KR101587299B1 - 복수의 광전 소자의 제조 방법 - Google Patents

복수의 광전 소자의 제조 방법 Download PDF

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Publication number
KR101587299B1
KR101587299B1 KR1020107020383A KR20107020383A KR101587299B1 KR 101587299 B1 KR101587299 B1 KR 101587299B1 KR 1020107020383 A KR1020107020383 A KR 1020107020383A KR 20107020383 A KR20107020383 A KR 20107020383A KR 101587299 B1 KR101587299 B1 KR 101587299B1
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semiconductor body
semiconductor
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layer
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KR20110025164A (ko
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시그프레이드 헤르만
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오스람 옵토 세미컨덕터스 게엠베하
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
KR1020107020383A 2008-06-30 2009-06-18 복수의 광전 소자의 제조 방법 Expired - Fee Related KR101587299B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008030815.3 2008-06-30
DE102008030815A DE102008030815A1 (de) 2008-06-30 2008-06-30 Verfahren zur Herstellung einer Vielzahl von optoelektronischen Bauelementen

Publications (2)

Publication Number Publication Date
KR20110025164A KR20110025164A (ko) 2011-03-09
KR101587299B1 true KR101587299B1 (ko) 2016-02-02

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KR1020107020383A Expired - Fee Related KR101587299B1 (ko) 2008-06-30 2009-06-18 복수의 광전 소자의 제조 방법

Country Status (7)

Country Link
US (1) US8431422B2 (enExample)
EP (1) EP2294614B1 (enExample)
JP (1) JP5693450B2 (enExample)
KR (1) KR101587299B1 (enExample)
CN (1) CN101983428B (enExample)
DE (1) DE102008030815A1 (enExample)
WO (1) WO2010000224A2 (enExample)

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US8816383B2 (en) * 2012-07-06 2014-08-26 Invensas Corporation High performance light emitting diode with vias
DE102012217776A1 (de) 2012-09-28 2014-06-12 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102013107862A1 (de) 2013-07-23 2015-01-29 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung zumindest eines oberflächenmontierbaren optoelektronischen Halbleiterbauteils
DE102014114188B4 (de) * 2014-09-30 2022-01-20 Osram Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
DE102015103835A1 (de) * 2015-03-16 2016-09-22 Osram Opto Semiconductors Gmbh Lichtemittierendes Bauelement und Verfahren zur Herstellung eines lichtemittierenden Bauelements
JP6217711B2 (ja) 2015-08-21 2017-10-25 日亜化学工業株式会社 発光装置の製造方法
TWI688121B (zh) 2018-08-24 2020-03-11 隆達電子股份有限公司 發光二極體結構
US11038088B2 (en) 2019-10-14 2021-06-15 Lextar Electronics Corporation Light emitting diode package
CN111883552B (zh) * 2020-08-04 2023-09-05 厦门乾照光电股份有限公司 一种集成式led芯片模组及其制作、测试、切割方法
CN118472152B (zh) * 2024-07-12 2024-09-17 诺视科技(浙江)有限公司 集成反射穹顶的微显示器件及其制备方法

Citations (3)

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US20020055200A1 (en) * 2000-06-30 2002-05-09 Takayuki Kondo Process of mounting elements and optical transmission apparatus
JP2008027999A (ja) * 2006-07-19 2008-02-07 Matsushita Electric Ind Co Ltd 発光装置の製造方法および発光装置
US20080079015A1 (en) * 2006-09-29 2008-04-03 Benjamin Claus Krummacher Optoelectronic component having a luminescence conversion layer

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US5104824A (en) * 1990-11-06 1992-04-14 Bell Communications Research, Inc. Selective area regrowth for surface-emitting lasers and other sharp features
JPH11177138A (ja) * 1997-12-11 1999-07-02 Stanley Electric Co Ltd 面実装型装置およびこれを用いた発光装置または受光装置
US6432752B1 (en) * 2000-08-17 2002-08-13 Micron Technology, Inc. Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
TW473951B (en) 2001-01-17 2002-01-21 Siliconware Precision Industries Co Ltd Non-leaded quad flat image sensor package
DE10128271C1 (de) * 2001-06-12 2002-11-28 Liz Electronics Corp Verfahren zur Herstellung von Dioden
DE10222609B4 (de) * 2002-04-15 2008-07-10 Schott Ag Verfahren zur Herstellung strukturierter Schichten auf Substraten und verfahrensgemäß beschichtetes Substrat
DE10235332A1 (de) * 2002-08-01 2004-02-19 Infineon Technologies Ag Mehrlagiger Schaltungsträger und Herstellung desselben
DE10245930A1 (de) * 2002-09-30 2004-04-08 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Bauelement-Modul
JP4603368B2 (ja) * 2003-02-28 2010-12-22 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 構造化された金属被覆を施されたパッケージボディを有するオプトエレクトロニクス素子、この種の素子を製作する方法、およびプラスチックを含むボディに、構造化された金属被覆を施す方法
JP2004304161A (ja) * 2003-03-14 2004-10-28 Sony Corp 発光素子、発光装置、画像表示装置、発光素子の製造方法及び画像表示装置の製造方法
US20070126016A1 (en) * 2005-05-12 2007-06-07 Epistar Corporation Light emitting device and manufacture method thereof
US7084496B2 (en) * 2004-01-14 2006-08-01 International Business Machines Corporation Method and apparatus for providing optoelectronic communication with an electronic device
AU2005232074A1 (en) * 2004-03-29 2005-10-20 LumaChip, Inc. Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
DE102004021233A1 (de) * 2004-04-30 2005-12-01 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung
JP2006108204A (ja) * 2004-10-01 2006-04-20 Renesas Technology Corp 半導体モジュール及び電子装置
DE102006032047A1 (de) * 2006-07-10 2008-01-24 Schott Ag Verfahren zur Herstellung optoelektronischer Bauelemente und damit hergestellte Erzeugnisse
DE102007004303A1 (de) 2006-08-04 2008-02-07 Osram Opto Semiconductors Gmbh Dünnfilm-Halbleiterbauelement und Bauelement-Verbund
WO2008086090A1 (en) * 2007-01-05 2008-07-17 University Of Washington Self-assembled heterogeneous integrated optical analysis system
DE102007008524A1 (de) * 2007-02-21 2008-08-28 Osram Opto Semiconductors Gmbh Strahlung emittierender Chip mit mindestens einem Halbleiterkörper
DE102007030129A1 (de) * 2007-06-29 2009-01-02 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente und optoelektronisches Bauelement
DE102007043877A1 (de) 2007-06-29 2009-01-08 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Bauelementen und optoelektronisches Bauelement
DE102008013030A1 (de) 2007-12-14 2009-06-25 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung
DE102008014094A1 (de) 2008-03-13 2009-09-17 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020055200A1 (en) * 2000-06-30 2002-05-09 Takayuki Kondo Process of mounting elements and optical transmission apparatus
JP2008027999A (ja) * 2006-07-19 2008-02-07 Matsushita Electric Ind Co Ltd 発光装置の製造方法および発光装置
US20080079015A1 (en) * 2006-09-29 2008-04-03 Benjamin Claus Krummacher Optoelectronic component having a luminescence conversion layer

Also Published As

Publication number Publication date
DE102008030815A1 (de) 2009-12-31
CN101983428B (zh) 2013-06-12
WO2010000224A2 (de) 2010-01-07
JP2011526418A (ja) 2011-10-06
EP2294614B1 (de) 2017-11-22
WO2010000224A3 (de) 2010-03-04
JP5693450B2 (ja) 2015-04-01
US8431422B2 (en) 2013-04-30
KR20110025164A (ko) 2011-03-09
EP2294614A2 (de) 2011-03-16
US20110086447A1 (en) 2011-04-14
CN101983428A (zh) 2011-03-02

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