KR101612034B1 - 다이 이젝터 - Google Patents

다이 이젝터 Download PDF

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Publication number
KR101612034B1
KR101612034B1 KR1020090106216A KR20090106216A KR101612034B1 KR 101612034 B1 KR101612034 B1 KR 101612034B1 KR 1020090106216 A KR1020090106216 A KR 1020090106216A KR 20090106216 A KR20090106216 A KR 20090106216A KR 101612034 B1 KR101612034 B1 KR 101612034B1
Authority
KR
South Korea
Prior art keywords
plate
path
semiconductor chip
die ejector
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020090106216A
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English (en)
Korean (ko)
Other versions
KR20100050432A (ko
Inventor
다니엘 클뢰크너
이베스 뮐레만
다니엘 슈네츨러
Original Assignee
에섹 에스에이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH01748/08A external-priority patent/CH699851A1/de
Application filed by 에섹 에스에이 filed Critical 에섹 에스에이
Publication of KR20100050432A publication Critical patent/KR20100050432A/ko
Application granted granted Critical
Publication of KR101612034B1 publication Critical patent/KR101612034B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53274—Means to disassemble electrical device

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Die Bonding (AREA)
KR1020090106216A 2008-11-05 2009-11-04 다이 이젝터 Expired - Fee Related KR101612034B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH01748/08A CH699851A1 (de) 2008-11-05 2008-11-05 Chip-Auswerfer und Verfahren zum Ablösen und Entnehmen eines Halbleiterchips von einer Folie.
CH1748/08 2008-11-05
CH14522009 2009-09-18
CH1452/09 2009-09-18

Publications (2)

Publication Number Publication Date
KR20100050432A KR20100050432A (ko) 2010-05-13
KR101612034B1 true KR101612034B1 (ko) 2016-04-12

Family

ID=41510771

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090106216A Expired - Fee Related KR101612034B1 (ko) 2008-11-05 2009-11-04 다이 이젝터

Country Status (9)

Country Link
US (1) US8250742B2 (https=)
EP (1) EP2184765B1 (https=)
JP (1) JP5488966B2 (https=)
KR (1) KR101612034B1 (https=)
CN (1) CN101740349B (https=)
AT (1) ATE537553T1 (https=)
MY (1) MY150953A (https=)
SG (1) SG161178A1 (https=)
TW (1) TWI469241B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11244840B2 (en) 2018-10-04 2022-02-08 Samsung Electronics Co., Ltd. Die ejectors and die supplying apparatuses including ihe same

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102376613B (zh) * 2010-08-20 2013-04-03 吴华 集成电路装片机顶针模块
KR20140077882A (ko) * 2011-09-22 2014-06-24 플러스 세이키 가부시키가이샤 적층물 피치 변경 장치
CH706280B1 (de) * 2012-03-30 2016-03-15 Esec Ag Verfahren zum Ablösen eines Halbleiterchips von einer Folie.
KR101397750B1 (ko) * 2012-07-25 2014-05-21 삼성전기주식회사 칩 이젝터 및 이를 이용한 칩 탈착 방법
CH707236B1 (de) * 2012-11-23 2016-10-31 Besi Switzerland Ag Verfahren zum Ablösen von Halbleiterchips von einer Folie.
KR101957959B1 (ko) * 2012-12-31 2019-03-13 세메스 주식회사 다이 이젝팅 방법 및 장치
JP5717910B1 (ja) * 2014-02-26 2015-05-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
SG10201403372SA (en) * 2014-06-18 2016-01-28 Mfg Integration Technology Ltd System and method for peeling a semiconductor chip from a tape using a multistage ejector
WO2016151911A1 (ja) * 2015-03-23 2016-09-29 リンテック株式会社 半導体加工用シートおよび半導体装置の製造方法
JP6621771B2 (ja) * 2017-01-25 2019-12-18 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
US11289459B2 (en) 2017-07-18 2022-03-29 Lumens Co., Ltd. Apparatus and method for manufacturing light-emitting diode module
KR102380971B1 (ko) * 2017-07-18 2022-04-01 주식회사 루멘스 발광다이오드 모듈 제조 장치 및 방법
WO2019017584A1 (ko) * 2017-07-18 2019-01-24 주식회사 루멘스 발광다이오드 모듈 제조 장치 및 방법
CN107920428B (zh) * 2017-11-21 2023-06-30 南京工程学院 一种集成电路易拔ic底座
TWI641070B (zh) * 2018-01-09 2018-11-11 Powertech Technology Inc. 晶片頂針裝置
CH715447B1 (de) * 2018-10-15 2022-01-14 Besi Switzerland Ag Chip-Auswerfer.
EP3739619B1 (de) * 2019-05-17 2022-03-09 SR-Schindler Maschinen - Anlagetechnik GmbH Plattenproduktionsanlage mit ausstosseinrichtung
KR102220340B1 (ko) * 2019-06-11 2021-02-25 세메스 주식회사 다이 이젝팅 장치
KR102617784B1 (ko) * 2020-07-09 2023-12-26 세메스 주식회사 다이 이젝터 및 이를 포함하는 다이 본딩 장치
US11764098B2 (en) * 2021-04-16 2023-09-19 Asmpt Singapore Pte. Ltd. Detaching a die from an adhesive tape by air ejection
JP7645768B2 (ja) * 2021-10-26 2025-03-14 三菱電機株式会社 半導体製造装置および半導体装置の製造方法
KR20230167935A (ko) 2022-06-03 2023-12-12 삼성전자주식회사 반도체 패키지 제조용 장치 및 이를 이용한 반도체 패키지 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000353710A (ja) 1999-06-14 2000-12-19 Toshiba Corp ペレットピックアップ装置および半導体装置の製造方法
US20050059205A1 (en) 2003-09-17 2005-03-17 Hiroshi Maki Method of manufacturing semiconductor device
WO2005117072A1 (de) 2004-05-19 2005-12-08 Alphasem Ag Verfahren und vorrichung zum ablösen eines auf eine flexible folie geklebten bauteils
JP2008192736A (ja) 2007-02-02 2008-08-21 Shibaura Mechatronics Corp チップ実装装置、半導体ウエハ加工用粘着シート、およびチップ実装方法

