KR101667874B1 - 수지 성형 장치 및 수지 성형 방법 - Google Patents

수지 성형 장치 및 수지 성형 방법 Download PDF

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Publication number
KR101667874B1
KR101667874B1 KR1020150036657A KR20150036657A KR101667874B1 KR 101667874 B1 KR101667874 B1 KR 101667874B1 KR 1020150036657 A KR1020150036657 A KR 1020150036657A KR 20150036657 A KR20150036657 A KR 20150036657A KR 101667874 B1 KR101667874 B1 KR 101667874B1
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KR
South Korea
Prior art keywords
suction
gate
flow rate
resin
mold
Prior art date
Application number
KR1020150036657A
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English (en)
Korean (ko)
Other versions
KR20150112809A (ko
Inventor
히로키 오와리
신 다케우치
Original Assignee
토와 가부시기가이샤
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Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20150112809A publication Critical patent/KR20150112809A/ko
Application granted granted Critical
Publication of KR101667874B1 publication Critical patent/KR101667874B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/84—Safety devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76056—Flow rate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76545—Flow rate

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
KR1020150036657A 2014-03-27 2015-03-17 수지 성형 장치 및 수지 성형 방법 KR101667874B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-065401 2014-03-27
JP2014065401A JP6087859B2 (ja) 2014-03-27 2014-03-27 樹脂成形装置及び樹脂成形方法

Publications (2)

Publication Number Publication Date
KR20150112809A KR20150112809A (ko) 2015-10-07
KR101667874B1 true KR101667874B1 (ko) 2016-10-19

Family

ID=54158431

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150036657A KR101667874B1 (ko) 2014-03-27 2015-03-17 수지 성형 장치 및 수지 성형 방법

Country Status (4)

Country Link
JP (1) JP6087859B2 (zh)
KR (1) KR101667874B1 (zh)
CN (1) CN104943111B (zh)
TW (1) TWI559467B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6079925B1 (ja) * 2016-03-30 2017-02-15 第一精工株式会社 樹脂封止装置及び樹脂封止装置の異常検知方法
KR102010895B1 (ko) * 2017-06-20 2019-08-14 최영문 트랜스퍼성형장치
JP6923394B2 (ja) * 2017-08-30 2021-08-18 Ｔｏｗａ株式会社 吸着ハンド、搬送機構、樹脂成形装置、搬送方法および樹脂成形品の製造方法
JP2019059030A (ja) * 2017-09-25 2019-04-18 日本電産株式会社 射出成形装置及び射出成形装置監視システム
JP7240339B2 (ja) * 2020-01-20 2023-03-15 Ｔｏｗａ株式会社 樹脂成形品の製造方法及び樹脂成形装置
CN112802776B (zh) * 2020-12-31 2023-10-20 苏州首肯机械有限公司 伺服半导体封装压机智能化压力控制系统及控制方法
CN114131861B (zh) * 2021-12-20 2023-03-24 江苏国诺精密科技有限公司 一种注射器针筒注塑模具

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2680891B2 (ja) * 1989-04-28 1997-11-19 三田工業株式会社 樹脂成形金型のゲートづまり検出装置
JP2571719Y2 (ja) 1993-09-16 1998-05-18 住友精密工業株式会社 半導体モールド成形用ワーク取り出し装置
JP2010105326A (ja) 2008-10-31 2010-05-13 Towa Corp 基板の装着・取出方法及び装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536655Y2 (zh) * 1988-02-29 1993-09-16
JPH07102588B2 (ja) * 1988-04-15 1995-11-08 大日本印刷株式会社 絵付成形品の製造方法
JP2571719B2 (ja) * 1990-06-30 1997-01-16 株式会社アルファ ステアリングロック装置
JPH07135232A (ja) * 1993-11-11 1995-05-23 Toshiba Corp 半導体モールド装置
JPH1119970A (ja) * 1997-07-08 1999-01-26 Mitsui Chem Inc 射出成形におけるゲート詰まり防止方法およびその実施のための射出成形用金型装置
KR100244966B1 (ko) * 1997-12-30 2000-03-02 윤종용 공기 유입구가 형성된 절단 펀치를 포함하는 게이트 잔여물절단 장치
JP4009463B2 (ja) * 2002-01-31 2007-11-14 第一精工株式会社 樹脂成形装置のクリーニング装置およびそのクリーニング方法
JP2003266480A (ja) * 2002-03-15 2003-09-24 Mitsubishi Materials Corp 射出成形方法
JP4383105B2 (ja) * 2003-06-30 2009-12-16 第一精工株式会社 樹脂封止装置
JP2007001197A (ja) * 2005-06-24 2007-01-11 Gifu Plast Ind Co Ltd 合成樹脂射出成形品の成形方法及び射出成形金型装置
JP2007283505A (ja) * 2006-04-12 2007-11-01 Kanto Itami Denki Kk 金型及びゲート残り防止方法
JP5039443B2 (ja) * 2007-06-18 2012-10-03 アピックヤマダ株式会社 トランスファ成型装置および半導体装置の製造方法
CN102171801B (zh) * 2008-09-30 2013-10-16 东和株式会社 电子元器件的压缩树脂密封成形方法及采用该方法的装置
JP2012196870A (ja) * 2011-03-22 2012-10-18 Nec Corp 樹脂詰まり検出装置および樹脂詰まり検出方法
US9254596B2 (en) * 2011-12-29 2016-02-09 Stmicroelectronics Pte Ltd. Top gate mold with particle trap

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2680891B2 (ja) * 1989-04-28 1997-11-19 三田工業株式会社 樹脂成形金型のゲートづまり検出装置
JP2571719Y2 (ja) 1993-09-16 1998-05-18 住友精密工業株式会社 半導体モールド成形用ワーク取り出し装置
JP2010105326A (ja) 2008-10-31 2010-05-13 Towa Corp 基板の装着・取出方法及び装置

Also Published As

Publication number Publication date
JP6087859B2 (ja) 2017-03-01
CN104943111A (zh) 2015-09-30
JP2015186885A (ja) 2015-10-29
CN104943111B (zh) 2017-06-09
TWI559467B (zh) 2016-11-21
KR20150112809A (ko) 2015-10-07
TW201545287A (zh) 2015-12-01

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