KR101633517B1 - 기판 처리 시스템 - Google Patents

기판 처리 시스템 Download PDF

Info

Publication number
KR101633517B1
KR101633517B1 KR1020100016027A KR20100016027A KR101633517B1 KR 101633517 B1 KR101633517 B1 KR 101633517B1 KR 1020100016027 A KR1020100016027 A KR 1020100016027A KR 20100016027 A KR20100016027 A KR 20100016027A KR 101633517 B1 KR101633517 B1 KR 101633517B1
Authority
KR
South Korea
Prior art keywords
sheet
substrate
transfer
wafer
processing system
Prior art date
Application number
KR1020100016027A
Other languages
English (en)
Korean (ko)
Other versions
KR20100097037A (ko
Inventor
야스시 하야시다
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20100097037A publication Critical patent/KR20100097037A/ko
Application granted granted Critical
Publication of KR101633517B1 publication Critical patent/KR101633517B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G15/00—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
    • B65G15/30—Belts or like endless load-carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020100016027A 2009-02-24 2010-02-23 기판 처리 시스템 KR101633517B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-040157 2009-02-24
JP2009040157A JP4756076B2 (ja) 2009-02-24 2009-02-24 基板処理システム

Publications (2)

Publication Number Publication Date
KR20100097037A KR20100097037A (ko) 2010-09-02
KR101633517B1 true KR101633517B1 (ko) 2016-06-24

Family

ID=42823631

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100016027A KR101633517B1 (ko) 2009-02-24 2010-02-23 기판 처리 시스템

Country Status (2)

Country Link
JP (1) JP4756076B2 (ja)
KR (1) KR101633517B1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012073522A1 (ja) * 2010-12-03 2012-06-07 シャープ株式会社 基板処理装置及び基板処理方法
CN103380483B (zh) * 2011-04-25 2016-11-02 株式会社尼康 基板处理装置
KR102019779B1 (ko) * 2011-11-15 2019-09-09 세메스 주식회사 기판 처리 장치
KR102654241B1 (ko) * 2019-01-16 2024-04-02 어플라이드 머티어리얼스, 인코포레이티드 기판 프로세싱 시스템, 진공 프로세싱 시스템을 위한 기판 챔버, 및 기판을 냉각하는 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007048929A (ja) * 2005-08-10 2007-02-22 Tokyo Electron Ltd 塗布処理装置および塗布処理方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62129846A (ja) * 1985-12-02 1987-06-12 Dainippon Screen Mfg Co Ltd フオトレジストの塗布方法及び塗布装置
DE59006753D1 (de) * 1989-06-16 1994-09-15 Atotech Deutschland Gmbh Verfahren zum Behandeln von stückförmigen Teilen in Durchlaufanlagen, sowie Vorrichtung zur Durchfürung dieses Verfahrens.
JPH113924A (ja) * 1997-06-10 1999-01-06 Dainippon Screen Mfg Co Ltd 直線駆動装置およびそれを備えた基板搬送装置
JP3596312B2 (ja) * 1998-10-27 2004-12-02 松下電器産業株式会社 熱処理装置
JP2004210440A (ja) * 2002-12-27 2004-07-29 Ishikawajima Harima Heavy Ind Co Ltd 板状体の搬送装置
JP4955976B2 (ja) 2005-01-21 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4652250B2 (ja) * 2006-02-24 2011-03-16 東京エレクトロン株式会社 現像処理装置、現像処理方法、コンピュータ読取可能な記憶媒体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007048929A (ja) * 2005-08-10 2007-02-22 Tokyo Electron Ltd 塗布処理装置および塗布処理方法

Also Published As

Publication number Publication date
JP4756076B2 (ja) 2011-08-24
KR20100097037A (ko) 2010-09-02
JP2010199170A (ja) 2010-09-09

Similar Documents

Publication Publication Date Title
JP4745040B2 (ja) 基板搬送装置及び基板処理装置
JP4312787B2 (ja) 減圧乾燥装置
KR101516819B1 (ko) 기판의 처리 장치
JP4954162B2 (ja) 処理システム
JP5237176B2 (ja) 基板処理装置及び基板処理方法
KR20100007725A (ko) 기판 처리 장치
JP2011009362A (ja) インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体
JP5274148B2 (ja) 処理システム
KR20090030231A (ko) 상압 건조 장치 및 기판 처리 장치 및 기판 처리 방법
JP5025231B2 (ja) 基板搬送処理装置
KR101633517B1 (ko) 기판 처리 시스템
KR20090031271A (ko) 상압 건조 장치 및 기판 처리 장치 및 기판 처리 방법
KR20090031823A (ko) 상압 건조장치 및 기판처리장치 및 기판처리방법
KR101300853B1 (ko) 기판 반송 시스템, 기판 반송 장치 및 기판 처리 장치
JP4593461B2 (ja) 基板搬送システム
TW200537585A (en) Coating film forming apparatus
TW529072B (en) Lift-type substrate treatment device, and substrate treatment system with the substrate treatment device
JP2007173365A (ja) 塗布乾燥処理システム及び塗布乾燥処理方法
JP4476101B2 (ja) 基板処理装置及び平流し型基板搬送装置
KR101452543B1 (ko) 기판 처리 시스템
WO2010150740A1 (ja) テンプレート処理装置、インプリントシステム、テンプレート処理方法及びコンピュータ記憶媒体
KR20110066864A (ko) 기판처리장치, 기판처리방법 및 이 기판처리방법을 실행시키기 위한 프로그램을 기록한 기록매체
JP5108834B2 (ja) テンプレート処理装置、インプリントシステム、離型剤処理方法、プログラム及びコンピュータ記憶媒体
JP2002324740A (ja) 処理装置
KR101255718B1 (ko) 기판처리시스템 및 이를 이용한 기판처리방법

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20190530

Year of fee payment: 4