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US4921564A (en) 1988-05-23 1990-05-01 Semiconductor Equipment Corp. Method and apparatus for removing circuit chips from wafer handling tape
JP3498877B2 (ja) * 1995-12-05 2004-02-23 株式会社東芝 半導体製造装置および半導体装置の製造方法
JP2990197B1 (ja) * 1999-01-20 1999-12-13 熊本日本電気株式会社 半導体チップのピックアップ装置
JP3209736B2 (ja) 1999-11-09 2001-09-17 エヌイーシーマシナリー株式会社 ペレットピックアップ装置
JP4482243B2 (ja) 2001-03-13 2010-06-16 株式会社新川 ダイのピックアップ方法及びピックアップ装置
US6889427B2 (en) * 2002-02-15 2005-05-10 Freescale Semiconductor, Inc. Process for disengaging semiconductor die from an adhesive film
TWI225279B (en) 2002-03-11 2004-12-11 Hitachi Ltd Semiconductor device and its manufacturing method
US20040105750A1 (en) 2002-11-29 2004-06-03 Esec Trading Sa, A Swiss Corporation Method for picking semiconductor chips from a foil
CN100428402C (zh) * 2004-04-13 2008-10-22 优利讯国际贸易有限责任公司 从箔片分离半导体芯片的方法和用于安装半导体芯片的设备
EP1587138B1 (de) 2004-04-13 2007-05-30 Oerlikon Assembly Equipment AG, Steinhausen Einrichtung für die Montage von Halbleiterchips und Verfahren zum Ablösen eines Halbleiterchips von einer Folie
US7240422B2 (en) * 2004-05-11 2007-07-10 Asm Assembly Automation Ltd. Apparatus for semiconductor chip detachment
US7303647B2 (en) * 2004-10-29 2007-12-04 Asm Assembly Automation Ltd. Driving mechanism for chip detachment apparatus
US7665204B2 (en) 2006-10-16 2010-02-23 Asm Assembly Automation Ltd. Die detachment apparatus comprising pre-peeling structure
JP2008141068A (ja) * 2006-12-04 2008-06-19 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
CN201084714Y (zh) * 2007-10-16 2008-07-09 陈栋栋 芯片分离设备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000353710A (ja) 1999-06-14 2000-12-19 Toshiba Corp ペレットピックアップ装置および半導体装置の製造方法
US20050059205A1 (en) 2003-09-17 2005-03-17 Hiroshi Maki Method of manufacturing semiconductor device
WO2005117072A1 (de) 2004-05-19 2005-12-08 Alphasem Ag Verfahren und vorrichung zum ablösen eines auf eine flexible folie geklebten bauteils
JP2008192736A (ja) 2007-02-02 2008-08-21 Shibaura Mechatronics Corp チップ実装装置、半導体ウエハ加工用粘着シート、およびチップ実装方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11244840B2 (en) 2018-10-04 2022-02-08 Samsung Electronics Co., Ltd. Die ejectors and die supplying apparatuses including ihe same

Also Published As

Publication number Publication date
EP2184765B1 (de) 2011-12-14
CN101740349B (zh) 2013-09-25
TWI469241B (zh) 2015-01-11
TW201025483A (en) 2010-07-01
KR20100050432A (ko) 2010-05-13
JP2010114441A (ja) 2010-05-20
JP5488966B2 (ja) 2014-05-14
EP2184765A1 (de) 2010-05-12
SG161178A1 (en) 2010-05-27
CN101740349A (zh) 2010-06-16
US8250742B2 (en) 2012-08-28
MY150953A (en) 2014-03-31
US20100107405A1 (en) 2010-05-06
ATE537553T1 (de) 2011-12-15

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