KR101617493B1 - 연마 장치 - Google Patents

연마 장치 Download PDF

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Publication number
KR101617493B1
KR101617493B1 KR1020130003284A KR20130003284A KR101617493B1 KR 101617493 B1 KR101617493 B1 KR 101617493B1 KR 1020130003284 A KR1020130003284 A KR 1020130003284A KR 20130003284 A KR20130003284 A KR 20130003284A KR 101617493 B1 KR101617493 B1 KR 101617493B1
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KR
South Korea
Prior art keywords
polishing
head cover
dresser
head
polishing apparatus
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KR1020130003284A
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English (en)
Korean (ko)
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KR20130083406A (ko
Inventor
류이치 고스게
다다카즈 소네
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20130083406A publication Critical patent/KR20130083406A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020130003284A 2012-01-12 2013-01-11 연마 장치 Active KR101617493B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012003870A JP5844163B2 (ja) 2012-01-12 2012-01-12 研磨装置
JPJP-P-2012-003870 2012-01-12

Publications (2)

Publication Number Publication Date
KR20130083406A KR20130083406A (ko) 2013-07-22
KR101617493B1 true KR101617493B1 (ko) 2016-05-02

Family

ID=48945959

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130003284A Active KR101617493B1 (ko) 2012-01-12 2013-01-11 연마 장치

Country Status (4)

Country Link
US (1) US9028297B2 (https=)
JP (1) JP5844163B2 (https=)
KR (1) KR101617493B1 (https=)
TW (1) TWI535528B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3740982A1 (de) 1987-12-03 1989-06-15 Babcock Werke Ag Vorrichtung zum reinigen von rohren
CN104742008B (zh) * 2013-12-27 2017-03-22 中芯国际集成电路制造(上海)有限公司 化学机械研磨方法及化学机械研磨装置
JP6342198B2 (ja) * 2014-03-31 2018-06-13 株式会社荏原製作所 研磨装置の構成部品用のカバー、研磨装置の構成部品、および、研磨装置
US10576604B2 (en) * 2014-04-30 2020-03-03 Ebara Corporation Substrate polishing apparatus
CN104117898B (zh) * 2014-07-02 2016-08-17 吴志坚 艺术抛光工具
KR102177123B1 (ko) * 2014-08-28 2020-11-11 삼성전자주식회사 화학적 기계적 연마 장치
CN106272038A (zh) * 2015-06-04 2017-01-04 有研半导体材料有限公司 一种硅片抛光机边缘导轮
JP7220648B2 (ja) * 2019-12-20 2023-02-10 株式会社荏原製作所 基板処理装置および基板処理方法
CN112720247B (zh) * 2020-12-30 2022-04-19 合肥晶合集成电路股份有限公司 一种化学机械平坦化设备及其应用
CN117067101A (zh) * 2023-08-22 2023-11-17 西可装备制造(衡阳)有限公司 一种研磨摆动机构及研磨抛光机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002525885A (ja) * 1998-09-29 2002-08-13 アプライド マテリアルズ インコーポレイテッド 化学的機械研磨用コンディショナ
JP2007313644A (ja) * 1999-05-17 2007-12-06 Ebara Corp ドレッシング装置

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Publication number Priority date Publication date Assignee Title
FR2649439B1 (fr) 1989-07-07 1991-09-20 Ferco Int Usine Ferrures Palier intermediaire pour fenetre, porte ou analogue
JP3043578B2 (ja) 1993-10-25 2000-05-22 東芝機械株式会社 研磨装置
JPH09195640A (ja) * 1996-01-19 1997-07-29 Tostem Corp 換気框を備えたサッシまたは戸
JPH1075507A (ja) * 1996-08-29 1998-03-17 Energy Support Corp 開閉装置の防塵方法
JP3722591B2 (ja) * 1997-05-30 2005-11-30 株式会社日立製作所 研磨装置
JPH11129132A (ja) * 1997-10-28 1999-05-18 Amada Eng Center Co Ltd 板材加工複合機における防塵装置
JP3013302B2 (ja) * 1998-03-20 2000-02-28 ユキワ精工株式会社 回転テーブル装置
JPH11320385A (ja) * 1998-05-14 1999-11-24 Matsushita Electric Ind Co Ltd 研磨方法及びその装置
JP2000082859A (ja) * 1998-07-13 2000-03-21 Hitachi Metals Ltd 固体レ―ザ装置
US6419559B1 (en) * 2000-07-10 2002-07-16 Applied Materials, Inc. Using a purge gas in a chemical mechanical polishing apparatus with an incrementally advanceable polishing sheet
JP2003306259A (ja) * 2002-04-12 2003-10-28 Shinko Electric Ind Co Ltd 長尺帯状体の送り異常検知装置
US7288165B2 (en) * 2003-10-24 2007-10-30 Applied Materials, Inc. Pad conditioning head for CMP process
JP2008166709A (ja) 2006-12-05 2008-07-17 Ebara Corp 基板研磨装置、及び基板研磨設備
JP2009026569A (ja) * 2007-07-19 2009-02-05 Toyota Motor Corp 密閉型電池の気密検査方法及び密閉型電池

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002525885A (ja) * 1998-09-29 2002-08-13 アプライド マテリアルズ インコーポレイテッド 化学的機械研磨用コンディショナ
JP2007313644A (ja) * 1999-05-17 2007-12-06 Ebara Corp ドレッシング装置

Also Published As

Publication number Publication date
JP2013141735A (ja) 2013-07-22
US9028297B2 (en) 2015-05-12
TW201332713A (zh) 2013-08-16
JP5844163B2 (ja) 2016-01-13
US20130210324A1 (en) 2013-08-15
KR20130083406A (ko) 2013-07-22
TWI535528B (zh) 2016-06-01

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