP5468650B2 (ja) * 2011-09-29 2014-04-09 富士フイルム株式会社 感光性樹脂組成物、硬化膜並びにその製造方法

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2010152068A (ja) * 2008-12-25 2010-07-08 Tokyo Ohka Kogyo Co Ltd レジスト組成物、およびレジストパターン形成方法

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Publication number Publication date
CN104662476A (zh) 2015-05-27
KR20150043421A (ko) 2015-04-22
JPWO2014050324A1 (ja) 2016-08-22
TWI588605B (zh) 2017-06-21
JP6096202B2 (ja) 2017-03-15
TW201413379A (zh) 2014-04-01
WO2014050324A1 (ja) 2014-04-03
CN104662476B (zh) 2019-04-23

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