KR101635165B1 - 표시 장치 및 그 제조 방법 - Google Patents

표시 장치 및 그 제조 방법 Download PDF

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Publication number
KR101635165B1
KR101635165B1 KR1020080127126A KR20080127126A KR101635165B1 KR 101635165 B1 KR101635165 B1 KR 101635165B1 KR 1020080127126 A KR1020080127126 A KR 1020080127126A KR 20080127126 A KR20080127126 A KR 20080127126A KR 101635165 B1 KR101635165 B1 KR 101635165B1
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KR
South Korea
Prior art keywords
layer
insulating film
electrode
contact portion
delete delete
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KR1020080127126A
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English (en)
Korean (ko)
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KR20090066223A (ko
Inventor
나오키 하야시
야스노부 히로마스
히로후미 후지오카
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소니 주식회사
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Application filed by 소니 주식회사 filed Critical 소니 주식회사
Publication of KR20090066223A publication Critical patent/KR20090066223A/ko
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Publication of KR101635165B1 publication Critical patent/KR101635165B1/ko

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80522—Cathodes combined with auxiliary electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020080127126A 2007-12-18 2008-12-15 표시 장치 및 그 제조 방법 KR101635165B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007326595 2007-12-18
JPJP-P-2007-326595 2007-12-18
JPJP-P-2008-123004 2008-05-09
JP2008123004A JP4600786B2 (ja) 2007-12-18 2008-05-09 表示装置およびその製造方法

Publications (2)

Publication Number Publication Date
KR20090066223A KR20090066223A (ko) 2009-06-23
KR101635165B1 true KR101635165B1 (ko) 2016-06-30

Family

ID=40805831

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080127126A KR101635165B1 (ko) 2007-12-18 2008-12-15 표시 장치 및 그 제조 방법

Country Status (3)

Country Link
JP (1) JP4600786B2 (zh)
KR (1) KR101635165B1 (zh)
CN (1) CN101465368B (zh)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI555436B (zh) * 2011-04-08 2016-10-21 半導體能源研究所股份有限公司 發光裝置及其製造方法
US8912547B2 (en) * 2012-01-20 2014-12-16 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, display device, and semiconductor device
TWI479948B (zh) * 2012-02-29 2015-04-01 Innocom Tech Shenzhen Co Ltd 顯示面板及顯示裝置
US9178174B2 (en) * 2012-03-27 2015-11-03 Sony Corporation Display device and method of manufacturing the same, method of repairing display device, and electronic apparatus
JP5954162B2 (ja) * 2012-03-28 2016-07-20 ソニー株式会社 表示装置の製造方法
KR101930847B1 (ko) * 2012-05-16 2018-12-20 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조방법
KR20130128940A (ko) * 2012-05-18 2013-11-27 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조방법
KR102132884B1 (ko) * 2013-05-21 2020-07-13 삼성디스플레이 주식회사 유기발광 디스플레이 장치 및 그 제조방법
KR102155370B1 (ko) * 2013-12-02 2020-09-22 삼성디스플레이 주식회사 유기 발광 표시장치 및 그의 제조방법
KR102164949B1 (ko) 2014-03-25 2020-10-14 삼성디스플레이 주식회사 표시 장치, 이의 제조 방법 및 리페어 방법
KR102315824B1 (ko) * 2014-06-27 2021-10-20 엘지디스플레이 주식회사 유기 발광 표시 장치 및 그의 제조 방법
JP2016062885A (ja) * 2014-09-22 2016-04-25 ソニー株式会社 表示装置およびその製造方法、ならびに電子機器
KR102320591B1 (ko) * 2014-10-30 2021-11-03 엘지디스플레이 주식회사 유기전계발광표시장치와 이의 제조방법
KR102374833B1 (ko) * 2014-11-25 2022-03-15 엘지디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR102426691B1 (ko) * 2015-02-05 2022-07-28 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
JP6457879B2 (ja) * 2015-04-22 2019-01-23 株式会社ジャパンディスプレイ 表示装置及びその製造方法
KR102465826B1 (ko) * 2015-10-29 2022-11-09 엘지디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR102578834B1 (ko) * 2015-11-30 2023-09-15 엘지디스플레이 주식회사 유기 발광 표시 장치
JP6676998B2 (ja) * 2016-02-10 2020-04-08 セイコーエプソン株式会社 電気光学装置、および電子機器
KR101878187B1 (ko) * 2016-07-29 2018-07-13 엘지디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR20180046229A (ko) * 2016-10-27 2018-05-08 엘지디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR102410500B1 (ko) * 2017-11-30 2022-06-16 엘지디스플레이 주식회사 전계 발광 표시장치
JP7179517B2 (ja) * 2018-03-01 2022-11-29 Ｔｉａｎｍａ Ｊａｐａｎ株式会社 表示装置
CN113284921B (zh) * 2020-02-19 2023-05-09 合肥鑫晟光电科技有限公司 阵列基板及显示装置
CN114141826B (zh) * 2021-11-16 2023-08-01 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005011810A (ja) * 2003-06-16 2005-01-13 Eastman Kodak Co 上面発光型ｏｌｅｄデバイスの製造方法
JP2006113571A (ja) * 2004-09-15 2006-04-27 Semiconductor Energy Lab Co Ltd 半導体装置
JP2007141844A (ja) * 2005-11-15 2007-06-07 Samsung Electronics Co Ltd 表示装置とその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4165145B2 (ja) * 2002-08-07 2008-10-15 株式会社日立製作所 有機発光表示装置
CN102544027B (zh) * 2004-09-15 2016-02-17 株式会社半导体能源研究所 半导体器件
JP2007287354A (ja) * 2006-04-12 2007-11-01 Hitachi Displays Ltd 有機ｅｌ表示装置
KR101386055B1 (ko) * 2006-06-19 2014-04-16 소니 주식회사 발광 표시 장치 및 그 제조 방법
KR100875103B1 (ko) * 2007-11-16 2008-12-19 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005011810A (ja) * 2003-06-16 2005-01-13 Eastman Kodak Co 上面発光型ｏｌｅｄデバイスの製造方法
JP2006113571A (ja) * 2004-09-15 2006-04-27 Semiconductor Energy Lab Co Ltd 半導体装置
JP2007141844A (ja) * 2005-11-15 2007-06-07 Samsung Electronics Co Ltd 表示装置とその製造方法

Also Published As

Publication number Publication date
KR20090066223A (ko) 2009-06-23
JP4600786B2 (ja) 2010-12-15
JP2009170395A (ja) 2009-07-30
CN101465368A (zh) 2009-06-24
CN101465368B (zh) 2011-07-27

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