MY167806A - Adhesive sheet - Google Patents
Adhesive sheetInfo
- Publication number
- MY167806A MY167806A MYPI2014002769A MYPI2014002769A MY167806A MY 167806 A MY167806 A MY 167806A MY PI2014002769 A MYPI2014002769 A MY PI2014002769A MY PI2014002769 A MYPI2014002769 A MY PI2014002769A MY 167806 A MY167806 A MY 167806A
- Authority
- MY
- Malaysia
- Prior art keywords
- pressure
- film
- adhesive layer
- sensitive adhesive
- label
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012083642A JP5158908B1 (ja) | 2012-04-02 | 2012-04-02 | 接着シート |
Publications (1)
Publication Number | Publication Date |
---|---|
MY167806A true MY167806A (en) | 2018-09-26 |
Family
ID=48013550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2014002769A MY167806A (en) | 2012-04-02 | 2013-03-28 | Adhesive sheet |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5158908B1 (ja) |
KR (1) | KR101574910B1 (ja) |
CN (1) | CN103781864B (ja) |
MY (1) | MY167806A (ja) |
PH (1) | PH12014502050A1 (ja) |
TW (1) | TWI496868B (ja) |
WO (1) | WO2013150963A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5158907B1 (ja) | 2012-04-02 | 2013-03-06 | 古河電気工業株式会社 | 接着シート |
JP2016111160A (ja) * | 2014-12-04 | 2016-06-20 | 古河電気工業株式会社 | ウエハ加工用テープ |
JP7164841B2 (ja) * | 2017-01-12 | 2022-11-02 | ナニワ化工株式会社 | 電子部品の仮止め用シート状基板 |
WO2019146607A1 (ja) * | 2018-01-24 | 2019-08-01 | リンテック株式会社 | 長尺積層シートおよびその巻収体 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4666887B2 (ja) * | 2003-03-03 | 2011-04-06 | 日立化成工業株式会社 | 接着シート及び接着剤つき半導体チップの製造方法 |
JP5063026B2 (ja) * | 2005-05-10 | 2012-10-31 | リンテック株式会社 | 半導体ウエハ加工用シートおよび半導体ウエハの加工方法 |
EP1916284A4 (en) * | 2005-08-01 | 2009-03-11 | Lintec Corp | ADHESIVE SHEET |
JP4999066B2 (ja) * | 2006-12-20 | 2012-08-15 | 古河電気工業株式会社 | ウェハ加工用テープ |
JP4829802B2 (ja) | 2007-01-26 | 2011-12-07 | Necディスプレイソリューションズ株式会社 | 画質改善装置および画質改善方法 |
JP2009256458A (ja) * | 2008-04-16 | 2009-11-05 | Hitachi Chem Co Ltd | 粘接着シート及び半導体装置の製造方法 |
JP5453894B2 (ja) * | 2008-04-17 | 2014-03-26 | 日立化成株式会社 | 接着シート |
JP5716322B2 (ja) * | 2010-08-30 | 2015-05-13 | 日立化成株式会社 | ウェハ加工用テープ |
JP2012049474A (ja) * | 2010-08-30 | 2012-03-08 | Hitachi Chem Co Ltd | ウェハ加工用テープ |
CN103155109B (zh) * | 2010-10-15 | 2017-08-11 | 日立化成株式会社 | 晶圆加工用胶带、晶圆加工用胶带的制造方法以及半导体装置的制造方法 |
-
2012
- 2012-04-02 JP JP2012083642A patent/JP5158908B1/ja active Active
-
2013
- 2013-03-25 TW TW102110488A patent/TWI496868B/zh active
- 2013-03-28 WO PCT/JP2013/059326 patent/WO2013150963A1/ja active Application Filing
- 2013-03-28 CN CN201380002905.6A patent/CN103781864B/zh not_active Expired - Fee Related
- 2013-03-28 KR KR1020147002017A patent/KR101574910B1/ko active IP Right Grant
- 2013-03-28 MY MYPI2014002769A patent/MY167806A/en unknown
-
2014
- 2014-09-15 PH PH12014502050A patent/PH12014502050A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2013213128A (ja) | 2013-10-17 |
WO2013150963A1 (ja) | 2013-10-10 |
CN103781864A (zh) | 2014-05-07 |
KR20140035502A (ko) | 2014-03-21 |
JP5158908B1 (ja) | 2013-03-06 |
PH12014502050A1 (en) | 2014-12-10 |
TW201348389A (zh) | 2013-12-01 |
KR101574910B1 (ko) | 2015-12-04 |
CN103781864B (zh) | 2015-09-30 |
TWI496868B (zh) | 2015-08-21 |
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