KR101707898B1 - 임프린트 리소그래피 시스템에서 경화를 위한 에너지원 - Google Patents
임프린트 리소그래피 시스템에서 경화를 위한 에너지원 Download PDFInfo
- Publication number
- KR101707898B1 KR101707898B1 KR1020117007990A KR20117007990A KR101707898B1 KR 101707898 B1 KR101707898 B1 KR 101707898B1 KR 1020117007990 A KR1020117007990 A KR 1020117007990A KR 20117007990 A KR20117007990 A KR 20117007990A KR 101707898 B1 KR101707898 B1 KR 101707898B1
- Authority
- KR
- South Korea
- Prior art keywords
- energy
- substrate
- lithography system
- imprint lithography
- template
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
- H10P76/2041—Photolithographic processes
- H10P76/2042—Photolithographic processes using lasers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10433108P | 2008-10-10 | 2008-10-10 | |
| US61/104,331 | 2008-10-10 | ||
| US12/511,593 US8237133B2 (en) | 2008-10-10 | 2009-07-29 | Energy sources for curing in an imprint lithography system |
| US12/511,593 | 2009-07-29 | ||
| PCT/US2009/004454 WO2010042141A2 (en) | 2008-10-10 | 2009-08-04 | Energy sources for curing in an imprint lithography system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110084499A KR20110084499A (ko) | 2011-07-25 |
| KR101707898B1 true KR101707898B1 (ko) | 2017-02-17 |
Family
ID=42098033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117007990A Active KR101707898B1 (ko) | 2008-10-10 | 2009-08-04 | 임프린트 리소그래피 시스템에서 경화를 위한 에너지원 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8237133B2 (https=) |
| JP (1) | JP5802557B2 (https=) |
| KR (1) | KR101707898B1 (https=) |
| MY (1) | MY155087A (https=) |
| TW (1) | TWI426353B (https=) |
| WO (1) | WO2010042141A2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11137679B2 (en) | 2017-09-18 | 2021-10-05 | SK Hynix Inc. | Methods of forming imprinted patterns and imprinting apparatuses used therein |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005003802A1 (de) * | 2004-12-10 | 2006-06-14 | Nütro Maschinen- und Anlagenbau GmbH & Co. KG | Strahlungsgerät sowie Pulverauftragsstation und Anordnung zur Beschichtung von temperatursensiblen Materialien und Verfahren hierzu |
| NL2005254A (en) * | 2009-09-22 | 2011-03-23 | Asml Netherlands Bv | Imprint lithography method and apparatus. |
| JP5366735B2 (ja) * | 2009-09-24 | 2013-12-11 | 東芝機械株式会社 | 転写装置および転写方法 |
| JP5535164B2 (ja) * | 2011-09-22 | 2014-07-02 | 株式会社東芝 | インプリント方法およびインプリント装置 |
| JP6263930B2 (ja) * | 2013-09-30 | 2018-01-24 | 大日本印刷株式会社 | インプリント装置及びインプリント方法 |
| JP6611450B2 (ja) * | 2015-03-31 | 2019-11-27 | キヤノン株式会社 | インプリント装置、インプリント方法、及び物品の製造方法 |
| US10180248B2 (en) | 2015-09-02 | 2019-01-15 | ProPhotonix Limited | LED lamp with sensing capabilities |
| KR102743032B1 (ko) * | 2016-10-14 | 2024-12-17 | 삼성디스플레이 주식회사 | 임프린트용 가압 롤러 및 이를 이용한 임프린트 방법 |
| JP2018125377A (ja) * | 2017-01-31 | 2018-08-09 | 東芝メモリ株式会社 | インプリント装置および半導体装置の製造方法 |
| US10754078B2 (en) | 2018-12-20 | 2020-08-25 | Canon Kabushiki Kaisha | Light source, a shaping system using the light source and an article manufacturing method |
| US11972976B2 (en) | 2021-04-29 | 2024-04-30 | Canon Kabushiki Kaisha | Planarization system, planarization process, and method of manufacturing an article |
| US12027373B2 (en) | 2021-05-28 | 2024-07-02 | Canon Kabushiki Kaisha | Planarization process, planarization system, and method of manufacturing an article |
| JP7746784B2 (ja) * | 2021-10-06 | 2025-10-01 | ウシオ電機株式会社 | 光加熱装置、加熱処理方法 |
| JP7750154B2 (ja) * | 2022-03-28 | 2025-10-07 | ウシオ電機株式会社 | 光加熱装置、加熱処理方法 |
| JP7750120B2 (ja) * | 2022-01-26 | 2025-10-07 | ウシオ電機株式会社 | 光加熱装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006332678A (ja) | 2005-05-27 | 2006-12-07 | Asml Netherlands Bv | インプリントリソグラフィ |
| WO2007123249A2 (en) | 2006-04-18 | 2007-11-01 | Canon Kabushiki Kaisha | Alignment method, imprint method, alignment apparatus, and position measurement method |
