KR101574910B1 - 접착 시트 - Google Patents

접착 시트 Download PDF

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Publication number
KR101574910B1
KR101574910B1 KR1020147002017A KR20147002017A KR101574910B1 KR 101574910 B1 KR101574910 B1 KR 101574910B1 KR 1020147002017 A KR1020147002017 A KR 1020147002017A KR 20147002017 A KR20147002017 A KR 20147002017A KR 101574910 B1 KR101574910 B1 KR 101574910B1
Authority
KR
South Korea
Prior art keywords
adhesive
film
adhesive layer
adhesive film
hole
Prior art date
Application number
KR1020147002017A
Other languages
English (en)
Korean (ko)
Other versions
KR20140035502A (ko
Inventor
마사미 아오야마
히로미츠 마루야마
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20140035502A publication Critical patent/KR20140035502A/ko
Application granted granted Critical
Publication of KR101574910B1 publication Critical patent/KR101574910B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020147002017A 2012-04-02 2013-03-28 접착 시트 KR101574910B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-083642 2012-04-02
JP2012083642A JP5158908B1 (ja) 2012-04-02 2012-04-02 接着シート
PCT/JP2013/059326 WO2013150963A1 (ja) 2012-04-02 2013-03-28 接着シート

Publications (2)

Publication Number Publication Date
KR20140035502A KR20140035502A (ko) 2014-03-21
KR101574910B1 true KR101574910B1 (ko) 2015-12-04

Family

ID=48013550

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147002017A KR101574910B1 (ko) 2012-04-02 2013-03-28 접착 시트

Country Status (7)

Country Link
JP (1) JP5158908B1 (ja)
KR (1) KR101574910B1 (ja)
CN (1) CN103781864B (ja)
MY (1) MY167806A (ja)
PH (1) PH12014502050A1 (ja)
TW (1) TWI496868B (ja)
WO (1) WO2013150963A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5158907B1 (ja) 2012-04-02 2013-03-06 古河電気工業株式会社 接着シート
JP2016111160A (ja) * 2014-12-04 2016-06-20 古河電気工業株式会社 ウエハ加工用テープ
JP7164841B2 (ja) * 2017-01-12 2022-11-02 ナニワ化工株式会社 電子部品の仮止め用シート状基板
WO2019146607A1 (ja) * 2018-01-24 2019-08-01 リンテック株式会社 長尺積層シートおよびその巻収体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008185606A (ja) 2007-01-26 2008-08-14 Ｎｅｃディスプレイソリューションズ株式会社 画質改善装置および画質改善方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4666887B2 (ja) * 2003-03-03 2011-04-06 日立化成工業株式会社 接着シート及び接着剤つき半導体チップの製造方法
JP5063026B2 (ja) * 2005-05-10 2012-10-31 リンテック株式会社 半導体ウエハ加工用シートおよび半導体ウエハの加工方法
CA2617682A1 (en) * 2005-08-01 2007-02-08 Lintec Corporation Adhesive sheet
JP4999066B2 (ja) * 2006-12-20 2012-08-15 古河電気工業株式会社 ウェハ加工用テープ
JP2009256458A (ja) * 2008-04-16 2009-11-05 Hitachi Chem Co Ltd 粘接着シート及び半導体装置の製造方法
JP5453894B2 (ja) * 2008-04-17 2014-03-26 日立化成株式会社 接着シート
JP2012049474A (ja) * 2010-08-30 2012-03-08 Hitachi Chem Co Ltd ウェハ加工用テープ
JP5716322B2 (ja) * 2010-08-30 2015-05-13 日立化成株式会社 ウェハ加工用テープ
JP5590136B2 (ja) * 2010-10-15 2014-09-17 日立化成株式会社 ウェハ加工用テープ、ウェハ加工用テープの製造方法、及び半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008185606A (ja) 2007-01-26 2008-08-14 Ｎｅｃディスプレイソリューションズ株式会社 画質改善装置および画質改善方法

Also Published As

Publication number Publication date
JP5158908B1 (ja) 2013-03-06
MY167806A (en) 2018-09-26
CN103781864A (zh) 2014-05-07
TW201348389A (zh) 2013-12-01
KR20140035502A (ko) 2014-03-21
TWI496868B (zh) 2015-08-21
CN103781864B (zh) 2015-09-30
WO2013150963A1 (ja) 2013-10-10
JP2013213128A (ja) 2013-10-17
PH12014502050A1 (en) 2014-12-10

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