KR101716920B1 - 불활성 기체를 웨이브 납땜 설비에 제공하기 위한 장치 - Google Patents
불활성 기체를 웨이브 납땜 설비에 제공하기 위한 장치 Download PDFInfo
- Publication number
- KR101716920B1 KR101716920B1 KR1020127005429A KR20127005429A KR101716920B1 KR 101716920 B1 KR101716920 B1 KR 101716920B1 KR 1020127005429 A KR1020127005429 A KR 1020127005429A KR 20127005429 A KR20127005429 A KR 20127005429A KR 101716920 B1 KR101716920 B1 KR 101716920B1
- Authority
- KR
- South Korea
- Prior art keywords
- inert gas
- solder bath
- solder
- cover
- wave soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE202009011875U DE202009011875U1 (de) | 2009-09-02 | 2009-09-02 | Vorrichtung zum Zuführen eines Inertgases zu einer Wellenlötanlage |
| DE202009011875.4 | 2009-09-02 | ||
| PCT/EP2010/062355 WO2011026761A1 (en) | 2009-09-02 | 2010-08-24 | Device for supplying an inert gas to a wave soldering installation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120093831A KR20120093831A (ko) | 2012-08-23 |
| KR101716920B1 true KR101716920B1 (ko) | 2017-03-15 |
Family
ID=41397175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127005429A Expired - Fee Related KR101716920B1 (ko) | 2009-09-02 | 2010-08-24 | 불활성 기체를 웨이브 납땜 설비에 제공하기 위한 장치 |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US8403200B2 (enExample) |
| EP (1) | EP2473307B1 (enExample) |
| JP (1) | JP5635099B2 (enExample) |
| KR (1) | KR101716920B1 (enExample) |
| CN (1) | CN102497951B (enExample) |
| BR (1) | BR112012004796A2 (enExample) |
| CA (1) | CA2771165C (enExample) |
| DE (1) | DE202009011875U1 (enExample) |
| DK (1) | DK2473307T3 (enExample) |
| ES (1) | ES2903146T3 (enExample) |
| PL (1) | PL2473307T3 (enExample) |
| WO (1) | WO2011026761A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140027495A1 (en) * | 2012-04-18 | 2014-01-30 | Air Products And Chemicals Inc. | Apparatus And Method For Providing An Inerting Gas During Soldering |
| CN104249208B (zh) | 2013-06-26 | 2018-03-06 | 联想企业解决方案(新加坡)私人有限公司 | 波峰焊装置及其喷嘴 |
| CN104801809B (zh) * | 2014-01-29 | 2018-09-14 | 气体产品与化学公司 | 用于在焊接期间提供惰性气体的设备和方法 |
| CN106334855A (zh) * | 2016-11-17 | 2017-01-18 | 深圳市劲拓自动化设备股份有限公司 | 一种氮气保护装置 |
| DE102017010550A1 (de) * | 2017-11-14 | 2019-05-16 | Roland Barkhoff | Vorrichtung zum thermischen Verschweißen von Kunststoffteilen sowie Anordnung enthaltend eine solche Vorrichtung |
| CN115930104A (zh) * | 2022-11-24 | 2023-04-07 | 宝钢湛江钢铁有限公司 | 一种降低间断性气体用户对系统冲击的自动控制技术 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005115669A2 (en) | 2004-05-24 | 2005-12-08 | Pillarhouse International Limited | Selective soldering apparatus with jet wave solder jet and nitrogen preheat |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2581744A (en) * | 1949-06-02 | 1952-01-08 | William G Zimmerman | Heating and cooling air conditioning system |
| JPS5927771A (ja) * | 1982-08-09 | 1984-02-14 | Hitachi Ltd | 半田付け装置 |
| FR2538209A1 (fr) * | 1982-12-15 | 1984-06-22 | Europ Composants Electron | Dispositif destine a la soudure des connexions de composants |
| JPH01143760A (ja) * | 1987-11-27 | 1989-06-06 | Japan Electron Control Syst Co Ltd | 噴流式自動半田装置 |
| US5121874A (en) | 1989-11-22 | 1992-06-16 | Electrovert Ltd. | Shield gas wave soldering |
| JP3311547B2 (ja) * | 1995-08-02 | 2002-08-05 | 日本電熱計器株式会社 | はんだ付け装置 |
| CN2274540Y (zh) * | 1996-08-19 | 1998-02-18 | 张国琦 | 液态金属软钎接的单/双波峰异步感应式电泵 |
| US6305596B1 (en) * | 1998-06-18 | 2001-10-23 | Asustek Computer Inc. | Apparatus and method for soldering through-hole components on circuit board |
| JP2000071066A (ja) * | 1998-08-28 | 2000-03-07 | Tokyo Seisan Giken Kk | 窒素パッケージ一体型半田槽 |
| JP2002057449A (ja) * | 2000-08-11 | 2002-02-22 | Air Liquide Japan Ltd | ガス供給装置およびハンダ付け装置 |
| JP2004141914A (ja) * | 2002-10-24 | 2004-05-20 | Osaka Asahi Kagaku Kk | はんだ槽 |
| JP2004188449A (ja) * | 2002-12-10 | 2004-07-08 | Matsushita Electric Ind Co Ltd | はんだ槽及びはんだ付け装置 |
| JP2004221326A (ja) * | 2003-01-15 | 2004-08-05 | Tokyo Seisan Giken Kk | 鉛フリーハンダを用いたハンダ付け方法 |
| US20060186183A1 (en) * | 2005-02-18 | 2006-08-24 | Speedline Technologies, Inc. | Wave solder nozzle |
| GB0610679D0 (en) * | 2006-05-30 | 2006-07-12 | Pillarhouse Int Ltd | Soldering apparatus |
| FR2926233B1 (fr) * | 2008-01-10 | 2010-08-13 | Air Liquide | Dispositif d'alimentation en gaz d'une machine de brasage ou etamage a la vague. |
-
2009
- 2009-09-02 DE DE202009011875U patent/DE202009011875U1/de not_active Expired - Lifetime
-
2010
- 2010-08-24 US US13/393,414 patent/US8403200B2/en active Active
- 2010-08-24 JP JP2012527280A patent/JP5635099B2/ja not_active Expired - Fee Related
- 2010-08-24 WO PCT/EP2010/062355 patent/WO2011026761A1/en not_active Ceased
- 2010-08-24 CN CN201080038993.1A patent/CN102497951B/zh active Active
- 2010-08-24 CA CA2771165A patent/CA2771165C/en active Active
- 2010-08-24 KR KR1020127005429A patent/KR101716920B1/ko not_active Expired - Fee Related
- 2010-08-24 EP EP10747453.8A patent/EP2473307B1/en active Active
- 2010-08-24 PL PL10747453T patent/PL2473307T3/pl unknown
- 2010-08-24 DK DK10747453.8T patent/DK2473307T3/da active
- 2010-08-24 ES ES10747453T patent/ES2903146T3/es active Active
- 2010-08-24 BR BR112012004796A patent/BR112012004796A2/pt not_active Application Discontinuation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005115669A2 (en) | 2004-05-24 | 2005-12-08 | Pillarhouse International Limited | Selective soldering apparatus with jet wave solder jet and nitrogen preheat |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2473307B1 (en) | 2021-10-27 |
| KR20120093831A (ko) | 2012-08-23 |
| BR112012004796A2 (pt) | 2016-03-15 |
| DE202009011875U1 (de) | 2009-12-03 |
| ES2903146T3 (es) | 2022-03-31 |
| WO2011026761A1 (en) | 2011-03-10 |
| EP2473307A1 (en) | 2012-07-11 |
| PL2473307T3 (pl) | 2022-02-21 |
| JP5635099B2 (ja) | 2014-12-03 |
| US20120160898A1 (en) | 2012-06-28 |
| CN102497951B (zh) | 2015-09-23 |
| JP2013503749A (ja) | 2013-02-04 |
| CA2771165C (en) | 2017-04-25 |
| US8403200B2 (en) | 2013-03-26 |
| CA2771165A1 (en) | 2011-03-10 |
| CN102497951A (zh) | 2012-06-13 |
| DK2473307T3 (da) | 2022-01-17 |
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St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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