KR101607552B1 - 전자파 실드재 및 프린트 배선판 - Google Patents

전자파 실드재 및 프린트 배선판 Download PDF

Info

Publication number
KR101607552B1
KR101607552B1 KR1020107029437A KR20107029437A KR101607552B1 KR 101607552 B1 KR101607552 B1 KR 101607552B1 KR 1020107029437 A KR1020107029437 A KR 1020107029437A KR 20107029437 A KR20107029437 A KR 20107029437A KR 101607552 B1 KR101607552 B1 KR 101607552B1
Authority
KR
South Korea
Prior art keywords
conductive adhesive
electromagnetic shielding
layer
adhesive layer
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020107029437A
Other languages
English (en)
Korean (ko)
Other versions
KR20110026436A (ko
Inventor
마사유키 토토우게
요시노리 카와카미
Original Assignee
다츠다 덴센 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다츠다 덴센 가부시키가이샤 filed Critical 다츠다 덴센 가부시키가이샤
Publication of KR20110026436A publication Critical patent/KR20110026436A/ko
Application granted granted Critical
Publication of KR101607552B1 publication Critical patent/KR101607552B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
KR1020107029437A 2008-05-30 2009-05-27 전자파 실드재 및 프린트 배선판 Active KR101607552B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008143114A JP5139156B2 (ja) 2008-05-30 2008-05-30 電磁波シールド材及びプリント配線板
JPJP-P-2008-143114 2008-05-30

Publications (2)

Publication Number Publication Date
KR20110026436A KR20110026436A (ko) 2011-03-15
KR101607552B1 true KR101607552B1 (ko) 2016-03-30

Family

ID=41377101

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107029437A Active KR101607552B1 (ko) 2008-05-30 2009-05-27 전자파 실드재 및 프린트 배선판

Country Status (4)

Country Link
JP (1) JP5139156B2 (https=)
KR (1) KR101607552B1 (https=)
CN (1) CN102047777B (https=)
WO (1) WO2009145230A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020017766A1 (en) * 2018-07-20 2020-01-23 Samsung Electronics Co., Ltd. Electronic device including structure for protecting display driver from static electricity
KR20210102093A (ko) 2020-02-10 2021-08-19 진테크 주식회사 관통홀을 구비한 전자파 차폐용 캐리어 금속극박 및 이의 제조방법
KR20210102092A (ko) 2020-02-10 2021-08-19 진테크 주식회사 열반응성 점착제층을 구비한 전자파 차폐용 캐리어 금속극박 및 이의 제조방법