| JP2008183810A (ja) | 2007-01-30 | 2008-08-14 | Toshiba Mach Co Ltd | 転写方法及び装置 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6112588A (en) | 1996-10-25 | 2000-09-05 | Speedline Technologies, Inc. | Method and apparatus for measuring the size of drops of a viscous material dispensed from a dispensing system |
| US6204895B1 (en) | 1997-09-30 | 2001-03-20 | Kabushiki Kaisha Toshiba | Display panel associated with light collecting plate and position adjusting method using microlenses for the display panel |
| US5897195A (en) * | 1997-12-09 | 1999-04-27 | Optical Gaging, Products, Inc. | Oblique led illuminator device |
| EP1203264A4 (en) * | 1999-07-01 | 2004-09-15 | DEVICE AND METHOD FOR IMPROVING IMAGE BY SPATIAL FILTERING | |
| US6462818B1 (en) | 2000-06-22 | 2002-10-08 | Kla-Tencor Corporation | Overlay alignment mark design |
| EP1303792B1 (en) | 2000-07-16 | 2012-10-03 | Board Of Regents, The University Of Texas System | High-resolution overlay alignement methods and systems for imprint lithography |
| CN1696826A (zh) | 2000-08-01 | 2005-11-16 | 得克萨斯州大学系统董事会 | 用对激活光透明的模板在衬底上形成图案的方法及半导体器件 |
| US7317531B2 (en) * | 2002-12-05 | 2008-01-08 | Kla-Tencor Technologies Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
| CA2332190A1 (en) * | 2001-01-25 | 2002-07-25 | Efos Inc. | Addressable semiconductor array light source for localized radiation delivery |
| JP4203553B2 (ja) * | 2002-03-26 | 2009-01-07 | 東芝ライテック株式会社 | フラッドライト |
| US6871558B2 (en) * | 2002-12-12 | 2005-03-29 | Molecular Imprints, Inc. | Method for determining characteristics of substrate employing fluid geometries |
| GB0304761D0 (en) * | 2003-03-01 | 2003-04-02 | Integration Technology Ltd | Ultraviolet curing |
| SG147288A1 (en) | 2003-04-29 | 2008-11-28 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method and angular encoder |
| JP2004335808A (ja) * | 2003-05-08 | 2004-11-25 | Sony Corp | パターン転写装置、パターン転写方法およびプログラム |
| JP4481698B2 (ja) * | 2004-03-29 | 2010-06-16 | キヤノン株式会社 | 加工装置 |
| US7309225B2 (en) | 2004-08-13 | 2007-12-18 | Molecular Imprints, Inc. | Moat system for an imprint lithography template |
| US20070231421A1 (en) * | 2006-04-03 | 2007-10-04 | Molecular Imprints, Inc. | Enhanced Multi Channel Alignment |
| US7292326B2 (en) | 2004-11-30 | 2007-11-06 | Molecular Imprints, Inc. | Interferometric analysis for the manufacture of nano-scale devices |
| US7630067B2 (en) | 2004-11-30 | 2009-12-08 | Molecular Imprints, Inc. | Interferometric analysis method for the manufacture of nano-scale devices |
| JP4773729B2 (ja) * | 2005-02-28 | 2011-09-14 | キヤノン株式会社 | 転写装置およびデバイス製造方法 |
| JP2006244710A (ja) * | 2005-02-28 | 2006-09-14 | Sharp Corp | 照明装置 |
| KR101352360B1 (ko) * | 2005-04-27 | 2014-01-15 | 오브듀캇 아베 | 물체에 패턴을 전사하기 위한 수단 |
| US7470921B2 (en) * | 2005-09-20 | 2008-12-30 | Summit Business Products, Inc. | Light-emitting diode device |
| US7677877B2 (en) * | 2005-11-04 | 2010-03-16 | Asml Netherlands B.V. | Imprint lithography |
| US7517211B2 (en) | 2005-12-21 | 2009-04-14 | Asml Netherlands B.V. | Imprint lithography |
| JP2007266308A (ja) * | 2006-03-28 | 2007-10-11 | Toshiba Corp | パターン転写方法、パターン転写装置及び電子デバイスの製造方法 |
| JP2008194838A (ja) * | 2007-02-08 | 2008-08-28 | Sii Nanotechnology Inc | ナノインプリントリソグラフィーのモールド検査方法及び樹脂残渣除去方法 |
| US7841741B2 (en) * | 2007-04-02 | 2010-11-30 | Endicott Interconnect Technologies, Inc. | LED lighting assembly and lamp utilizing same |
| JP4810496B2 (ja) * | 2007-04-25 | 2011-11-09 | 株式会社東芝 | パターン形成装置、パターン形成方法及びテンプレート |
| US8389203B2 (en) * | 2007-05-08 | 2013-03-05 | Esko-Graphics Imaging Gmbh | Exposing printing plates using light emitting diodes |
| WO2009006252A1 (en) * | 2007-07-03 | 2009-01-08 | 3M Innovative Properties Company | Method of forming composite optical film |
| JP2009266901A (ja) * | 2008-04-22 | 2009-11-12 | Sharp Corp | 転写装置、ウエハ状光学装置の製造方法、電子素子ウエハモジュール、センサウエハモジュール、電子素子モジュール、センサモジュールおよび電子情報機器 |
| JP4695679B2 (ja) * | 2008-08-21 | 2011-06-08 | 株式会社東芝 | テンプレートの洗浄方法及びパターン形成方法 |
| JP4892025B2 (ja) * | 2008-09-26 | 2012-03-07 | 株式会社東芝 | インプリント方法 |
