PH12014502050A1 - Adhesive sheet - Google Patents

Adhesive sheet

Info

Publication number
PH12014502050A1
PH12014502050A1 PH12014502050A PH12014502050A PH12014502050A1 PH 12014502050 A1 PH12014502050 A1 PH 12014502050A1 PH 12014502050 A PH12014502050 A PH 12014502050A PH 12014502050 A PH12014502050 A PH 12014502050A PH 12014502050 A1 PH12014502050 A1 PH 12014502050A1
Authority
PH
Philippines
Prior art keywords
adhesive
film
adhesive layer
adhesive sheet
label
Prior art date
Application number
PH12014502050A
Inventor
Aoyama Masami
Maruyama Hiromitsu
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of PH12014502050A1 publication Critical patent/PH12014502050A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Provided is an adhesive sheet which suppresses voids from occurring between an adhesive layer and an adhesive film, and which, even if the expansion amount and/or speed is increased, favorably expands without the adhesive film tearing. An adhesive sheet (10) wound into a roll shape comprises a rectangular release film (11), an adhesive layer (12) provided in a label form on the release film (11), and an adhesive film (13) comprising a label part (13a) which covers the adhesive layer (12) and contacts the release film (11) in the periphery of the adhesive layer (12), and a peripheral part (13b) which surrounds the outer side of the label part (13a), wherein through-holes (14) passing through the adhesive film (13) are provided outside of the portion of the adhesive layer (12) corresponding to an adherend-foreseen portion (c), inside of the label part (13a), and in positions of the adhesive film (13) including an adherend-foreseen portion (R).
PH12014502050A 2012-04-02 2014-09-15 Adhesive sheet PH12014502050A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012083642A JP5158908B1 (en) 2012-04-02 2012-04-02 Adhesive sheet
PCT/JP2013/059326 WO2013150963A1 (en) 2012-04-02 2013-03-28 Adhesive sheet

Publications (1)

Publication Number Publication Date
PH12014502050A1 true PH12014502050A1 (en) 2014-12-10

Family

ID=48013550

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12014502050A PH12014502050A1 (en) 2012-04-02 2014-09-15 Adhesive sheet

Country Status (7)

Country Link
JP (1) JP5158908B1 (en)
KR (1) KR101574910B1 (en)
CN (1) CN103781864B (en)
MY (1) MY167806A (en)
PH (1) PH12014502050A1 (en)
TW (1) TWI496868B (en)
WO (1) WO2013150963A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5158907B1 (en) 2012-04-02 2013-03-06 古河電気工業株式会社 Adhesive sheet
JP2016111160A (en) * 2014-12-04 2016-06-20 古河電気工業株式会社 Tape for wafer processing
JP7164841B2 (en) * 2017-01-12 2022-11-02 ナニワ化工株式会社 Sheet substrate for temporary fixing of electronic parts
JP7402052B2 (en) * 2018-01-24 2023-12-20 リンテック株式会社 Long laminated sheets and their rolls

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4666887B2 (en) * 2003-03-03 2011-04-06 日立化成工業株式会社 Adhesive sheet and method for manufacturing semiconductor chip with adhesive
JP5063026B2 (en) * 2005-05-10 2012-10-31 リンテック株式会社 Semiconductor wafer processing sheet and semiconductor wafer processing method
AU2006276650A1 (en) * 2005-08-01 2007-02-08 Lintec Corporation Adhesive sheet
JP4999066B2 (en) * 2006-12-20 2012-08-15 古河電気工業株式会社 Wafer processing tape
JP4829802B2 (en) 2007-01-26 2011-12-07 Ｎｅｃディスプレイソリューションズ株式会社 Image quality improving apparatus and image quality improving method
JP2009256458A (en) * 2008-04-16 2009-11-05 Hitachi Chem Co Ltd Pressure-sensitive adhesive sheet and method for manufacturing semiconductor device
JP5453894B2 (en) * 2008-04-17 2014-03-26 日立化成株式会社 Adhesive sheet
JP5716322B2 (en) * 2010-08-30 2015-05-13 日立化成株式会社 Wafer processing tape
JP2012049474A (en) * 2010-08-30 2012-03-08 Hitachi Chem Co Ltd Wafer process tape
CN103155109B (en) * 2010-10-15 2017-08-11 日立化成株式会社 The manufacture method of wafer processing adhesive tape, the manufacture method of wafer processing adhesive tape and semiconductor device

Also Published As

Publication number Publication date
MY167806A (en) 2018-09-26
CN103781864A (en) 2014-05-07
TW201348389A (en) 2013-12-01
KR20140035502A (en) 2014-03-21
WO2013150963A1 (en) 2013-10-10
JP2013213128A (en) 2013-10-17
TWI496868B (en) 2015-08-21
KR101574910B1 (en) 2015-12-04
JP5158908B1 (en) 2013-03-06
CN103781864B (en) 2015-09-30

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