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9167735B2 (en) * 2010-06-23 2015-10-20 Inktec Co., Ltd. Method for manufacturing electromagnetic interference shielding film
CN103190209B (zh) 2010-10-26 2016-05-18 汉高知识产权控股有限责任公司 用于板级emi屏蔽的复合膜
JP5582539B2 (ja) * 2011-02-25 2014-09-03 清二 加川 近傍界ノイズ抑制シート
JP5707216B2 (ja) * 2011-04-26 2015-04-22 藤森工業株式会社 Ｆｐｃ用電磁波シールド材
JP6106083B2 (ja) * 2011-04-28 2017-03-29 株式会社カネカ 新規な導電層一体型フレキシブルプリント基板
WO2013011873A1 (ja) * 2011-07-20 2013-01-24 株式会社カネカ 新規な導電層一体型ｆｐｃ
JP5712095B2 (ja) * 2011-09-16 2015-05-07 藤森工業株式会社 Ｆｐｃ用電磁波シールド材
JPWO2013077108A1 (ja) 2011-11-24 2015-04-27 タツタ電線株式会社 シールドフィルム、シールドプリント配線板、及び、シールドフィルムの製造方法
TWI586230B (zh) 2012-07-18 2017-06-01 鐘化股份有限公司 補強板一體型軟性印刷基板
TWI627875B (zh) 2012-07-18 2018-06-21 鐘化股份有限公司 導電層一體型軟性印刷基板
JP6225436B2 (ja) * 2012-08-16 2017-11-08 住友ベークライト株式会社 電磁波シールド用フィルム、および電子部品の被覆方法
KR101272397B1 (ko) * 2013-04-11 2013-06-07 장성대 열확산, 전자파 차폐 및 충격흡수 기능을 갖는 복합기능 박막시트 및 이의 제조방법
JP6014680B2 (ja) * 2012-11-19 2016-10-25 タツタ電線株式会社 積層フィルム及びシールドプリント配線板
TWI488280B (zh) 2012-11-21 2015-06-11 Ind Tech Res Inst 電磁波屏蔽結構及其製造方法
KR101393072B1 (ko) * 2013-02-14 2014-05-12 가드넥(주) 전자파 간섭 저감 및 열 확산 강화 기능을 갖는 복합 시트
JP6081819B2 (ja) * 2013-02-28 2017-02-15 藤森工業株式会社 Ｆｐｃ用電磁波シールド材
KR101459223B1 (ko) * 2013-04-19 2014-11-26 (주)창성 기능을 향상시킨 열확산 시트 및 이를 포함하는 전자 기기.
US9178104B2 (en) 2013-12-20 2015-11-03 Sunpower Corporation Single-step metal bond and contact formation for solar cells
CN105830234B (zh) * 2013-12-20 2020-10-30 太阳能公司 太阳能电池的金属结合部和触点的单步形成
WO2015186624A1 (ja) * 2014-06-02 2015-12-10 タツタ電線株式会社 導電性接着フィルム、プリント回路基板、及び、電子機器
CN104219942A (zh) * 2014-09-04 2014-12-17 斯迪克新型材料（江苏）有限公司 多用途吸波贴膜
CN104470342A (zh) * 2014-11-21 2015-03-25 贵州航天天马机电科技有限公司 一种宽频电磁屏蔽层
CN104853576A (zh) * 2015-05-13 2015-08-19 东莞市万丰纳米材料有限公司 超高屏蔽性能的电磁屏蔽膜及其生产工艺
JP6379071B2 (ja) * 2015-06-15 2018-08-22 Ｊｘ金属株式会社 電磁波シールド材
CN105139923A (zh) * 2015-09-21 2015-12-09 杨天纬 一种用于线缆的屏蔽膜及制造方法及线材的制造方法
KR102608700B1 (ko) * 2015-12-25 2023-11-30 타츠타 전선 주식회사 전자파 차폐 필름 및 그의 제조 방법
KR101856528B1 (ko) * 2016-04-12 2018-06-20 최훈석 유기발광표시모듈용 복합 시트
JP6777423B2 (ja) * 2016-04-28 2020-10-28 新科實業有限公司ＳＡＥ Ｍａｇｎｅｔｉｃｓ（Ｈ．Ｋ．）Ｌｔｄ． 電子部品モジュールおよびその製造方法
WO2018147426A1 (ja) * 2017-02-13 2018-08-16 タツタ電線株式会社 シールドフィルム、シールドプリント配線板及びシールドプリント配線板の製造方法
CN108966478B (zh) * 2017-05-17 2021-02-26 鹏鼎控股(深圳)股份有限公司 柔性电路板及其制作方法
CN108481839A (zh) * 2017-05-19 2018-09-04 上海浦健科技有限公司 一种用于吸收负极性粒子的装置
JP2017212472A (ja) * 2017-09-12 2017-11-30 タツタ電線株式会社 シールドフィルム、及び、シールドプリント配線板
CN109041561B (zh) * 2018-08-28 2020-04-28 中国人民解放军海军航空大学青岛校区 一种飞机复合材料蒙皮的电磁屏蔽方法
JP2020038889A (ja) * 2018-09-03 2020-03-12 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
KR102007807B1 (ko) * 2018-09-18 2019-08-06 주학식 실리콘 복합 시트 및 그 제조 방법
CN109068556B (zh) * 2018-09-18 2024-07-26 北京梦之墨科技有限公司 一种电磁屏蔽袋
JP7268446B2 (ja) * 2019-03-29 2023-05-08 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器
CN110012655B (zh) * 2019-04-28 2025-01-17 昆山雅森电子材料科技有限公司 具有emi功能的薄型化覆盖膜
CN110497659B (zh) * 2019-07-18 2024-07-09 铭尔金属(苏州)有限公司 一种复合材料及其制备方法及使用其的电子产品
CN111234722B (zh) * 2020-03-25 2021-10-01 南通康尔乐复合材料有限公司 一种双层金属塑料复合膜导电胶带、制造方法及其涂布机
CN113747775A (zh) * 2020-05-29 2021-12-03 同方威视技术股份有限公司 防止安检通道之间的电磁干扰的射频识别装置和屏蔽板的制造方法
CN111806013A (zh) * 2020-07-03 2020-10-23 河南国安电子材料有限公司 一种高频电磁屏蔽膜及其制备方法
KR102578184B1 (ko) * 2020-12-30 2023-09-12 엘지디스플레이 주식회사 표시 모듈 및 표시 장치
CN113949223B (zh) * 2021-03-11 2023-07-14 国家电投集团科学技术研究院有限公司 永磁齿轮变速装置
JP7001187B1 (ja) * 2021-03-19 2022-01-19 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびその製造方法、シールド性配線基板、並びに電子機器
CN115515407A (zh) * 2021-06-23 2022-12-23 中国科学院宁波材料技术与工程研究所 电磁波屏蔽材料及其制造方法和制造设备
KR20230053438A (ko) * 2021-10-14 2023-04-21 쓰리엠 이노베이티브 프로퍼티즈 캄파니 통합 전자 스택
CN114938618A (zh) * 2022-05-31 2022-08-23 广州方邦电子股份有限公司 电磁屏蔽罩、线路板、电子设备及电磁屏蔽罩的制备方法
JP7754883B2 (ja) * 2022-06-30 2025-10-15 株式会社リケン環境システム 電波吸収体
CN119815815A (zh) * 2025-01-20 2025-04-11 合肥维信诺科技有限公司 电磁屏蔽膜及电路板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1328501A (zh) * 1998-10-20 2001-12-26 Atd公司 多层波纹金属箔绝缘板及其制造方法
JP2007294918A (ja) * 2006-03-29 2007-11-08 Tatsuta System Electronics Kk シールドフィルム及びシールドプリント配線板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01117395A (ja) * 1987-10-30 1989-05-10 Hiraoka & Co Ltd 電磁波シールド性積層シート
JPH0474496U (https=) * 1990-11-07 1992-06-30
JPH062925U (ja) * 1992-06-12 1994-01-14 矢崎総業株式会社 シールド機能付き集束チューブ
JP3087883B2 (ja) * 1994-03-25 2000-09-11 エム・アイ・シー株式会社 ケーブル圧接ハーネスの製造方法
JP3593857B2 (ja) * 1997-08-05 2004-11-24 Ｎｅｃトーキン株式会社 電磁波吸収接着剤
JP4201548B2 (ja) * 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
JP2004128158A (ja) * 2002-10-01 2004-04-22 Fcm Kk 電磁波シールド材
FI20031796L (fi) * 2003-12-09 2005-06-10 Asperation Oy Menetelmä EMI-suojan rakentamiseksi piirilevylle upotettavan komponentin ympärille

