JP6087859B2 - 樹脂成形装置及び樹脂成形方法 - Google Patents

樹脂成形装置及び樹脂成形方法 Download PDF

Info

Publication number
JP6087859B2
JP6087859B2 JP2014065401A JP2014065401A JP6087859B2 JP 6087859 B2 JP6087859 B2 JP 6087859B2 JP 2014065401 A JP2014065401 A JP 2014065401A JP 2014065401 A JP2014065401 A JP 2014065401A JP 6087859 B2 JP6087859 B2 JP 6087859B2
Authority
JP
Japan
Prior art keywords
suction
gate
flow rate
resin
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014065401A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015186885A (ja
Inventor
弘樹 尾張
弘樹 尾張
竹内　慎
慎 竹内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2014065401A priority Critical patent/JP6087859B2/ja
Priority to TW104107841A priority patent/TWI559467B/zh
Priority to CN201510113380.4A priority patent/CN104943111B/zh
Priority to KR1020150036657A priority patent/KR101667874B1/ko
Publication of JP2015186885A publication Critical patent/JP2015186885A/ja
Application granted granted Critical
Publication of JP6087859B2 publication Critical patent/JP6087859B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2014065401A 2014-03-27 2014-03-27 樹脂成形装置及び樹脂成形方法 Active JP6087859B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014065401A JP6087859B2 (ja) 2014-03-27 2014-03-27 樹脂成形装置及び樹脂成形方法
TW104107841A TWI559467B (zh) 2014-03-27 2015-03-12 Resin forming apparatus and resin forming method
CN201510113380.4A CN104943111B (zh) 2014-03-27 2015-03-16 树脂成型装置及树脂成型方法
KR1020150036657A KR101667874B1 (ko) 2014-03-27 2015-03-17 수지 성형 장치 및 수지 성형 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014065401A JP6087859B2 (ja) 2014-03-27 2014-03-27 樹脂成形装置及び樹脂成形方法

Publications (2)

Publication Number Publication Date
JP2015186885A JP2015186885A (ja) 2015-10-29
JP6087859B2 true JP6087859B2 (ja) 2017-03-01

Family

ID=54158431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014065401A Active JP6087859B2 (ja) 2014-03-27 2014-03-27 樹脂成形装置及び樹脂成形方法

Country Status (4)

Country Link
JP (1) JP6087859B2 (zh)
KR (1) KR101667874B1 (zh)
CN (1) CN104943111B (zh)
TW (1) TWI559467B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6079925B1 (ja) * 2016-03-30 2017-02-15 第一精工株式会社 樹脂封止装置及び樹脂封止装置の異常検知方法
KR102010895B1 (ko) * 2017-06-20 2019-08-14 최영문 트랜스퍼성형장치
JP6923394B2 (ja) * 2017-08-30 2021-08-18 Ｔｏｗａ株式会社 吸着ハンド、搬送機構、樹脂成形装置、搬送方法および樹脂成形品の製造方法
JP2019059030A (ja) * 2017-09-25 2019-04-18 日本電産株式会社 射出成形装置及び射出成形装置監視システム
JP7240339B2 (ja) * 2020-01-20 2023-03-15 Ｔｏｗａ株式会社 樹脂成形品の製造方法及び樹脂成形装置
CN112802776B (zh) * 2020-12-31 2023-10-20 苏州首肯机械有限公司 伺服半导体封装压机智能化压力控制系统及控制方法
CN114131861B (zh) * 2021-12-20 2023-03-24 江苏国诺精密科技有限公司 一种注射器针筒注塑模具

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536655Y2 (zh) * 1988-02-29 1993-09-16
JPH07102588B2 (ja) * 1988-04-15 1995-11-08 大日本印刷株式会社 絵付成形品の製造方法
JP2680891B2 (ja) * 1989-04-28 1997-11-19 三田工業株式会社 樹脂成形金型のゲートづまり検出装置
JP2571719B2 (ja) * 1990-06-30 1997-01-16 株式会社アルファ ステアリングロック装置
JP2571719Y2 (ja) 1993-09-16 1998-05-18 住友精密工業株式会社 半導体モールド成形用ワーク取り出し装置
JPH07135232A (ja) * 1993-11-11 1995-05-23 Toshiba Corp 半導体モールド装置
JPH1119970A (ja) * 1997-07-08 1999-01-26 Mitsui Chem Inc 射出成形におけるゲート詰まり防止方法およびその実施のための射出成形用金型装置
KR100244966B1 (ko) * 1997-12-30 2000-03-02 윤종용 공기 유입구가 형성된 절단 펀치를 포함하는 게이트 잔여물절단 장치
JP4009463B2 (ja) * 2002-01-31 2007-11-14 第一精工株式会社 樹脂成形装置のクリーニング装置およびそのクリーニング方法
JP2003266480A (ja) * 2002-03-15 2003-09-24 Mitsubishi Materials Corp 射出成形方法
JP4383105B2 (ja) * 2003-06-30 2009-12-16 第一精工株式会社 樹脂封止装置
JP2007001197A (ja) * 2005-06-24 2007-01-11 Gifu Plast Ind Co Ltd 合成樹脂射出成形品の成形方法及び射出成形金型装置
JP2007283505A (ja) * 2006-04-12 2007-11-01 Kanto Itami Denki Kk 金型及びゲート残り防止方法
JP5039443B2 (ja) * 2007-06-18 2012-10-03 アピックヤマダ株式会社 トランスファ成型装置および半導体装置の製造方法
US20110233821A1 (en) * 2008-09-30 2011-09-29 Towa Corporation Compression resin sealing and molding method for electronic component and apparatus therefor
JP5156579B2 (ja) 2008-10-31 2013-03-06 Ｔｏｗａ株式会社 基板の装着・取出装置
JP2012196870A (ja) * 2011-03-22 2012-10-18 Nec Corp 樹脂詰まり検出装置および樹脂詰まり検出方法
US9254596B2 (en) * 2011-12-29 2016-02-09 Stmicroelectronics Pte Ltd. Top gate mold with particle trap

Also Published As

Publication number Publication date
KR20150112809A (ko) 2015-10-07
KR101667874B1 (ko) 2016-10-19
TW201545287A (zh) 2015-12-01
CN104943111A (zh) 2015-09-30
JP2015186885A (ja) 2015-10-29
CN104943111B (zh) 2017-06-09
TWI559467B (zh) 2016-11-21

Similar Documents

Publication Publication Date Title
JP6087859B2 (ja) 樹脂成形装置及び樹脂成形方法
TWI745535B (zh) 樹脂成形模具及樹脂成形裝置
JP2014192362A (ja) 成形品生産装置、成形品生産方法、及び成形品
TWI679096B (zh) 將一載體與電子元件至少部分封裝之模具及封裝之成型裝置及封裝之方法
JP6423677B2 (ja) 成形金型、成形装置および成形品の製造方法
JP4954171B2 (ja) 電子部品の圧縮樹脂封止成形方法及び装置
KR20060070141A (ko) 클리닝 핀을 갖는 반도체 칩 패키지 몰딩 장치
JP5153548B2 (ja) 樹脂封止成形用型の加熱冷却装置
JP6676726B1 (ja) 樹脂封止システム
WO2023067849A1 (ja) 樹脂成形装置、及び樹脂成形品の製造方法
JP4954172B2 (ja) 電子部品の圧縮樹脂封止成形方法
JP5128430B2 (ja) 下型キャビティ面への離型フイルム装着方法及び装置
TWI834055B (zh) 樹脂成形裝置及樹脂成形品的製造方法
JP2010082889A (ja) 液状樹脂材料供給用のゲートノズル
KR100686960B1 (ko) 렌즈 일체형 엘이디의 렌즈 성형 방법 및 렌즈 성형 장치
JP5153549B2 (ja) 基板供給等の共用作業体
JP5192968B2 (ja) 圧縮樹脂封止成形に用いられる液状樹脂材料の供給装置
KR100624334B1 (ko) 반도체 패키지 성형 공정에서의 리드 프레임 공급 불량감지 방법
JP3826710B2 (ja) 封止成形装置
WO2022224487A1 (ja) 成形型、樹脂成形装置及び樹脂成形品の製造方法
JPH058253A (ja) 電子部品の樹脂封止成形装置
KR20110005548A (ko) 전자부품 제조용 몰딩장치
JP2015030235A (ja) 樹脂封止金型、樹脂封止方法、および樹脂封止金型のクリーニング方法
JPH05104562A (ja) 半導体装置の製造装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160324

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20161220

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170110

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170202

R150 Certificate of patent or registration of utility model

Ref document number: 6087859

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250