KR101537518B1 - 탄소 나노-튜브 가역 저항-스위칭 소자를 포함한 메모리 셀과 이를 형성하는 방법 - Google Patents
탄소 나노-튜브 가역 저항-스위칭 소자를 포함한 메모리 셀과 이를 형성하는 방법 Download PDFInfo
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- KR101537518B1 KR101537518B1 KR1020107022549A KR20107022549A KR101537518B1 KR 101537518 B1 KR101537518 B1 KR 101537518B1 KR 1020107022549 A KR1020107022549 A KR 1020107022549A KR 20107022549 A KR20107022549 A KR 20107022549A KR 101537518 B1 KR101537518 B1 KR 101537518B1
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- forming
- resistivity
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- switching material
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/02—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change
- G11C13/025—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change using fullerenes, e.g. C60, or nanotubes, e.g. carbon or silicon nanotubes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
- H10B63/84—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays arranged in a direction perpendicular to the substrate, e.g. 3D cell arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
- H10D62/119—Nanowire, nanosheet or nanotube semiconductor bodies
- H10D62/121—Nanowire, nanosheet or nanotube semiconductor bodies oriented parallel to substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
- H10D62/119—Nanowire, nanosheet or nanotube semiconductor bodies
- H10D62/122—Nanowire, nanosheet or nanotube semiconductor bodies oriented at angles to substrates, e.g. perpendicular to substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
- H10D62/119—Nanowire, nanosheet or nanotube semiconductor bodies
- H10D62/123—Nanowire, nanosheet or nanotube semiconductor bodies comprising junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/881—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being a two-dimensional material
- H10D62/882—Graphene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/021—Formation of switching materials, e.g. deposition of layers
- H10N70/023—Formation of switching materials, e.g. deposition of layers by chemical vapor deposition, e.g. MOCVD, ALD
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/041—Modification of switching materials after formation, e.g. doping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/061—Shaping switching materials
- H10N70/066—Shaping switching materials by filling of openings, e.g. damascene method
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/884—Switching materials based on at least one element of group IIIA, IVA or VA, e.g. elemental or compound semiconductors
- H10N70/8845—Carbon or carbides
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/10—Resistive cells; Technology aspects
- G11C2213/19—Memory cell comprising at least a nanowire and only two terminals
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/71—Three dimensional array
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/72—Array wherein the access device being a diode
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US4432808P | 2008-04-11 | 2008-04-11 | |
| US61/044,328 | 2008-04-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110005799A KR20110005799A (ko) | 2011-01-19 |
| KR101537518B1 true KR101537518B1 (ko) | 2015-07-17 |
Family
ID=41228690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107022549A Expired - Fee Related KR101537518B1 (ko) | 2008-04-11 | 2009-04-10 | 탄소 나노-튜브 가역 저항-스위칭 소자를 포함한 메모리 셀과 이를 형성하는 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7977667B2 (enExample) |
| EP (1) | EP2263273B1 (enExample) |
| JP (1) | JP5469159B2 (enExample) |
| KR (1) | KR101537518B1 (enExample) |
| CN (1) | CN102027610B (enExample) |
| TW (1) | TW201001629A (enExample) |
| WO (1) | WO2009137222A2 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8569730B2 (en) | 2008-07-08 | 2013-10-29 | Sandisk 3D Llc | Carbon-based interface layer for a memory device and methods of forming the same |
| US20100032639A1 (en) | 2008-08-07 | 2010-02-11 | Sandisk 3D Llc | Memory cell that includes a carbon-based memory element and methods of forming the same |
| WO2010019789A1 (en) * | 2008-08-13 | 2010-02-18 | Sandisk 3D, Llc | Methods and apparatus for increasing memory density using diode layer sharing |
| US8835892B2 (en) | 2008-10-30 | 2014-09-16 | Sandisk 3D Llc | Electronic devices including carbon nano-tube films having boron nitride-based liners, and methods of forming the same |
| US8421050B2 (en) | 2008-10-30 | 2013-04-16 | Sandisk 3D Llc | Electronic devices including carbon nano-tube films having carbon-based liners, and methods of forming the same |
| US8183121B2 (en) * | 2009-03-31 | 2012-05-22 | Sandisk 3D Llc | Carbon-based films, and methods of forming the same, having dielectric filler material and exhibiting reduced thermal resistance |
| JP5611574B2 (ja) | 2009-11-30 | 2014-10-22 | 株式会社東芝 | 抵抗変化メモリ及びその製造方法 |
| KR20110098441A (ko) * | 2010-02-26 | 2011-09-01 | 삼성전자주식회사 | 그라핀 전자 소자 및 제조방법 |
| US8481394B2 (en) | 2010-03-04 | 2013-07-09 | Sandisk 3D Llc | Memory cell that includes a carbon-based memory element and methods of forming the same |
| JP2011222952A (ja) * | 2010-03-24 | 2011-11-04 | Toshiba Corp | 抵抗変化メモリ |
| JP2012004277A (ja) | 2010-06-16 | 2012-01-05 | Toshiba Corp | 不揮発性半導体記憶装置および不揮発性半導体記憶装置の製造方法 |
| JP5525946B2 (ja) | 2010-07-14 | 2014-06-18 | 株式会社東芝 | 不揮発性記憶装置の製造方法 |
| JP5580126B2 (ja) * | 2010-07-14 | 2014-08-27 | 株式会社東芝 | 不揮発性記憶装置及びその製造方法 |
| CN102157684B (zh) * | 2010-12-17 | 2015-04-15 | 天津理工大学 | 一种利用碳纳米管作为固态电解液的阻变存储器 |
| US8699259B2 (en) | 2011-03-02 | 2014-04-15 | Sandisk 3D Llc | Non-volatile storage system using opposite polarity programming signals for MIM memory cell |
| US20130075685A1 (en) * | 2011-09-22 | 2013-03-28 | Yubao Li | Methods and apparatus for including an air gap in carbon-based memory devices |
| US9251934B2 (en) * | 2013-01-11 | 2016-02-02 | Infineon Technologies Ag | Method for manufacturing a plurality of nanowires |
| WO2014138124A1 (en) | 2013-03-04 | 2014-09-12 | Sandisk 3D Llc | Vertical bit line non-volatile memory systems and methods of fabrication |
| US9214332B2 (en) * | 2014-03-20 | 2015-12-15 | International Business Machines Corporation | Composite dielectric materials with improved mechanical and electrical properties |
| US9450023B1 (en) | 2015-04-08 | 2016-09-20 | Sandisk Technologies Llc | Vertical bit line non-volatile memory with recessed word lines |
| US9923139B2 (en) * | 2016-03-11 | 2018-03-20 | Micron Technology, Inc. | Conductive hard mask for memory device formation |
| CN107887425B (zh) * | 2016-09-30 | 2020-05-12 | 中芯国际集成电路制造(北京)有限公司 | 半导体装置的制造方法 |
| KR102767605B1 (ko) * | 2017-02-20 | 2025-02-17 | 에스케이하이닉스 주식회사 | 카본 나노 튜브들을 갖는 시냅스를 포함하는 뉴로모픽 소자 |
| CN110400872B (zh) * | 2018-04-24 | 2024-02-23 | 中芯国际集成电路制造(天津)有限公司 | 碳纳米管存储结构的制造方法及半导体器件的制造方法 |
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| US8236623B2 (en) | 2007-12-31 | 2012-08-07 | Sandisk 3D Llc | Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element and methods of forming the same |
| US20090166610A1 (en) | 2007-12-31 | 2009-07-02 | April Schricker | Memory cell with planarized carbon nanotube layer and methods of forming the same |
| US8558220B2 (en) | 2007-12-31 | 2013-10-15 | Sandisk 3D Llc | Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element formed over a bottom conductor and methods of forming the same |
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-
2009
- 2009-04-10 TW TW098112118A patent/TW201001629A/zh unknown
- 2009-04-10 KR KR1020107022549A patent/KR101537518B1/ko not_active Expired - Fee Related
- 2009-04-10 JP JP2011504206A patent/JP5469159B2/ja not_active Expired - Fee Related
- 2009-04-10 CN CN2009801172089A patent/CN102027610B/zh active Active
- 2009-04-10 US US12/421,823 patent/US7977667B2/en not_active Expired - Fee Related
- 2009-04-10 EP EP09743209A patent/EP2263273B1/en active Active
- 2009-04-10 WO PCT/US2009/040222 patent/WO2009137222A2/en not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040251551A1 (en) * | 2003-06-11 | 2004-12-16 | Horii Hideki | Phase changeable memory devices including carbon nano tubes and methods for forming the same |
| US20070205792A1 (en) * | 2006-03-06 | 2007-09-06 | Micron Technology, Inc. | Semiconductor packages, methods of forming semiconductor packages, and methods of cooling semiconductor dies |
| WO2008021900A2 (en) * | 2006-08-08 | 2008-02-21 | Nantero, Inc. | Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5469159B2 (ja) | 2014-04-09 |
| US20100072445A1 (en) | 2010-03-25 |
| EP2263273B1 (en) | 2012-05-16 |
| CN102027610A (zh) | 2011-04-20 |
| TW201001629A (en) | 2010-01-01 |
| EP2263273A2 (en) | 2010-12-22 |
| JP2011517123A (ja) | 2011-05-26 |
| WO2009137222A2 (en) | 2009-11-12 |
| WO2009137222A3 (en) | 2010-01-07 |
| CN102027610B (zh) | 2012-12-05 |
| KR20110005799A (ko) | 2011-01-19 |
| US7977667B2 (en) | 2011-07-12 |
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