-
2009
- 2009-07-29 US US12/511,593 patent/US8237133B2/en active Active
- 2009-07-31 TW TW098125869A patent/TWI426353B/zh active
- 2009-08-04 WO PCT/US2009/004454 patent/WO2010042141A2/en not_active Ceased
- 2009-08-04 JP JP2011531011A patent/JP5802557B2/ja active Active
- 2009-08-04 MY MYPI2011001493A patent/MY155087A/en unknown
- 2009-08-04 KR KR1020117007990A patent/KR101707898B1/ko active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006332678A (ja) | 2005-05-27 | 2006-12-07 | Asml Netherlands Bv | インプリントリソグラフィ |
| WO2007123249A2 (en) | 2006-04-18 | 2007-11-01 | Canon Kabushiki Kaisha | Alignment method, imprint method, alignment apparatus, and position measurement method |
| JP2008183810A (ja) | 2007-01-30 | 2008-08-14 | Toshiba Mach Co Ltd | 転写方法及び装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11137679B2 (en) | 2017-09-18 | 2021-10-05 | SK Hynix Inc. | Methods of forming imprinted patterns and imprinting apparatuses used therein |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201015233A (en) | 2010-04-16 |
| KR20110084499A (ko) | 2011-07-25 |
| US8237133B2 (en) | 2012-08-07 |
| WO2010042141A2 (en) | 2010-04-15 |
| TWI426353B (zh) | 2014-02-11 |
| JP5802557B2 (ja) | 2015-10-28 |
| MY155087A (en) | 2015-08-28 |
| US20100090130A1 (en) | 2010-04-15 |
| JP2012505544A (ja) | 2012-03-01 |
| WO2010042141A3 (en) | 2010-06-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101707898B1 (ko) | 임프린트 리소그래피 시스템에서 경화를 위한 에너지원 | |
| JP5198071B2 (ja) | インプリントリソグラフィ・プロセスにおける熱管理のための露光方法 | |
| US7309225B2 (en) | Moat system for an imprint lithography template | |
| JP5225443B2 (ja) | 回折レンズ構造を形成する方法 | |
| US20200018986A1 (en) | Optical apparatus | |
| US7670529B2 (en) | Method and system for double-sided patterning of substrates | |
| US7136150B2 (en) | Imprint lithography template having opaque alignment marks | |
| WO2009153925A1 (ja) | ナノインプリント方法及び装置 | |
| TW200907587A (en) | Liquid recovery system, immersion exposure apparatus, immersion exposing method, and method for manufacturing device | |
| EP1526411A1 (en) | Apparatus and method for aligning surface | |
| JP7598359B2 (ja) | ウェハプロセス、物品を製造する装置および方法 | |
| US12515946B2 (en) | Imprinting method, pre-processing apparatus, substrate for imprinting, and method for manufacturing substrate | |
| TWI254189B (en) | Lithographic apparatus and device manufacturing method | |
| JPWO2008062836A1 (ja) | 光導波路モジュール及びその製造方法 | |
| TW201007390A (en) | Lithographic apparatus | |
| CN114829987B (zh) | 超透镜的添加式制造 | |
| US8142694B2 (en) | Method for forming an imprint pattern | |
| KR20080114599A (ko) | 액침노광장치 및 디바이스의 제조방법 | |
| WO2020203104A1 (ja) | 計測装置、パターン形成装置および物品の製造方法 | |
| TWI906921B (zh) | 具有抗反射結構之透鏡 | |
| CN106415193A (zh) | 用于在柔性基板上制造微型结构的系统和方法 | |
| Zhu et al. | An ultraviolet micro‐LED array and its application for microlens fabrication | |
| Kim et al. | Intergration of micro-optical elements on an optical fiber tip using DMD-based maskless lithography | |
| KR20230047961A (ko) | 고정밀 나노스케일 박막 제조 공정 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| A201 | Request for examination | ||
| AMND | Amendment | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| AMND | Amendment | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
| X091 | Application refused [patent] | ||
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T13-X000 | Administrative time limit extension granted |
St.27 status event code: U-3-3-T10-T13-oth-X000 |
|
| AMND | Amendment | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PX0901 | Re-examination |
St.27 status event code: A-2-3-E10-E12-rex-PX0901 |
|
| PX0701 | Decision of registration after re-examination |
St.27 status event code: A-3-4-F10-F13-rex-PX0701 |
|
| X701 | Decision to grant (after re-examination) | ||
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| FPAY | Annual fee payment |
Payment date: 20200131 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |