KR101614576B1 - Ⅲ족 질화물 결정 기판, 에피택셜층이 부착된 ⅲ족 질화물 결정 기판, 및 반도체 디바이스와 그 제조 방법 - Google Patents
Ⅲ족 질화물 결정 기판, 에피택셜층이 부착된 ⅲ족 질화물 결정 기판, 및 반도체 디바이스와 그 제조 방법 Download PDFInfo
- Publication number
- KR101614576B1 KR101614576B1 KR1020127007437A KR20127007437A KR101614576B1 KR 101614576 B1 KR101614576 B1 KR 101614576B1 KR 1020127007437 A KR1020127007437 A KR 1020127007437A KR 20127007437 A KR20127007437 A KR 20127007437A KR 101614576 B1 KR101614576 B1 KR 101614576B1
- Authority
- KR
- South Korea
- Prior art keywords
- plane
- crystal substrate
- group
- iii nitride
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/04—After-treatment of single crystals or homogeneous polycrystalline material with defined structure using electric or magnetic fields or particle radiation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/20—Epitaxial-layer growth characterised by the substrate the substrate being of the same materials as the epitaxial layer
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/38—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3202—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
- H01S5/320275—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth semi-polar orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/04—MOCVD or MOVPE
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
- H01S5/0202—Cleaving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0287—Facet reflectivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2009—Confining in the direction perpendicular to the layer structure by using electron barrier layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3211—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Nanotechnology (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Led Devices (AREA)
- Semiconductor Lasers (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2009-206109 | 2009-09-07 | ||
| JP2009206109 | 2009-09-07 | ||
| JP2009287970A JP4518209B1 (ja) | 2009-09-07 | 2009-12-18 | Iii族窒化物結晶基板、エピ層付iii族窒化物結晶基板、ならびに半導体デバイスおよびその製造方法 |
| JPJP-P-2009-287970 | 2009-12-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120049367A KR20120049367A (ko) | 2012-05-16 |
| KR101614576B1 true KR101614576B1 (ko) | 2016-04-21 |
Family
ID=42709015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127007437A Active KR101614576B1 (ko) | 2009-09-07 | 2010-01-28 | Ⅲ족 질화물 결정 기판, 에피택셜층이 부착된 ⅲ족 질화물 결정 기판, 및 반도체 디바이스와 그 제조 방법 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP2477237B1 (enExample) |
| JP (3) | JP4518209B1 (enExample) |
| KR (1) | KR101614576B1 (enExample) |
| CN (1) | CN102484181A (enExample) |
| TW (1) | TW201109488A (enExample) |
| WO (1) | WO2011027580A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4277826B2 (ja) | 2005-06-23 | 2009-06-10 | 住友電気工業株式会社 | 窒化物結晶、窒化物結晶基板、エピ層付窒化物結晶基板、ならびに半導体デバイスおよびその製造方法 |
| JP4518209B1 (ja) * | 2009-09-07 | 2010-08-04 | 住友電気工業株式会社 | Iii族窒化物結晶基板、エピ層付iii族窒化物結晶基板、ならびに半導体デバイスおよびその製造方法 |
| US9708735B2 (en) | 2005-06-23 | 2017-07-18 | Sumitomo Electric Industries, Ltd. | Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same |
| US8771552B2 (en) | 2005-06-23 | 2014-07-08 | Sumitomo Electric Industries, Ltd. | Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same |
| US9064706B2 (en) * | 2006-11-17 | 2015-06-23 | Sumitomo Electric Industries, Ltd. | Composite of III-nitride crystal on laterally stacked substrates |
| JP5381581B2 (ja) * | 2009-09-30 | 2014-01-08 | 住友電気工業株式会社 | 窒化ガリウム基板 |
| JP5679869B2 (ja) * | 2011-03-07 | 2015-03-04 | スタンレー電気株式会社 | 光半導体素子の製造方法 |
| JP2012209766A (ja) | 2011-03-30 | 2012-10-25 | Yamaha Corp | コントローラー |
| JP2013177256A (ja) * | 2012-02-28 | 2013-09-09 | Mitsubishi Chemicals Corp | 周期表第13族金属窒化物基板 |
| JP6656829B2 (ja) | 2014-11-07 | 2020-03-04 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP6448155B2 (ja) * | 2015-01-22 | 2019-01-09 | シックスポイント マテリアルズ, インコーポレイテッド | 低減亀裂iii族窒化物バルク結晶のためのシード選択および成長方法 |
| KR102306671B1 (ko) * | 2015-06-16 | 2021-09-29 | 삼성전자주식회사 | 발광 소자 패키지 |
| EP3778533A4 (en) * | 2018-03-27 | 2021-12-15 | NGK Insulators, Ltd. | ALUMINUM NITRIDE SHEET |
| KR20210144729A (ko) * | 2019-03-29 | 2021-11-30 | 미쯔비시 케미컬 주식회사 | GaN 기판 웨이퍼 및 GaN 기판 웨이퍼의 제조 방법 |
| CN114599965B (zh) * | 2019-11-01 | 2025-09-26 | 三菱电机株式会社 | 化合物半导体的晶体缺陷观察方法 |
| JP2023530956A (ja) * | 2020-06-15 | 2023-07-20 | グーグル エルエルシー | Mbeおよび他の技術によって成長させた低欠陥光電子デバイス |
| CN111693850B (zh) * | 2020-06-17 | 2023-03-28 | 西安微电子技术研究所 | 一种芯片抗辐照性能的监控方法 |
| CN111948235B (zh) * | 2020-08-07 | 2022-09-20 | 广西大学 | 测量半极性面ⅲ族氮化物薄膜缺陷密度的方法及其应用 |
| US20250180495A1 (en) * | 2022-03-07 | 2025-06-05 | Rigaku Corporation | X-ray diffraction data processing device and x-ray analysis device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001322899A (ja) | 2000-05-11 | 2001-11-20 | Matsushita Electric Ind Co Ltd | 窒化ガリウム系化合物半導体基板及びその製造方法 |
| WO2002101121A1 (en) | 2001-06-08 | 2002-12-19 | Advanced Technology Materials, Inc. | High surface quality gan wafer and method of fabricating same |
| US6596079B1 (en) | 2000-03-13 | 2003-07-22 | Advanced Technology Materials, Inc. | III-V nitride substrate boule and method of making and using the same |
| JP2004311575A (ja) | 2003-04-03 | 2004-11-04 | Rodel Nitta Co | 半導体基板用研磨組成物及びこれを用いた半導体基板製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2796212B1 (fr) * | 1999-07-07 | 2001-08-31 | Commissariat Energie Atomique | Dispositif optique a semiconducteur, a cavite resonante accordable en longueur d'onde, application a la modulation d'une intensite lumineuse |
| JP4031628B2 (ja) * | 2001-10-03 | 2008-01-09 | 松下電器産業株式会社 | 半導体多層膜結晶、およびそれを用いた発光素子、ならびに当該半導体多層膜結晶の成長方法 |
| JP4178936B2 (ja) * | 2002-12-11 | 2008-11-12 | 日本電気株式会社 | Iii族窒化物自立基板およびそれを用いた半導体素子ならびにそれらの製造方法 |
| JP2006071354A (ja) * | 2004-08-31 | 2006-03-16 | Sumitomo Electric Ind Ltd | 結晶表面層の結晶性評価方法 |
| JP4792802B2 (ja) * | 2005-04-26 | 2011-10-12 | 住友電気工業株式会社 | Iii族窒化物結晶の表面処理方法 |
| JP4277826B2 (ja) * | 2005-06-23 | 2009-06-10 | 住友電気工業株式会社 | 窒化物結晶、窒化物結晶基板、エピ層付窒化物結晶基板、ならびに半導体デバイスおよびその製造方法 |
| JP4518209B1 (ja) * | 2009-09-07 | 2010-08-04 | 住友電気工業株式会社 | Iii族窒化物結晶基板、エピ層付iii族窒化物結晶基板、ならびに半導体デバイスおよびその製造方法 |
| JP2008235802A (ja) * | 2007-03-23 | 2008-10-02 | Rohm Co Ltd | 発光装置 |
| JP4462289B2 (ja) * | 2007-05-18 | 2010-05-12 | ソニー株式会社 | 半導体層の成長方法および半導体発光素子の製造方法 |
| CN101350333A (zh) * | 2007-06-14 | 2009-01-21 | 住友电气工业株式会社 | GaN衬底、带外延层的衬底、半导体器件及GaN衬底制造方法 |
| JP4720834B2 (ja) * | 2008-02-25 | 2011-07-13 | 住友電気工業株式会社 | Iii族窒化物半導体レーザ |
| JP4305574B1 (ja) * | 2009-01-14 | 2009-07-29 | 住友電気工業株式会社 | Iii族窒化物基板、それを備える半導体デバイス、及び、表面処理されたiii族窒化物基板を製造する方法 |
| JP4375497B1 (ja) * | 2009-03-11 | 2009-12-02 | 住友電気工業株式会社 | Iii族窒化物半導体素子、エピタキシャル基板、及びiii族窒化物半導体素子を作製する方法 |
-
2009
- 2009-12-18 JP JP2009287970A patent/JP4518209B1/ja active Active
-
2010
- 2010-01-28 WO PCT/JP2010/051158 patent/WO2011027580A1/ja not_active Ceased
- 2010-01-28 CN CN2010800397711A patent/CN102484181A/zh active Pending
- 2010-01-28 KR KR1020127007437A patent/KR101614576B1/ko active Active
- 2010-01-28 EP EP10813531.0A patent/EP2477237B1/en active Active
- 2010-01-29 TW TW099102753A patent/TW201109488A/zh unknown
- 2010-05-21 JP JP2010117702A patent/JP5024426B2/ja active Active
-
2012
- 2012-06-19 JP JP2012137811A patent/JP5724954B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6596079B1 (en) | 2000-03-13 | 2003-07-22 | Advanced Technology Materials, Inc. | III-V nitride substrate boule and method of making and using the same |
| JP2001322899A (ja) | 2000-05-11 | 2001-11-20 | Matsushita Electric Ind Co Ltd | 窒化ガリウム系化合物半導体基板及びその製造方法 |
| WO2002101121A1 (en) | 2001-06-08 | 2002-12-19 | Advanced Technology Materials, Inc. | High surface quality gan wafer and method of fabricating same |
| JP2004311575A (ja) | 2003-04-03 | 2004-11-04 | Rodel Nitta Co | 半導体基板用研磨組成物及びこれを用いた半導体基板製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2477237A1 (en) | 2012-07-18 |
| JP2012248850A (ja) | 2012-12-13 |
| JP2011073957A (ja) | 2011-04-14 |
| WO2011027580A1 (ja) | 2011-03-10 |
| EP2477237B1 (en) | 2020-09-09 |
| CN102484181A (zh) | 2012-05-30 |
| KR20120049367A (ko) | 2012-05-16 |
| TW201109488A (en) | 2011-03-16 |
| JP5724954B2 (ja) | 2015-05-27 |
| JP2011073958A (ja) | 2011-04-14 |
| JP5024426B2 (ja) | 2012-09-12 |
| JP4518209B1 (ja) | 2010-08-04 |
| EP2477237A4 (en) | 2015-11-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101614576B1 (ko) | Ⅲ족 질화물 결정 기판, 에피택셜층이 부착된 ⅲ족 질화물 결정 기판, 및 반도체 디바이스와 그 제조 방법 | |
| JP4835749B2 (ja) | Iii族窒化物結晶基板、エピ層付iii族窒化物結晶基板、ならびに半導体デバイスおよびその製造方法 | |
| US8771552B2 (en) | Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same | |
| JP4277826B2 (ja) | 窒化物結晶、窒化物結晶基板、エピ層付窒化物結晶基板、ならびに半導体デバイスおよびその製造方法 | |
| US8853670B2 (en) | III nitride semiconductor substrate, epitaxial substrate, and semiconductor device | |
| WO2010082366A1 (ja) | 化合物半導体基板、半導体デバイス及びその製造方法 | |
| US10113248B2 (en) | Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same | |
| US20120223417A1 (en) | Group iii nitride crystal substrate, epilayer-containing group iii nitride crystal substrate, semiconductor device and method of manufacturing the same | |
| JP4337953B2 (ja) | 窒化物結晶基板、エピ層付窒化物結晶基板および半導体デバイス | |
| JP5565396B2 (ja) | Iii族窒化物結晶基板、エピ層付iii族窒化物結晶基板、および半導体デバイス | |
| JP2009124160A (ja) | 窒化物結晶およびエピ層付窒化物結晶基板の製造方法 | |
| WO2011058870A1 (ja) | Iii族窒化物結晶基板、エピ層付iii族窒化物結晶基板、ならびに半導体デバイスおよびその製造方法 | |
| JP2012054563A (ja) | 窒化物結晶およびエピ層付窒化物結晶基板の製造方法 | |
| HK1124961A (en) | Gan substrate, and epitaxial substrate and semiconductor light-emitting device employing the substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| FPAY | Annual fee payment |
Payment date: 20190328 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R14-asn-PN2301 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| R18 | Changes to party contact information recorded |
Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |