KR101559741B1 - 본딩 장치용 히터 및 그 냉각 방법 - Google Patents

본딩 장치용 히터 및 그 냉각 방법 Download PDF

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Publication number
KR101559741B1
KR101559741B1 KR1020147024142A KR20147024142A KR101559741B1 KR 101559741 B1 KR101559741 B1 KR 101559741B1 KR 1020147024142 A KR1020147024142 A KR 1020147024142A KR 20147024142 A KR20147024142 A KR 20147024142A KR 101559741 B1 KR101559741 B1 KR 101559741B1
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South Korea
Prior art keywords
capillary
cooling
heater
insulating material
heat insulating
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KR1020147024142A
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English (en)
Korean (ko)
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KR20140128380A (ko
Inventor
코헤이 세야마
야스히로 치다
오사무 카쿠타니
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가부시키가이샤 신가와
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Application granted granted Critical
Publication of KR101559741B1 publication Critical patent/KR101559741B1/ko
Assigned to 가부시키가이샤 신가와 reassignment 가부시키가이샤 신가와 권리의 전부이전등록 Assignors: 야마하 모터 로보틱스 홀딩스 가부시키가이샤
Assigned to 야마하 로보틱스 가부시키가이샤 reassignment 야마하 로보틱스 가부시키가이샤 권리의 전부이전등록 Assignors: 가부시키가이샤 신가와
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07152—Means for cooling

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
  • Resistance Heating (AREA)
KR1020147024142A 2012-07-20 2013-04-11 본딩 장치용 히터 및 그 냉각 방법 Active KR101559741B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-161304 2012-07-20
JP2012161304A JP5793473B2 (ja) 2012-07-20 2012-07-20 ボンディング装置用ヒータ及びその冷却方法
PCT/JP2013/060908 WO2014013764A1 (ja) 2012-07-20 2013-04-11 ボンディング装置用ヒータ及びその冷却方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020157017088A Division KR20150082673A (ko) 2012-07-20 2013-04-11 본딩 장치용 히터 및 그 냉각 방법

Publications (2)

Publication Number Publication Date
KR20140128380A KR20140128380A (ko) 2014-11-05
KR101559741B1 true KR101559741B1 (ko) 2015-10-13

Family

ID=49948601

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020147024142A Active KR101559741B1 (ko) 2012-07-20 2013-04-11 본딩 장치용 히터 및 그 냉각 방법
KR1020157017088A Ceased KR20150082673A (ko) 2012-07-20 2013-04-11 본딩 장치용 히터 및 그 냉각 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020157017088A Ceased KR20150082673A (ko) 2012-07-20 2013-04-11 본딩 장치용 히터 및 그 냉각 방법

Country Status (7)

Country Link
US (1) US10350692B2 (https=)
JP (1) JP5793473B2 (https=)
KR (2) KR101559741B1 (https=)
CN (1) CN104520980B (https=)
SG (1) SG11201500238RA (https=)
TW (2) TWI489598B (https=)
WO (1) WO2014013764A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9093549B2 (en) * 2013-07-02 2015-07-28 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US9659902B2 (en) * 2014-02-28 2017-05-23 Kulicke And Soffa Industries, Inc. Thermocompression bonding systems and methods of operating the same
JP6176542B2 (ja) * 2015-04-22 2017-08-09 パナソニックＩｐマネジメント株式会社 電子部品ボンディングヘッド
JP6457905B2 (ja) * 2015-08-31 2019-01-23 株式会社イチネンジコー ヒータ
JP6529865B2 (ja) * 2015-08-31 2019-06-12 株式会社イチネンジコー ヒータ
JP6632856B2 (ja) * 2015-10-16 2020-01-22 東レエンジニアリング株式会社 ボンディングヘッドおよび実装装置
JP6836317B2 (ja) * 2015-10-16 2021-02-24 東レエンジニアリング株式会社 ボンディングヘッドおよび実装装置
CN109196629B (zh) * 2016-03-24 2021-12-07 株式会社新川 接合装置
CN107825011A (zh) * 2017-11-10 2018-03-23 普尔思（苏州）无线通讯产品有限公司 一种能够控制温度的焊接系统
JP6680930B2 (ja) * 2019-05-15 2020-04-15 株式会社イチネンジコー ヒータ
JP6850854B2 (ja) * 2019-11-18 2021-03-31 東レエンジニアリング株式会社 ボンディングヘッドおよび実装装置
TWI834007B (zh) * 2019-11-19 2024-03-01 日商新川股份有限公司 半導體裝置的製造裝置及製造方法
WO2022029916A1 (ja) 2020-08-05 2022-02-10 株式会社新川 実装装置及び実装方法
KR102604789B1 (ko) * 2020-11-30 2023-11-21 세메스 주식회사 히터 조립체 및 이를 포함하는 본딩 헤드
CN114981939B (zh) * 2020-12-28 2026-01-30 雅马哈智能机器株式会社 安装头
TWI791287B (zh) * 2021-09-16 2023-02-01 日商新川股份有限公司 封裝裝置以及封裝方法
TWI876430B (zh) * 2023-07-19 2025-03-11 日月光半導體製造股份有限公司 熱壓組件
US20250326073A1 (en) * 2024-04-23 2025-10-23 Asmpt Singapore Pte. Ltd. Bond head heater incorporating fluid chamber for cooling

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004063947A (ja) 2002-07-31 2004-02-26 Kyocera Corp 加熱装置
JP2007165897A (ja) 2005-12-09 2007-06-28 General Electric Co <Ge> 電子デバイス冷却システムを製造する方法
JP2007329306A (ja) 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd 熱圧着装置

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US5592363A (en) 1992-09-30 1997-01-07 Hitachi, Ltd. Electronic apparatus
US5453641A (en) * 1992-12-16 1995-09-26 Sdl, Inc. Waste heat removal system
JP3255871B2 (ja) * 1997-03-31 2002-02-12 住友大阪セメント株式会社 パルスヒーター及び半導体チップ実装ボードの製法
JPH11204994A (ja) 1998-01-14 1999-07-30 Hitachi Ltd 素子搭載装置
JP2000277567A (ja) * 1999-03-25 2000-10-06 Ngk Insulators Ltd ボンディング用ヒータ
JP2002016091A (ja) 2000-06-29 2002-01-18 Kyocera Corp 接触加熱装置
US6414271B2 (en) 2000-05-25 2002-07-02 Kyocera Corporation Contact heating device
JP2002076102A (ja) * 2000-08-31 2002-03-15 Ibiden Co Ltd セラミック基板
JP2007180505A (ja) 2005-12-02 2007-07-12 Matsushita Electric Ind Co Ltd 電子部品の冷却装置
US20070125526A1 (en) 2005-12-02 2007-06-07 Matsushita Electric Industrial Co., Ltd. Cooling device for electronic components
JP4640170B2 (ja) * 2005-12-28 2011-03-02 株式会社豊田自動織機 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置
JP2007242724A (ja) * 2006-03-06 2007-09-20 Seiko Epson Corp マイクロチャンネル構造体、マイクロチャンネル構造体の製造方法及び電子機器
WO2010131317A1 (ja) * 2009-05-11 2010-11-18 トヨタ自動車株式会社 熱交換器、半導体装置、及び、これらの製造方法
US8637794B2 (en) * 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
JP4808283B1 (ja) * 2010-06-30 2011-11-02 株式会社新川 電子部品実装装置及び電子部品実装方法
US8633423B2 (en) * 2010-10-14 2014-01-21 Applied Materials, Inc. Methods and apparatus for controlling substrate temperature in a process chamber
US9434029B2 (en) * 2011-12-20 2016-09-06 Intel Corporation High performance transient uniform cooling solution for thermal compression bonding process

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Publication number Priority date Publication date Assignee Title
JP2004063947A (ja) 2002-07-31 2004-02-26 Kyocera Corp 加熱装置
JP2007165897A (ja) 2005-12-09 2007-06-28 General Electric Co <Ge> 電子デバイス冷却システムを製造する方法
JP2007329306A (ja) 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd 熱圧着装置

Also Published As

Publication number Publication date
TW201535635A (zh) 2015-09-16
US20150183040A1 (en) 2015-07-02
TW201405731A (zh) 2014-02-01
US10350692B2 (en) 2019-07-16
TWI489598B (zh) 2015-06-21
KR20140128380A (ko) 2014-11-05
WO2014013764A1 (ja) 2014-01-23
CN104520980B (zh) 2017-07-07
KR20150082673A (ko) 2015-07-15
CN104520980A (zh) 2015-04-15
JP5793473B2 (ja) 2015-10-14
JP2014022629A (ja) 2014-02-03
SG11201500238RA (en) 2015-03-30

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