KR101598657B1 - 웨이퍼의 모따기 장치 - Google Patents

웨이퍼의 모따기 장치 Download PDF

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Publication number
KR101598657B1
KR101598657B1 KR1020127029505A KR20127029505A KR101598657B1 KR 101598657 B1 KR101598657 B1 KR 101598657B1 KR 1020127029505 A KR1020127029505 A KR 1020127029505A KR 20127029505 A KR20127029505 A KR 20127029505A KR 101598657 B1 KR101598657 B1 KR 101598657B1
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South Korea
Prior art keywords
wafer
machining
processing
chamfering
tables
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KR1020127029505A
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English (en)
Korean (ko)
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KR20130092401A (ko
Inventor
이치로 가타야마
Original Assignee
다이토 일렉트론 가부시키가이샤
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Publication of KR20130092401A publication Critical patent/KR20130092401A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B24B47/225—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation for bevelling optical work, e.g. lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/128—Preparing bulk and homogeneous wafers by edge treatment, e.g. chamfering

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020127029505A 2010-05-11 2011-02-28 웨이퍼의 모따기 장치 Active KR101598657B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010109645A JP5491273B2 (ja) 2010-05-11 2010-05-11 ウェーハの面取り装置
JPJP-P-2010-109645 2010-05-11
PCT/JP2011/054445 WO2011142159A1 (ja) 2010-05-11 2011-02-28 ウェーハの面取り装置

Publications (2)

Publication Number Publication Date
KR20130092401A KR20130092401A (ko) 2013-08-20
KR101598657B1 true KR101598657B1 (ko) 2016-02-29

Family

ID=44914218

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127029505A Active KR101598657B1 (ko) 2010-05-11 2011-02-28 웨이퍼의 모따기 장치

Country Status (5)

Country Link
JP (1) JP5491273B2 (https=)
KR (1) KR101598657B1 (https=)
CN (1) CN102869476B (https=)
TW (1) TWI499482B (https=)
WO (1) WO2011142159A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6099960B2 (ja) * 2012-12-18 2017-03-22 ダイトエレクトロン株式会社 ウェーハの面取り加工方法およびウェーハの面取り装置
JP6007889B2 (ja) * 2013-12-03 2016-10-19 信越半導体株式会社 面取り加工装置及びノッチレスウェーハの製造方法
JP6141814B2 (ja) * 2014-10-30 2017-06-07 信越半導体株式会社 研磨装置
KR101578713B1 (ko) * 2015-06-22 2015-12-18 황정하 광학렌즈의 양면 모따기 장치
JP6614978B2 (ja) * 2016-01-14 2019-12-04 株式会社荏原製作所 研磨装置及び研磨方法
JP6774263B2 (ja) * 2016-08-19 2020-10-21 株式会社ディスコ 切削装置
CN106181681A (zh) * 2016-08-31 2016-12-07 天通银厦新材料有限公司 一种蓝宝石加工用精确打磨装置
EP3581331B1 (en) 2018-06-13 2022-07-20 W-M GLASS Sp. z o.o. Set of discs for grinding the edges of glass plates
CN109333222B (zh) * 2018-11-01 2023-06-27 浙江中晶新材料研究有限公司 一种全自动硅片倒角加工设备及其加工工艺
JP7153578B2 (ja) * 2019-01-29 2022-10-14 信越半導体株式会社 シリコンウェーハの製造方法
JP7016032B2 (ja) 2019-09-24 2022-02-04 日亜化学工業株式会社 半導体素子の製造方法
CN114888983B (zh) * 2022-05-31 2025-03-04 杭州中为光电技术有限公司 硅片自动倒角清洗一体化设备
CN116673817B (zh) * 2023-06-08 2025-09-02 芜湖众源复合新材料有限公司 一种机械零件边角的打磨设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2186135Y (zh) * 1994-03-04 1994-12-28 廖胜钦 多轴式圆形玻璃磨斜边机

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2554432B2 (ja) * 1992-11-20 1996-11-13 住友シチックス株式会社 半導体ウエーハの外周面加工装置
JP2882458B2 (ja) 1994-11-28 1999-04-12 株式会社東京精密 ウェーハ面取り機
JPH1177501A (ja) * 1997-09-05 1999-03-23 Asahi Glass Co Ltd ガラス板端部の加工方法
ITMI991382A1 (it) * 1999-06-21 2000-12-21 Bavelloni Z Spa Macchina automatica bilaterale per la lavorazione dei bordi di lastredi vetro materiali lapidei e simili
JP4323058B2 (ja) 2000-04-24 2009-09-02 エムテック株式会社 ウェーハのノッチの研摩装置
JP4013778B2 (ja) * 2003-02-04 2007-11-28 坂東機工株式会社 ガラス板の加工装置
JP2006110642A (ja) * 2004-10-12 2006-04-27 Shiraitekku:Kk 研磨装置
JP5112703B2 (ja) 2007-01-18 2013-01-09 ダイトエレクトロン株式会社 ウェーハ面取り加工方法およびその装置
KR100905094B1 (ko) * 2007-08-01 2009-06-30 주식회사 에스에프에이 웨이퍼 연마장치
JP5304020B2 (ja) * 2008-05-14 2013-10-02 新東工業株式会社 板状部材の端面の加工方法
JP4758457B2 (ja) * 2008-05-22 2011-08-31 株式会社東京精密 ウェーハ面取り装置
JP5434014B2 (ja) * 2008-08-22 2014-03-05 坂東機工株式会社 ガラス板の加工方法及びガラス板加工装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2186135Y (zh) * 1994-03-04 1994-12-28 廖胜钦 多轴式圆形玻璃磨斜边机

Also Published As

Publication number Publication date
JP5491273B2 (ja) 2014-05-14
JP2011235406A (ja) 2011-11-24
TWI499482B (zh) 2015-09-11
KR20130092401A (ko) 2013-08-20
TW201206636A (en) 2012-02-16
WO2011142159A1 (ja) 2011-11-17
CN102869476B (zh) 2015-08-19
CN102869476A (zh) 2013-01-09

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