KR101523293B1 - 레이저 가공 장치 - Google Patents
레이저 가공 장치 Download PDFInfo
- Publication number
- KR101523293B1 KR101523293B1 KR1020080038670A KR20080038670A KR101523293B1 KR 101523293 B1 KR101523293 B1 KR 101523293B1 KR 1020080038670 A KR1020080038670 A KR 1020080038670A KR 20080038670 A KR20080038670 A KR 20080038670A KR 101523293 B1 KR101523293 B1 KR 101523293B1
- Authority
- KR
- South Korea
- Prior art keywords
- optical axis
- imaging
- image
- spatial modulation
- modulation element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007120812A JP5086687B2 (ja) | 2007-05-01 | 2007-05-01 | レーザ加工装置 |
JPJP-P-2007-00120812 | 2007-05-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080097340A KR20080097340A (ko) | 2008-11-05 |
KR101523293B1 true KR101523293B1 (ko) | 2015-05-27 |
Family
ID=40051446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080038670A Expired - Fee Related KR101523293B1 (ko) | 2007-05-01 | 2008-04-25 | 레이저 가공 장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5086687B2 (enrdf_load_stackoverflow) |
KR (1) | KR101523293B1 (enrdf_load_stackoverflow) |
CN (1) | CN101298117B (enrdf_load_stackoverflow) |
TW (1) | TWI405633B (enrdf_load_stackoverflow) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5301955B2 (ja) * | 2008-11-13 | 2013-09-25 | オリンパス株式会社 | 欠陥修正装置 |
JP5346690B2 (ja) * | 2009-05-26 | 2013-11-20 | オリンパス株式会社 | レーザ照射装置 |
DE102010020183B4 (de) * | 2010-05-11 | 2013-07-11 | Precitec Kg | Laserschneidkopf und Verfahren zum Schneiden eines Werkstücks mittels eines Laserschneidkopfes |
TWI642507B (zh) | 2011-12-16 | 2018-12-01 | 應用材料股份有限公司 | 用於雷射處理設備的輻射源及多重光束組合器 |
CN102608875A (zh) * | 2012-03-27 | 2012-07-25 | 深圳市华星光电技术有限公司 | 基于修补机台的玻璃基板补刻号方法及玻璃基板补刻号装置 |
CN103203541B (zh) * | 2013-02-04 | 2015-05-13 | 张立国 | 一种激光加工装置 |
CN104375383B (zh) * | 2013-08-13 | 2017-08-29 | 上海微电子装备有限公司 | 用于光刻设备的调焦调平检测装置及方法 |
JP6321932B2 (ja) * | 2013-09-24 | 2018-05-09 | 株式会社小糸製作所 | 車両用前照灯 |
CN104227243A (zh) * | 2014-09-11 | 2014-12-24 | 深圳英诺激光科技有限公司 | 一种硬质材料激光深加工设备及加工方法 |
CN106141457B (zh) * | 2016-07-19 | 2018-01-12 | 张立国 | 一种激光钻孔系统及激光钻孔方法 |
CN106735875B (zh) * | 2017-02-20 | 2019-01-18 | 湖北工业大学 | 一种基于液晶空间光调制器的激光柔性微加工系统及方法 |
CN107824968A (zh) * | 2017-11-08 | 2018-03-23 | 深圳泰德激光科技有限公司 | Ccd视觉定位的激光焊接装置 |
US12145214B2 (en) * | 2018-10-30 | 2024-11-19 | Hamamatsu Photonics K.K. | Laser machining head and laser machining device |
CN111098043B (zh) * | 2020-01-19 | 2024-12-27 | 中国科学院宁波材料技术与工程研究所 | 水导激光加工装置和加工系统 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09206965A (ja) * | 1996-01-26 | 1997-08-12 | Keyence Corp | レーザマーク装置 |
JP2006227198A (ja) * | 2005-02-16 | 2006-08-31 | Olympus Corp | レーザ加工装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2220936Y (zh) * | 1995-04-07 | 1996-02-28 | 中国科学院长春光学精密机械研究所 | 一种新型激光照排机 |
JP4429974B2 (ja) * | 2005-06-17 | 2010-03-10 | オリンパス株式会社 | レーザ加工方法および装置 |
TWI367800B (en) * | 2005-06-17 | 2012-07-11 | Olympus Corp | Laser beam machining method and apparatus |
JP4947933B2 (ja) * | 2005-07-26 | 2012-06-06 | オリンパス株式会社 | レーザリペア装置 |
-
2007
- 2007-05-01 JP JP2007120812A patent/JP5086687B2/ja not_active Expired - Fee Related
-
2008
- 2008-04-23 TW TW097114836A patent/TWI405633B/zh not_active IP Right Cessation
- 2008-04-25 KR KR1020080038670A patent/KR101523293B1/ko not_active Expired - Fee Related
- 2008-04-30 CN CN2008100960621A patent/CN101298117B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09206965A (ja) * | 1996-01-26 | 1997-08-12 | Keyence Corp | レーザマーク装置 |
JP2006227198A (ja) * | 2005-02-16 | 2006-08-31 | Olympus Corp | レーザ加工装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20080097340A (ko) | 2008-11-05 |
JP2008272806A (ja) | 2008-11-13 |
TW200932409A (en) | 2009-08-01 |
CN101298117A (zh) | 2008-11-05 |
JP5086687B2 (ja) | 2012-11-28 |
TWI405633B (zh) | 2013-08-21 |
CN101298117B (zh) | 2013-04-10 |
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