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1328501A (zh) * 1998-10-20 2001-12-26 Atd公司 多层波纹金属箔绝缘板及其制造方法
JP2007294918A (ja) * 2006-03-29 2007-11-08 Tatsuta System Electronics Kk シールドフィルム及びシールドプリント配線板

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020017766A1 (en) * 2018-07-20 2020-01-23 Samsung Electronics Co., Ltd. Electronic device including structure for protecting display driver from static electricity
KR20200009731A (ko) * 2018-07-20 2020-01-30 삼성전자주식회사 정전기로부터 디스플레이 구동 드라이버를 보호하는 구조를 갖는 전자 장치
US11330743B2 (en) 2018-07-20 2022-05-10 Samsung Electronics Co., Ltd. Electronic device including structure for protecting display driver from static electricity
KR102474751B1 (ko) 2018-07-20 2022-12-07 삼성전자주식회사 정전기로부터 디스플레이 구동 드라이버를 보호하는 구조를 갖는 전자 장치
KR20210102093A (ko) 2020-02-10 2021-08-19 진테크 주식회사 관통홀을 구비한 전자파 차폐용 캐리어 금속극박 및 이의 제조방법
KR20210102092A (ko) 2020-02-10 2021-08-19 진테크 주식회사 열반응성 점착제층을 구비한 전자파 차폐용 캐리어 금속극박 및 이의 제조방법

Also Published As

Publication number Publication date
CN102047777A (zh) 2011-05-04
JP5139156B2 (ja) 2013-02-06
KR20110026436A (ko) 2011-03-15
JP2009290103A (ja) 2009-12-10
WO2009145230A1 (ja) 2009-12-03
CN102047777B (zh) 2016-05-25

Similar Documents

Publication Publication Date Title
KR101607552B1 (ko) 전자파 실드재 및 프린트 배선판
KR101510173B1 (ko) 프린트 배선판용 쉴드 필름 및 프린트 배선판
CN111163623B (zh) 一种多层金属结构的屏蔽膜
JP2009038278A5 (https=)
JPS59175785A (ja) 配線基板
JP7244535B2 (ja) 電磁波シールドフィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板
JP2013193253A (ja) 電磁シールド性カバーレイフィルム、フレキシブル配線板およびその製造方法
KR101552976B1 (ko) 전자기파 차폐 시트 및 그 제조 방법
KR102790802B1 (ko) 전자파 차폐 필름
KR101970484B1 (ko) Fpc용 도전성 접착 시트 및 fpc
CN210130065U (zh) 一种多层金属结构的屏蔽膜
CN115038768B (zh) 导电性胶粘剂、电磁波屏蔽膜以及导电性粘结膜
CN215073714U (zh) 一种柔性电磁屏蔽膜及线路板
CN110278701A (zh) 电磁波屏蔽膜以及屏蔽印制线路板
KR20250139186A (ko) 고방열 전자기 차폐 복합시트 및 이의 제조방법
KR20210108325A (ko) 자성 시트
HK40114151A (zh) 导电性粘接剂层和散热结构
HK40044816B (zh) 电磁波屏蔽膜、屏蔽印制线路板的制造方法及屏蔽印制线路板

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20101228

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20140513

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20150216

Patent event code: PE09021S01D

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20150827

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20160224

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20160324

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20160324

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
FPAY Annual fee payment

Payment date: 20190315

Year of fee payment: 4

PR1001 Payment of annual fee

Payment date: 20190315

Start annual number: 4

End annual number: 4

FPAY Annual fee payment

Payment date: 20200313

Year of fee payment: 5

PR1001 Payment of annual fee

Payment date: 20200313

Start annual number: 5

End annual number: 5

FPAY Annual fee payment

Payment date: 20210312

Year of fee payment: 6

PR1001 Payment of annual fee

Payment date: 20210312

Start annual number: 6

End annual number: 6

FPAY Annual fee payment

Payment date: 20220311

Year of fee payment: 7

PR1001 Payment of annual fee

Payment date: 20220311

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 20240315

Start annual number: 9

End annual number: 9