KR101643502B1 - 절단 장치 및 절단 방법 - Google Patents

절단 장치 및 절단 방법 Download PDF

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Publication number
KR101643502B1
KR101643502B1 KR1020150094522A KR20150094522A KR101643502B1 KR 101643502 B1 KR101643502 B1 KR 101643502B1 KR 1020150094522 A KR1020150094522 A KR 1020150094522A KR 20150094522 A KR20150094522 A KR 20150094522A KR 101643502 B1 KR101643502 B1 KR 101643502B1
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KR
South Korea
Prior art keywords
cutting
water
flow rate
condition
cut
Prior art date
Application number
KR1020150094522A
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English (en)
Korean (ko)
Other versions
KR20160010309A (ko
Inventor
유야 이즈미
이치로 이마이
간지 이시바시
Original Assignee
토와 가부시기가이샤
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Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20160010309A publication Critical patent/KR20160010309A/ko
Application granted granted Critical
Publication of KR101643502B1 publication Critical patent/KR101643502B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/98—Methods for disconnecting semiconductor or solid-state bodies
KR1020150094522A 2014-07-18 2015-07-02 절단 장치 및 절단 방법 KR101643502B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-147250 2014-07-18
JP2014147250A JP6333650B2 (ja) 2014-07-18 2014-07-18 切断装置及び切断方法

Publications (2)

Publication Number Publication Date
KR20160010309A KR20160010309A (ko) 2016-01-27
KR101643502B1 true KR101643502B1 (ko) 2016-07-27

Family

ID=55149324

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150094522A KR101643502B1 (ko) 2014-07-18 2015-07-02 절단 장치 및 절단 방법

Country Status (4)

Country Link
JP (1) JP6333650B2 (ja)
KR (1) KR101643502B1 (ja)
CN (1) CN105280526B (ja)
TW (1) TWI641037B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018058130A (ja) * 2016-10-03 2018-04-12 Ｔｏｗａ株式会社 円板状の回転刃、切削装置、及び、円板状の回転刃の製造方法
JP6955971B2 (ja) * 2017-11-10 2021-10-27 株式会社ディスコ 洗浄ノズル
JP2023101881A (ja) * 2022-01-11 2023-07-24 Ｔｏｗａ株式会社 切断装置、及び切断品の製造方法
CN117381629B (zh) * 2023-12-12 2024-02-06 泰州市江洲数控机床制造有限公司 一种磁控式往复式砂线切割机

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014108491A (ja) 2012-12-03 2014-06-12 Towa Corp 電子部品製造用の切断装置及び切断方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2893641B2 (ja) * 1993-12-16 1999-05-24 株式会社東京精密 ダイシング装置
JP2576421B2 (ja) * 1994-09-30 1997-01-29 日本電気株式会社 ダイシング装置
JP3482157B2 (ja) * 1999-06-02 2003-12-22 シャープ株式会社 半導体ウエハのダイシング方法および半導体ウエハのダイシング装置
JP2001196282A (ja) * 2000-01-13 2001-07-19 Hitachi Ltd 半導体装置及びその製造方法
JP3608152B2 (ja) * 2000-05-26 2005-01-05 ホーコス株式会社 切削液自動供給装置
JP2002075919A (ja) * 2000-08-30 2002-03-15 Sharp Corp 半導体ウエハのダイシング方法
JP2002313753A (ja) * 2001-04-19 2002-10-25 Tokyo Seimitsu Co Ltd ダイシング装置の切削水供給管理装置
JP4796271B2 (ja) * 2003-07-10 2011-10-19 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2006231474A (ja) * 2005-02-25 2006-09-07 Disco Abrasive Syst Ltd 切削装置
JP4777072B2 (ja) * 2006-01-11 2011-09-21 株式会社東京精密 ダイシング装置
JP2007329263A (ja) * 2006-06-07 2007-12-20 Disco Abrasive Syst Ltd ウエーハの切削方法
JP5511154B2 (ja) * 2008-06-13 2014-06-04 Ｔｏｗａ株式会社 電子部品製造用の個片化装置及び個片化方法
KR20100082550A (ko) * 2009-01-09 2010-07-19 (주)캠시스 워터젯 싱귤레이션 장치 및 그의 워터젯 커팅 방법
JP5757806B2 (ja) * 2011-06-30 2015-08-05 株式会社ディスコ 被加工物の切削方法
JP5291178B2 (ja) * 2011-12-26 2013-09-18 株式会社ディスコ 切削装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014108491A (ja) 2012-12-03 2014-06-12 Towa Corp 電子部品製造用の切断装置及び切断方法

Also Published As

Publication number Publication date
TWI641037B (zh) 2018-11-11
TW201608629A (zh) 2016-03-01
JP6333650B2 (ja) 2018-05-30
CN105280526B (zh) 2018-04-10
JP2016025166A (ja) 2016-02-08
KR20160010309A (ko) 2016-01-27
CN105280526A (zh) 2016-01-27

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