KR101704843B1 - 도포 장치, 도포 방법 및 기억 매체 - Google Patents

도포 장치, 도포 방법 및 기억 매체 Download PDF

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Publication number
KR101704843B1
KR101704843B1 KR1020120041386A KR20120041386A KR101704843B1 KR 101704843 B1 KR101704843 B1 KR 101704843B1 KR 1020120041386 A KR1020120041386 A KR 1020120041386A KR 20120041386 A KR20120041386 A KR 20120041386A KR 101704843 B1 KR101704843 B1 KR 101704843B1
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KR
South Korea
Prior art keywords
substrate
coating
wafer
heating
resist
Prior art date
Application number
KR1020120041386A
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English (en)
Korean (ko)
Other versions
KR20120120485A (ko
Inventor
히사시 가와노
고오스께 요시하라
료오이찌 우에무라
Original Assignee
도쿄엘렉트론가부시키가이샤
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20120120485A publication Critical patent/KR20120120485A/ko
Application granted granted Critical
Publication of KR101704843B1 publication Critical patent/KR101704843B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020120041386A 2011-04-22 2012-04-20 도포 장치, 도포 방법 및 기억 매체 KR101704843B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011095837A JP5655690B2 (ja) 2011-04-22 2011-04-22 塗布装置、塗布方法及び記憶媒体
JPJP-P-2011-095837 2011-04-22

Publications (2)

Publication Number Publication Date
KR20120120485A KR20120120485A (ko) 2012-11-01
KR101704843B1 true KR101704843B1 (ko) 2017-02-08

Family

ID=47277268

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120041386A KR101704843B1 (ko) 2011-04-22 2012-04-20 도포 장치, 도포 방법 및 기억 매체

Country Status (2)

Country Link
JP (1) JP5655690B2 (ja)
KR (1) KR101704843B1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5677603B2 (ja) * 2012-11-26 2015-02-25 東京エレクトロン株式会社 基板洗浄システム、基板洗浄方法および記憶媒体
JP2014110314A (ja) * 2012-11-30 2014-06-12 Sumitomo Electric Ind Ltd 非接触型ウエハ加熱ヒータ
JP6023017B2 (ja) * 2012-12-19 2016-11-09 東京エレクトロン株式会社 基板熱処理装置、基板熱処理方法及び基板熱処理用記録媒体
JP6319705B2 (ja) * 2013-12-14 2018-05-09 木村　光照 スピンコータ
KR102221692B1 (ko) * 2018-10-12 2021-03-03 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP7220968B2 (ja) * 2022-05-02 2023-02-13 中外炉工業株式会社 塗工部周縁処理装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001188357A (ja) 1999-12-28 2001-07-10 Matsushita Electric Ind Co Ltd 表示素子用基板への樹脂膜形成法及び装置、並びに該方法を用いた液晶表示装置の製造方法
JP2005322791A (ja) 2004-05-10 2005-11-17 Toshiba Corp 半導体装置の製造方法、及び塗布装置
JP2010135508A (ja) 2008-12-03 2010-06-17 Tokyo Electron Ltd 基板加熱装置、基板加熱方法及び記憶媒体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61131529A (ja) 1984-11-30 1986-06-19 Nec Corp レジスト塗布方法
JPS62274722A (ja) * 1986-05-23 1987-11-28 Nec Corp レジスト膜の形成方法
KR100811964B1 (ko) * 2000-09-28 2008-03-10 동경 엘렉트론 주식회사 레지스트 패턴 형성장치 및 그 방법
JP2003279245A (ja) * 2002-03-19 2003-10-02 Seiko Epson Corp 塗布膜の乾燥方法及びその装置、デバイスの製造方法、デバイス

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001188357A (ja) 1999-12-28 2001-07-10 Matsushita Electric Ind Co Ltd 表示素子用基板への樹脂膜形成法及び装置、並びに該方法を用いた液晶表示装置の製造方法
JP2005322791A (ja) 2004-05-10 2005-11-17 Toshiba Corp 半導体装置の製造方法、及び塗布装置
JP2010135508A (ja) 2008-12-03 2010-06-17 Tokyo Electron Ltd 基板加熱装置、基板加熱方法及び記憶媒体

Also Published As

Publication number Publication date
KR20120120485A (ko) 2012-11-01
JP2012227461A (ja) 2012-11-15
JP5655690B2 (ja) 2015-01-21

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