JP5635099B2 - ウェーブソルダリング装置に不活性ガスを供給する装置 - Google Patents

ウェーブソルダリング装置に不活性ガスを供給する装置 Download PDF

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Publication number
JP5635099B2
JP5635099B2 JP2012527280A JP2012527280A JP5635099B2 JP 5635099 B2 JP5635099 B2 JP 5635099B2 JP 2012527280 A JP2012527280 A JP 2012527280A JP 2012527280 A JP2012527280 A JP 2012527280A JP 5635099 B2 JP5635099 B2 JP 5635099B2
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JP
Japan
Prior art keywords
solder
inert gas
solder bath
wave soldering
heat exchangers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012527280A
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English (en)
Japanese (ja)
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JP2013503749A5 (enExample
JP2013503749A (ja
Inventor
ハイネ、フェルナンド
レトゥルム、マルク
Original Assignee
レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード
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Publication of JP2013503749A publication Critical patent/JP2013503749A/ja
Publication of JP2013503749A5 publication Critical patent/JP2013503749A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2012527280A 2009-09-02 2010-08-24 ウェーブソルダリング装置に不活性ガスを供給する装置 Expired - Fee Related JP5635099B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE202009011875U DE202009011875U1 (de) 2009-09-02 2009-09-02 Vorrichtung zum Zuführen eines Inertgases zu einer Wellenlötanlage
DE202009011875.4 2009-09-02
PCT/EP2010/062355 WO2011026761A1 (en) 2009-09-02 2010-08-24 Device for supplying an inert gas to a wave soldering installation

Publications (3)

Publication Number Publication Date
JP2013503749A JP2013503749A (ja) 2013-02-04
JP2013503749A5 JP2013503749A5 (enExample) 2014-08-14
JP5635099B2 true JP5635099B2 (ja) 2014-12-03

Family

ID=41397175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012527280A Expired - Fee Related JP5635099B2 (ja) 2009-09-02 2010-08-24 ウェーブソルダリング装置に不活性ガスを供給する装置

Country Status (12)

Country Link
US (1) US8403200B2 (enExample)
EP (1) EP2473307B1 (enExample)
JP (1) JP5635099B2 (enExample)
KR (1) KR101716920B1 (enExample)
CN (1) CN102497951B (enExample)
BR (1) BR112012004796A2 (enExample)
CA (1) CA2771165C (enExample)
DE (1) DE202009011875U1 (enExample)
DK (1) DK2473307T3 (enExample)
ES (1) ES2903146T3 (enExample)
PL (1) PL2473307T3 (enExample)
WO (1) WO2011026761A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140027495A1 (en) * 2012-04-18 2014-01-30 Air Products And Chemicals Inc. Apparatus And Method For Providing An Inerting Gas During Soldering
CN104249208B (zh) 2013-06-26 2018-03-06 联想企业解决方案（新加坡）私人有限公司 波峰焊装置及其喷嘴
CN104801809B (zh) * 2014-01-29 2018-09-14 气体产品与化学公司 用于在焊接期间提供惰性气体的设备和方法
CN106334855A (zh) * 2016-11-17 2017-01-18 深圳市劲拓自动化设备股份有限公司 一种氮气保护装置
DE102017010550A1 (de) * 2017-11-14 2019-05-16 Roland Barkhoff Vorrichtung zum thermischen Verschweißen von Kunststoffteilen sowie Anordnung enthaltend eine solche Vorrichtung
CN115930104A (zh) * 2022-11-24 2023-04-07 宝钢湛江钢铁有限公司 一种降低间断性气体用户对系统冲击的自动控制技术

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2581744A (en) * 1949-06-02 1952-01-08 William G Zimmerman Heating and cooling air conditioning system
JPS5927771A (ja) * 1982-08-09 1984-02-14 Hitachi Ltd 半田付け装置
FR2538209A1 (fr) * 1982-12-15 1984-06-22 Europ Composants Electron Dispositif destine a la soudure des connexions de composants
JPH01143760A (ja) * 1987-11-27 1989-06-06 Japan Electron Control Syst Co Ltd 噴流式自動半田装置
US5121874A (en) 1989-11-22 1992-06-16 Electrovert Ltd. Shield gas wave soldering
JP3311547B2 (ja) * 1995-08-02 2002-08-05 日本電熱計器株式会社 はんだ付け装置
CN2274540Y (zh) * 1996-08-19 1998-02-18 张国琦 液态金属软钎接的单/双波峰异步感应式电泵
US6305596B1 (en) * 1998-06-18 2001-10-23 Asustek Computer Inc. Apparatus and method for soldering through-hole components on circuit board
JP2000071066A (ja) * 1998-08-28 2000-03-07 Tokyo Seisan Giken Kk 窒素パッケージ一体型半田槽
JP2002057449A (ja) * 2000-08-11 2002-02-22 Air Liquide Japan Ltd ガス供給装置およびハンダ付け装置
JP2004141914A (ja) * 2002-10-24 2004-05-20 Osaka Asahi Kagaku Kk はんだ槽
JP2004188449A (ja) * 2002-12-10 2004-07-08 Matsushita Electric Ind Co Ltd はんだ槽及びはんだ付け装置
JP2004221326A (ja) * 2003-01-15 2004-08-05 Tokyo Seisan Giken Kk 鉛フリーハンダを用いたハンダ付け方法
GB0411573D0 (en) * 2004-05-24 2004-06-23 Pillarhouse Int Ltd Selective soldering apparatus
US20060186183A1 (en) * 2005-02-18 2006-08-24 Speedline Technologies, Inc. Wave solder nozzle
GB0610679D0 (en) * 2006-05-30 2006-07-12 Pillarhouse Int Ltd Soldering apparatus
FR2926233B1 (fr) * 2008-01-10 2010-08-13 Air Liquide Dispositif d'alimentation en gaz d'une machine de brasage ou etamage a la vague.

Also Published As

Publication number Publication date
EP2473307B1 (en) 2021-10-27
KR20120093831A (ko) 2012-08-23
BR112012004796A2 (pt) 2016-03-15
DE202009011875U1 (de) 2009-12-03
ES2903146T3 (es) 2022-03-31
WO2011026761A1 (en) 2011-03-10
EP2473307A1 (en) 2012-07-11
PL2473307T3 (pl) 2022-02-21
KR101716920B1 (ko) 2017-03-15
US20120160898A1 (en) 2012-06-28
CN102497951B (zh) 2015-09-23
JP2013503749A (ja) 2013-02-04
CA2771165C (en) 2017-04-25
US8403200B2 (en) 2013-03-26
CA2771165A1 (en) 2011-03-10
CN102497951A (zh) 2012-06-13
DK2473307T3 (da) 2022-01-17

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