TW200932409A - Laser processing device - Google Patents
Laser processing device Download PDFInfo
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- TW200932409A TW200932409A TW097114836A TW97114836A TW200932409A TW 200932409 A TW200932409 A TW 200932409A TW 097114836 A TW097114836 A TW 097114836A TW 97114836 A TW97114836 A TW 97114836A TW 200932409 A TW200932409 A TW 200932409A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
Description
200932409 九、發明說明： 【發明所屬之技術領域3 發明領域 本發明關於雷射加工裝置。例如關於使用微鏡陣列所 5 構成之空間調變元件，進行液晶基板、半導體基板與印刷 - 電路基板等之缺陷的雷射加工(修復加工）的雷射加工裝置。 . 本申請案對已於2007年5月1日申請之日本發明專利申 請案第2007— 120812號主張優先權，並援用該申請案的内 ❹ 容。 1〇 【先前技術】 背景技術 習知例如在液晶顯示裝置(LCD)之製造工程上，會對於 要以光刻處理工程處理之玻璃基板進行各種檢查。一旦此 檢查結果於形成在玻璃基板上之暫存器圖形與蝕刻圖形檢 15測出缺陷部時，則多使用雷射加工裝置對缺陷部照射雷射 而去除缺陷部之雷射加工，即所謂進行修復加工的情形。 關於如此的雷射加工裝置，於專利文獻丨記載了從拍攝 玻璃基板上之缺陷部而取得之缺陷圖像資料，擷取出缺陷 部的开> 狀資料，並依據此形狀而高速地進行DMD(Digital 20 Micro minw Device)單元之各微小鏡的控制角度，並使此 等微小鏡反射之雷射光的剖面形狀與缺陷部的形狀約一 致，而照射缺陷部的修復裝置。 專利文獻1 :特開2005~~1〇3581號公報 但是’上述的習知雷射加工裝置存在有以下的問題。 5 200932409 專利文獻1記載之技術係以使D M D單元並因應缺陷部 形狀而照射業經空間調變的雷射光，因此，雖然可有效率 地進行雷射加工，但是，DMD的話，為了高速地轉動微小 鏡’係於微小鏡之對角線方向設定轉動軸的裝置，此乃一 5 般的情形。 此情形下，將反射光朝向被加工物反射之開啟狀態之 微小鏡的入射面，即射入DMD之光轴、在DMD反射後朝向 被加工面的光轴、以及包含微小鏡之法線的平面，必須與 微小鏡之轉動軸正交，因此，相對於配列有微小鏡之DMD 10 單元之矩形領域的4個邊，或是長邊及短邊的方向，必須採 用處於各個光轴彎曲之位置關係的配置。 如此的配置的話，一旦於被加工面設定矩形狀之可加 工領域，而使DMD單元配合此可加工領域之配置來配置， 則習知之構造上，配置光源與鏡等之計設構造非常複雜， 15 零件加工與組裝變得複雜。其結果則有零件加工費與組裝 工時增大而造成成本提高之重要原因的問題。 相對於配列有如此微小鏡之DMD單元之矩形領域的4 個邊方向，處於各個光軸曲折之位置關係的雷射加工裝置 之主要部分之計設構造的一例，乃參考第12圖、第13A圖、 20 第13B圖作簡單說明。第12圖表示雷射加工裝置之主要部分 之構造的立體圖。第13人圖、第13B圖係從A方向觀看第12 圖之正面圖及從B方向觀看的側面圖。 如第12圖所示，雷射加工裝置200係投影透鏡204、鏡 205、207、空間調變元件2〇6、半透鏡209、對物透鏡208及 200932409 攝影單元210等一體設置於筐體201。 藉此，射入投影透鏡204之雷射光經過光軸Ql、Q2、 Q3、Q4、Q5那般曲折的光路，而照射於被加工物，另一方 面，被加工物被已配置於光轴Q5上之攝影單元210所攝影。 5 Ο 10 15 ❹ 20 如第12圖所示，空間調變元件206長邊方向配置於Β方 向，短邊方向配置於Α方向，並配合於此，光轴Q3、Q4、 Q5配置於同一平面上。由於空間調變元件206使用DMD， 因此例如以相對於長邊方向延伸於45°方向作為旋轉軸， 而為了實現如此的光學配置，乃將射入空間調變元件206之 光軸Q2配置成相對於空間調變元件206之長邊及短邊交叉 的斜射入方向。即，分別於第12圖之A方向，相對於光軸Q3 傾斜角度a(參照第13A圖），相同地於B方向，相對於光軸Q3 傾斜角度b(參照第13B圖），並相對於包含光轴Q3、Q4、Q5 的平面，光轴Ql、Q2配置於構成曲折的位置。 因此，投影透鏡204、鏡205等之於射入空間調變元件 2〇6前的光學系統的配置極複雜，筐體2〇1之形狀也複雜， 配置於光軸Q卜q2上的構件斜斜地傾斜，因此無法構成精 簡的组元。 t 明内贫 發明概要 本發明係鑑於上述問題而完成的發明，本發明之目的 在於提供雷射加工裝置，係於使用了具有微小鏡陣列之空 間調變7L件，該微小鏡陣列係以排列於一定方向之轉動軸 為中〜且分別配置成可轉動之複數微小鏡，配列於以與延 7 200932409 伸於轉動轴交又方向之4個邊所包圍之矩形領域的雷射加 工裝置中’可提昇構成零件之零件加卫與組裝之效㈣雷 射加工裝置。 為解決上述課題，本發明之雷射加工裝置包含有：雷 5射光源；空間調變元件，係可依據微小鏡陣列而將前述: 射光源所照射之雷射光了以空間調變者，該微小鏡陣列係 以排列於-定方向之轉動軸為中心，分別配置成可轉動之 複數微小鏡，且在延伸於與前述轉動袖交叉之方向之_邊 所包圍之矩形領域内，配列於與前述4個邊相互正交之· 1〇邊延伸的方向；及，照射光學系統，係配置成前述微小鏡 2列與前述被加卫面共輊’且建構成從前述雷射光源而在 前述微小鏡陣列反射並經過前述照射光學系統至前述被加 工面之第1光轴在相同平面上。 依據本發明，由於具有從前述雷射光源而在前述微小 15鏡陣列反射並經過前述照射光學系統至前述被加工面之第 1光軸在相同平面上的構造，因此可將構成光學系統之光學 元件與光學零件等之光學構件配列於一平面上，光路之曲 折、零件配置、安裝等變得容易，可抑制零件朝向與一平 面交又之方向突出而能達到精簡的構造。 2〇 依據本發明之雷射加工裝置，由於可將第1光轴上之光 學零件配列於一平面上，因此光路之曲折與零件配置變得 容易’可達到提昇包含光學零件之保持構件等之各構成零 件之零件加工與組裝之效率的效果。 圖式簡單說明 200932409 第1圖表示本發明之第1實施樣態之雷射加工裝置之概 略構造，且係包含光軸之剖面的模式圖。 第2 A圖表示本發明之第1實施樣態之雷射加工裝置之 主要部分之外觀的正面圖。 5 第2B圖表示本發明之第1實施樣態之雷射加工裝置之 〇 主要部分之外觀的側面圖。 第3圖表示本發明之第1實施樣態之包含雷射加工裝置 之空間調變元件之光軸之剖面的剖面圖。 第4圖表示本發明之第1實施樣態之雷射加工裝置之空 10 間調變元件的模式圖。 第5A圖表示從正面觀看本發明之第1實施樣態之雷射 加工裝置之空間調變元件附近的模式圖。 第5B圖表示從第5A圖之C方向觀看本發明之第1實施 樣態之雷射加工裝置之空間調變元件的模式圖。 15 ❿ 第6圖表示本發明之第1實施樣態之雷射加工裝置之空 間調變元件之基準面與射入面之位置關係的立體圖。 第7圖表示本發明之第1實施樣態之雷射加工裝置之控 制單元之概略構造的機能方塊圖。 第8圖包含表示本發明之第2實施樣態之雷射加工裝置 20 之概略構造之光軸之剖面的模式圖。 第9A圖包含表示本發明之第2實施樣態之雷射加工裝 置之主要部分之外觀的正面圖。 第9B圖包含表示本發明之第2實施樣態之雷射加工裝 置之主要部分之外觀的上面圖。 9 200932409 第10圖表示本發明之第2實施樣態之雷射加工裝置之 控制單元之概略構造的機能方塊圖。 第11Α圖係說明本發明之第2實施樣態之雷射加工裝置 之動作的圖式。 5 第11B圖係說明本發明之第2實施樣態之雷射加工裝置 之動作的圖式。 第12圖表示雷射加工裝置之主要部分之構造之一例的 立體圖。 第13A圖係從第12圖之A方向觀看的正面圖。 10 第13B圖係從第12圖之B方向觀看的側面圖。 C實施方式3 較佳實施樣態 以下參照所附圖式來說明本發明之實施樣態。於全部 的圖式中，即使是實施樣態不同的情形下，也對相同或相 15 當的構件賦予相同符號而省略共通的說明。 [第1實施樣態] 說明本發明之第1實施樣態之雷射加工裝置。 第1圖表示本發明之第1實施樣態之雷射加工裝置之概 略構造，且係包含光軸之剖面的模式圖。第2A圖表示本發 20 明之第1實施樣態之雷射加工裝置之主要部分之外觀的正 面圖。第2B圖表示本發明之第1實施樣態之雷射加工裝置之 主要部分之外觀的侧面圖。第3圖表示本發明之第1實施樣 態之包含雷射加工裝置之空間調變元件之光軸之剖面的剖 面圖。第4圖表示本發明之第1實施樣態之雷射加工裝置之 10 200932409 空間調變元件的模式圖。第5A圖表示本發明之第^施樣態 之雷射加工裝置之空間調變元件附近的模式圖。第5B圖表 示從第5A圖之C方向觀看的模式圖。第6圖表示本發明之第 1實施樣態之雷射加工裝置之空間調變元件之基準面與射 5入面之位置關係的立體圖。第7圖表示本發明之第1實施樣 _ 態之雷射加工裝置之控制單元之概略構造的機能方塊圖。 圖中的XYZ座標系為用以方便於方向參照而設成各圖 共通的位置關係者，水平面為χγ面，從γ軸負方向朝向γ 〇 軸正方向的方向與正面觀看之方向一致（以下於其他圖亦 10 相同）。 . 又’圖式表示光束之線係模式地描繪雷射光照射於試 料之某一點時的狀態。 本實施樣態之雷射加工裝置100係以雷射光進行修復 加工的裝置。對於例如LCD(液晶顯示器）之玻璃基板與半導 15 體晶圓基板等、以光刻處理工程於基板上形成電路圖案等 被加工物，檢測出例如配線部分之短路、光阻劑之溢出等 ® 之缺陷部的狀態下，可適用於去除缺陷部之修復加工的裝 置。 雷射加工裝置100之概略構造如第1圖、第1A圖、第2B ’ 20 圖所示，由雷射光源50、加工頭20、加工頭移動機構31、 載置台21、控制單元22、顯示部30及使用者介面（參照第7 圖）所構成，作為被加工物之基板η於加工時將被加工面11a 朝向上側並水平地載置於設在加工頭之下方的載置台21 上0 11 200932409 雷射光源50係修復加工用的光源。本實施樣態採用雷 射振盪器1、結合透鏡2及光纖3所構成的構造。 雷射振盪器1係可振盪已設定了波長、輸出之雷射光而 能去除基板11上的缺陷者，例如可適宜採用可脈波振蘯之 5 YAG雷射等。又，可建構成因應修復對象而可切換複數振 盪波長。 ~ 雷射振盪器1建構成電性連接於控制單元22,且可因應 ， 來自控制單元22之控制信號而被控制振盪。 結合透鏡2係用以將雷射振盪器1射出之雷射光對光纖 © 10 3結合的光學元件。 光纖3藉著結合透鏡2而使已光結合光纖端面3a之雷射 . 光在内部傳送並導入加工頭2〇内，雷射光6〇係從光纖端面 3b射出者。雷射光60傳送於光纖3的内部之後射出，因此即 使雷射振蘯器1之雷射光為分布，也構成光量分布已均一化 15 的擴散光。 第1圖為模式圖，將雷射振盪器1沿著z方向配置著， 惟，雷射振盪器1之配置位置、姿勢不限定於此，藉著旋轉 〇 光纖3而能設定於適切的配置位置、姿勢。又，也可加入用 以使光纖的模式穩定的光纖微彎器（m〇de scramblel〇。 — 又，使雷射光均一化的機構並非如此地使用光纖3，也 - 可使用其他光學元件，例如可使用複眼透鏡、折射元件、 非球面透鏡，或使用了萬花筒型桿等各種構成之均質機 (homogenizer)等的構成。 加工頭20藉著設有適宜的驅動機構之加工頭移動機構 12 200932409 21(參照第2B圖）而將投影透鏡4、空間調變元件6、照射光 學系統8、觀察用光源16、觀察用成像透鏡12、攝影元件13 等光學元件、而將零件保持在相對於載置台已保持成可於 XYZ轴相對移動的筐體20a内。 5 本實施樣態之相對移動係藉著加工頭移動機構31而將 加工頭20朝向平行於被加工面lla的X軸方向及與被加工面 11a正交的方向（Z軸方向）移動，並藉著載置台21而將基板^ 朝Y軸方向移動時的例子來說明’惟，例如也可採用使加工 頭20朝向Z轴方向移動而載置台21朝向χγ方向移動，或是 10固定載置台21並使加工頭20朝向XYZ軸方向移動如此適宜 組合的相對移動。 投影透鏡4係使固定於筐體2〇a之光纖3之光纖端面％ 與空間調整元件6之將於後段記述之基準面M配置成共軛 的關係，並用以使光纖端面3b之像可照射空間調變元件6之 15調變領域整體，而已設定投影倍率的透鏡或透鏡群， 本實施樣態中，投影透鏡4之光軸ρ,κζχ平面，隨著從 X轴正方向朝向負方向，從Ζ軸正方向朝向負方向設定於斜 的方向。 空間調變元件6係將投影透鏡4所投射之雷射光61予以 2〇空間調變者，而由微小鏡陣列DMD構成。即，空間調變元 件6如第3圖所示，相對於基準面厘以轉動轴尺為尹心而可傾 斜角度之複數微小鏡6a’如第4圖所示，於長邊骹短邊η 之矩形狀的調變領域内，以延伸於長邊及短邊之方向作為 配列方向而配列成2次元。 13 200932409 各微小鏡6a之轉動轴R如第4圖所示，基準面Μ内相對 於調變領域之長邊傾斜角度0〗(其中0ι>〇。），相對於短 邊傾斜角度θ2(其中0 2>〇。，且(9 1+β 1 = 90。）。 本實施樣態之一例係採用12。10,= 0 2 = 45°的 5 DMD。 本實施樣態之空間調變元件6係設成長邊Wx短邊Η的矩 形狀，惟，也可為正方形，此情形下之4個邊之中，將相互 正交之2個邊的1個邊設為長邊而將另1邊設為短邊的話，以 下的說明同樣成立。 1〇 空間調變元件6之各微小鏡6a依據對應來自控制單元 22之控制信號而產生的靜電電場，在導通（〇N)狀態下例如 由基準面Μ旋轉+ 12。，在切斷（off)的狀態下由基準面Μ旋 轉一 12° 。以下將藉導通狀態之微小鏡6&所反射之光稱為 導通光（第3圖之L〇〇 ’將藉切斷狀態之微小鏡6&所反射之光 15 稱為切斷光（第3圖之Lot)。 各微小鏡6a的位置係可設為長邊方向之列號碼m、短邊 方向之行號碼n(m、η為〇以上整數）而能以（m、n)表示。 空間調變元件6之配置位置如第5Α圖、第5Β圖所示，將 基準面Μ朝向Ζ軸負方向側而排列於平行於χγ平面的平面， 20且於基準面Μ，將調變領域之長邊方向設成與包含光軸 平行於ΖΧ平面之平面傾斜角度β的配置。角度β為與微小 鏡6a之轉動轴R正交的角度，本實施樣態係0=45。。 本實施樣態於雷射光61之光路上配置鏡5，將雷射光61 之光轴Pi朝光轴P2的方向反射，雷射光61係設成相對於空 200932409 間調變元件6之基準面Μ的法線以角度2 α射入的配置。因 此，導通光62沿著該沿著基準面μ之法線的光軸ρ3反射。 5 〇 10 15 ❹ 20 如此以將空間調變元件6設成因應轉動軸1?之方向旋轉 角度0配置的狀態’如第6圖所示包含光轴pl、？2之平行於 ZX平面的平面，與在鏡5反射後射入微小鏡6&之雷射光61之 軸上光的射入面S—致。因此，光轴p,、p2及在微小鏡“反 射之導通光62的光軸P3係位於同一平面上。 照射光學系統8以空間調變元件6空間調變，且係光學 元件群’該光學元件群構成將朝向一定方向反射之導通光 62所形成之像以倍率々成像於基板η之被加 工面11a上的 成像光學系統，分別於空間調變元件6侧配置成像透鏡8A， 於基板11侧配置對物透鏡8β。 本實施樣態中，對物透鏡8Β藉不同倍率之複數個轉換 ii(revolver)機構而被保持成可切換。因此，以使轉換器機 構旋轉而切換對物透鏡88的狀態，可變更照射光學系統8 的倍率万。以下除非特別聲明，否則對物透鏡8B係指用以 構成照射光學系統8所選擇的透鏡。 又’本實施樣態中，成像透鏡8A之光軸P4配置成平行 於X軸方向’對物透鏡8B之光轴P5配置成平行於Z軸方向。 因此’空間調變元件6與成像透鏡8A之間設有可反射導 通光62而使該光沿著光軸射入的鏡7。而於成像透鏡8A與 對物透鏡8B之間設有可反射已透過成像透鏡8A之光並使 該光沿著光軸Ps射入的半透鏡9。 如此一來’光軸p4、p5與光軸Ρι、p2、p3位於同一平面 15 200932409 上。即，構成從雷射光源！以導通狀態之微小鏡如反射並經 過照射光學㈣8而達被加工面丨la之第丨光軸的絲&〜& 全部位於同一平面。 又，鏡7、半透鏡9均對γ軸周圍傾斜著。 5 照射光學系統8之投影倍率点可因應被加工面11a上之 必要的加工精度而適宜地設定。例如調變領域全體之WxH大 _ 小的圖像在被加工面Ua上成為r χΗ，那般的倍率。 成像透鏡8Α之ΝΑ設成作為切斷光63而反射之光不會 射入的尺寸。 10 觀察用光源16係用以產生可照亮被加工面11a上之可 加工領域内之觀察用光7〇的光源，且設於半透鏡9與對物透 · 鏡8B之間之光路的側方。 於半透鏡9與對物透鏡8B之間之光路上，且於與觀察用 光源16對向的位置，設置透過在半透鏡9反射之導通光62而 15將觀察用光7〇朝向對物透鏡8B反射的半透鏡14。觀察用光 源16與半透鏡14之間設有將觀察用光70聚光成適當直徑之 照明光束的聚光透鏡15。聚光透鏡15之光軸Ρό可位於第1光 〇 軸所在的平面上，也可在交叉的位置。 作為觀察用光源16者係例如可採用產生可見光之氤氣 20燈或LED等適當的光源。 - 觀察用成像透鏡12(攝影光學系統)係設於半透鏡9之上 方侧且與對物透鏡8B之光軸P5同轴，並係將由觀察用光7〇 所照亮之被加工面lla反射而藉由透物透鏡8B聚光之光予 以成像於攝影元件13(攝影部）之攝影面上的光學元件。因 16 200932409 此’光軸P5兼作為從被加工面經由攝影光學系統而達到攝 影部之第2光轴。 攝影元件13係將已成像於攝影面上之影像予以光電變 換者，例如由CCD等構成。本實施樣態中，採用於沿著長 5邊％><短邊h之攝影面的長邊的配列方向配列叉個，沿著短邊 之配列方向配置y個，合計配列X x y個受光像素（光電變換 要素)者。 ' 攝影元件13之光軸P5周圍之旋轉位置調整為攝影面之 長邊及短邊與被加工面11a上之可加工領域之長邊及短邊 10 方向平行。 但是，本實施樣態中’如將於後述之影像處理部44係 建構成在要算出加工資料時’可進行修正攝影元件13與被 加工面11a上之可加工領域之位置關係的影像處理因此攝 影元件13之光軸P5周圍之旋轉位置的調整精度，係攝影面 之長邊與短邊與被加工面lla上之可加工領域之長邊及短 邊在可修正處理的範圍約平行即可。 本實施樣態巾’元件13設為長邊⑽短邊h的矩形 狀，惟，也可為正方形，此情形下，將4個邊之中相互正交 之2個邊的-方設為長邊，而將另—方設為短邊的話，以下 2〇 的說明同樣成立。 攝影元件13相對於可加工領域配置成如此的位置關 係，因此’以適當地設定對物透鏡8B、觀察用成像透鏡η 所構成之成像光學系統之倍率的狀態下，可使投影在攝影 面上之可加工領域之長邊或短邊分別與攝影面之長邊或短 17 200932409 邊一致，或實質上一致。特別是在可加工領域與攝影面之 縱橫比一致的情形下，以分別的長邊及短邊為基準而可使 其-致或實質上一致。此情形下，曼好是配置成對應可加 工領域之各微小鏡6a之各座標的原點與配列方向一致。 5 業經攝影元件13光電換之影像信號被送出至電性連接 於攝影元件13的控制單元22。 控制單元22係用以控制雷射加工裝置1〇〇的動作者’而 如第7圖所示由影像納入部4〇、資料記憶部43、空間調變元 件驅動部41、裝置控制部42、影像處理部糾及修正資料記 10 憶部47構成。 在本實施樣態中，控制單元22之裝置構造係cpu、記 憶體、輪人輸出部、外部記憶裝置等所構成之電腦與適合 的硬體的組合所構成。 15 20 頁料此憶。卩43、修正資料記憶部47係使用此電腦之 憶體或外部減體裝置而實現。又，其他構造係以咖 行對應各別的控制機能、處理機能而製成之程式來實現 影像納入料_人以_彡元件13取狀影像信號 獲得被加qlla之二:欠元影像者人之二次元影 被送出至由螢幕等構成之顯示部3G後顯示之同時，影像 料150被送出至由影像記憶體構成之資料記憶部43並被: 憶0 之 •之各微小鏡6a之導通/切斷200932409 IX. Description of the Invention: [Technical Field 3 of the Invention] Field of the Invention The present invention relates to a laser processing apparatus. For example, a laser processing apparatus that performs laser processing (repair processing) of defects such as a liquid crystal substrate, a semiconductor substrate, and a printed circuit board using a spatial modulation element composed of the micromirror array 5 is used. The present application claims priority to Japanese Patent Application No. 2007-120812, filed on May 1, 2007, the disclosure of which is incorporated herein. 1. [Background Art] Conventionally, for example, in the manufacturing process of a liquid crystal display device (LCD), various inspections are performed on a glass substrate to be subjected to photolithography processing. When the result of this inspection is detected in the scratchpad pattern formed on the glass substrate and the etched pattern 15 is detected, the laser processing device is used to irradiate the defective portion with laser light to remove the defective portion, which is so-called laser processing. The case of repair processing. In the laser processing apparatus, the defective image data obtained by capturing the defective portion on the glass substrate is described in the patent document, and the open data of the defective portion is taken out, and the DMD is performed at a high speed according to the shape. The control angle of each of the micromirrors of the (Digital 20 Micro minw Device) unit is such that the cross-sectional shape of the laser light reflected by the micromirrors is approximately the same as the shape of the defective portion, and the defective portion is irradiated. Patent Document 1: Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. 5 200932409 The technique described in Patent Document 1 is such that the DMD unit illuminates the spatially modulated laser light in response to the shape of the defective portion. Therefore, laser processing can be performed efficiently, but in the case of DMD, in order to rotate at a high speed The mirror ' is a device that sets the rotation axis in the diagonal direction of the micro mirror. This is a five-fold situation. In this case, the incident surface of the micromirror that reflects the reflected light toward the workpiece, that is, the optical axis that enters the DMD, the optical axis that is directed toward the processed surface after the DMD is reflected, and the normal that includes the micromirror. The plane must be orthogonal to the axis of rotation of the micromirror. Therefore, the four sides of the rectangular field of the DMD 10 unit with the micromirror, or the direction of the long side and the short side, must be curved in each optical axis. The configuration of the location relationship. In such a configuration, once the DMD unit is configured in accordance with the configuration of the machinable field in the case where the machined surface is set in a rectangular shape, the configuration of the light source and the mirror is complicated. 15 Parts processing and assembly become complicated. As a result, there is a problem that the processing cost of components and the number of assembly man-hours increase, which causes an important increase in cost. An example of the structure of the main part of the laser processing apparatus in the positional relationship of the optical axes of the optical axes in the four side directions of the DMD unit in which the micro mirrors are arranged is referred to FIG. 12 and FIG. 13A. Figure, 20 Figure 13B for a brief description. Fig. 12 is a perspective view showing the configuration of a main portion of the laser processing apparatus. The 13th and 13th views are a front view of the 12th view and a side view viewed from the B direction viewed from the A direction. As shown in FIG. 12, the laser processing apparatus 200 is integrally provided in the housing 201 such as the projection lens 204, the mirrors 205 and 207, the spatial modulation element 2〇6, the half mirror 209, the objective lens 208, and the 200932409 photographing unit 210. . Thereby, the laser light incident on the projection lens 204 passes through the optical path that is meandered by the optical axes Q1, Q2, Q3, Q4, and Q5, and is irradiated onto the workpiece. On the other hand, the workpiece is placed on the optical axis Q5. The photographing unit 210 is photographed. 5 Ο 10 15 ❹ 20 As shown in Fig. 12, the spatial modulation element 206 is arranged in the Β direction in the longitudinal direction and in the Α direction in the short side direction, and the optical axes Q3, Q4 and Q5 are arranged on the same plane. on. Since the spatial modulation element 206 uses the DMD, for example, the direction extending in the 45° direction with respect to the longitudinal direction is used as the rotation axis, and in order to realize such an optical arrangement, the optical axis Q2 of the incident spatial modulation element 206 is configured to be relatively The oblique direction of the long side and the short side of the spatial modulation element 206 intersects. In other words, in the direction A of Fig. 12, the angle a is inclined with respect to the optical axis Q3 (see Fig. 13A), and the angle b is inclined with respect to the optical axis Q3 in the B direction (see Fig. 13B), and The plane including the optical axes Q3, Q4, and Q5, and the optical axes Q1 and Q2 are disposed at positions that constitute a meander. Therefore, the arrangement of the optical system before the projection lens 204, the mirror 205, and the like before entering the spatial modulation element 2〇6 is extremely complicated, and the shape of the housing 2〇1 is also complicated, and the member disposed on the optical axis Qbq2 is inclined. Tilted obliquely, so it is impossible to form a compact component. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a laser processing apparatus using a spatially modulated 7L piece having a micro mirror array arranged in an array The plurality of micromirrors are arranged in a certain direction and are respectively arranged to be rotatable, and are arranged in a laser processing device in a rectangular field surrounded by four sides extending in the direction of the rotation axis and the direction of the rotation axis. It can improve the effect of component assembly and assembly of components (4) Laser processing equipment. In order to solve the above problems, the laser processing apparatus of the present invention includes: a Ray 5 light source; and a spatial modulation component, wherein the laser light irradiated by the light source is spatially modulated according to the micro mirror array. The micro mirror array is arranged in a plurality of micromirrors that are rotatable around a rotation axis arranged in a predetermined direction, and is arranged in a rectangular region surrounded by a side extending in a direction intersecting with the rotating sleeve. a direction in which the four sides are orthogonal to each other; and the illumination optical system is arranged such that the micro mirrors 2 are aligned with the to-be-supported surface and are constructed from the laser light source described above The micro mirror array reflects and passes through the illumination optical system to the first optical axis of the processed surface on the same plane. According to the present invention, since the first optical axis reflected from the laser light source and reflected by the micro- 15 mirror array and passing through the illumination optical system to the processed surface is on the same plane, the optical constituting the optical system can be The optical member such as the component and the optical component are arranged on a flat surface, and the zigzag of the optical path, the arrangement of the components, the mounting, and the like are facilitated, and the component can be restrained from protruding toward the plane and can be reduced in structure. According to the laser processing apparatus of the present invention, since the optical components on the first optical axis can be arranged on a single plane, the zigzag of the optical path and the arrangement of the components are facilitated, and the holding member including the optical component can be improved. The effect of the efficiency of the machining and assembly of the components of each component. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a schematic configuration of a laser processing apparatus according to a first embodiment of the present invention, and showing a cross section of an optical axis. Fig. 2A is a front elevational view showing the appearance of a main portion of the laser processing apparatus according to the first embodiment of the present invention. 5B is a side view showing the appearance of a main portion of the laser processing apparatus according to the first embodiment of the present invention. Fig. 3 is a cross-sectional view showing a cross section of an optical axis of a spatial modulation element including a laser processing apparatus according to a first embodiment of the present invention. Fig. 4 is a schematic view showing the intermodulation elements of the space between the laser processing apparatuses according to the first embodiment of the present invention. Fig. 5A is a schematic view showing the vicinity of a spatial modulation element of the laser processing apparatus according to the first embodiment of the present invention as seen from the front. Fig. 5B is a schematic view showing the spatial modulation element of the laser processing apparatus according to the first embodiment of the present invention as seen from the direction C of Fig. 5A. Fig. 6 is a perspective view showing the positional relationship between the reference surface and the incident surface of the space modulating element of the laser processing apparatus according to the first embodiment of the present invention. Fig. 7 is a functional block diagram showing a schematic configuration of a control unit of the laser processing apparatus according to the first embodiment of the present invention. Fig. 8 is a schematic view showing a cross section of an optical axis showing a schematic structure of a laser processing apparatus 20 according to a second embodiment of the present invention. Fig. 9A is a front elevational view showing the appearance of a main part of a laser processing apparatus showing a second embodiment of the present invention. Fig. 9B is a top view showing the appearance of the main part of the laser processing apparatus showing the second embodiment of the present invention. 9 200932409 Fig. 10 is a functional block diagram showing a schematic configuration of a control unit of the laser processing apparatus according to the second embodiment of the present invention. Fig. 11 is a view for explaining the operation of the laser processing apparatus according to the second embodiment of the present invention. Fig. 11B is a view for explaining the operation of the laser processing apparatus according to the second embodiment of the present invention. Fig. 12 is a perspective view showing an example of the configuration of a main part of the laser processing apparatus. Fig. 13A is a front view as seen from the direction A of Fig. 12. 10 Fig. 13B is a side view seen from the B direction of Fig. 12. C Embodiment 3 Preferred Embodiments Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In all of the drawings, the same reference numerals will be given to the same or opposite elements, and the common description will be omitted. [First Embodiment] A laser processing apparatus according to a first embodiment of the present invention will be described. Fig. 1 is a schematic view showing a schematic configuration of a laser processing apparatus according to a first embodiment of the present invention, and showing a cross section of an optical axis. Fig. 2A is a front elevational view showing the appearance of a main part of a laser processing apparatus according to a first embodiment of the present invention. Fig. 2B is a side view showing the appearance of a main part of the laser processing apparatus according to the first embodiment of the present invention. Fig. 3 is a cross-sectional view showing a cross section of an optical axis of a spatial modulation element including a laser processing apparatus according to a first embodiment of the present invention. Fig. 4 is a schematic view showing a 10 200932409 spatial modulation element of the laser processing apparatus according to the first embodiment of the present invention. Fig. 5A is a schematic view showing the vicinity of a spatial modulation element of the laser processing apparatus according to the first embodiment of the present invention. Fig. 5B is a diagram showing a pattern viewed from the C direction of Fig. 5A. Fig. 6 is a perspective view showing the positional relationship between the reference plane and the incident surface of the spatial modulation element of the laser processing apparatus according to the first embodiment of the present invention. Fig. 7 is a functional block diagram showing a schematic configuration of a control unit of the laser processing apparatus according to the first embodiment of the present invention. The XYZ coordinate in the figure is a positional relationship that is common to each figure for convenience of direction reference, and the horizontal plane is the χγ plane, and the direction from the negative direction of the γ axis toward the positive direction of the γ 〇 axis coincides with the direction of the front view (below) Same as other figures 10). Further, the figure shows a state in which the beam of the light beam pattern schematically indicates when the laser light is irradiated to a certain point of the sample. The laser processing apparatus 100 of the present embodiment is a device for performing repair processing using laser light. For example, a glass substrate such as an LCD (Liquid Crystal Display) and a semiconductor wafer substrate are processed by photolithography to form a circuit pattern or the like on a substrate, and for example, a short circuit of the wiring portion, an overflow of the photoresist, and the like are detected. In the state of the defective part of ®, it can be applied to a device that removes the repair process of the defective part. The schematic structure of the laser processing apparatus 100 is as shown in Fig. 1, Fig. 1A, and Fig. 2B'20, and is composed of a laser light source 50, a machining head 20, a machining head moving mechanism 31, a mounting table 21, a control unit 22, and a display. The portion 30 and the user interface (see Fig. 7) are configured such that the substrate η as a workpiece is placed on the mounting table 21 provided below the processing head horizontally toward the upper side during processing. 11 200932409 Laser source 50 is a light source for repair processing. In this embodiment, a structure including a laser oscillator 1, a combination lens 2, and an optical fiber 3 is employed. The laser oscillator 1 is capable of oscillating a laser beam having a wavelength set and outputted to remove defects on the substrate 11, and for example, a 5 YAG laser capable of pulse wave vibration can be suitably used. Further, it is possible to construct a complex oscillation wavelength that can be switched in response to the object to be repaired. ~ The laser oscillator 1 is constructed to be electrically connected to the control unit 22, and can be controlled to oscillate in response to a control signal from the control unit 22. The combining lens 2 is an optical element for combining the laser light emitted from the laser oscillator 1 to the optical fiber © 10 3 . The optical fiber 3 is laser-coupled to the end face 3a of the optical fiber by the coupling of the lens 2. The light is internally transmitted and introduced into the processing head 2, and the laser light 6 is emitted from the end face 3b of the optical fiber. Since the laser light 60 is transmitted inside the optical fiber 3 and then emitted, even if the laser light of the laser vibrator 1 is distributed, the diffused light whose light quantity distribution has been uniformized 15 is also formed. Fig. 1 is a schematic view showing the arrangement of the laser oscillator 1 in the z direction. However, the arrangement position and posture of the laser oscillator 1 are not limited thereto, and can be set in an appropriate configuration by rotating the optical fiber 3. Position, posture. Further, a fiber microbend device for stabilizing the mode of the optical fiber may be added. Further, the mechanism for uniformizing the laser light does not use the optical fiber 3, and other optical components may be used, for example. A fly-eye lens, a refractive element, an aspherical lens, or a homogenizer of various configurations such as a kaleidoscope type rod can be used. The processing head 20 has a processing head moving mechanism 12 provided with a suitable driving mechanism 200932409 21 (Refer to FIG. 2B), optical elements such as the projection lens 4, the spatial modulation element 6, the illumination optical system 8, the observation light source 16, the observation imaging lens 12, and the imaging element 13 are held together with respect to the mounting table. It has been held in the casing 20a which is relatively movable with respect to the XYZ axis. 5 The relative movement of this embodiment is such that the machining head 20 is oriented in the X-axis direction parallel to the surface to be processed 11a by the machining head moving mechanism 31 and In the case where the machined surface 11a is moved in the direction orthogonal to the normal direction (Z-axis direction) and the substrate is moved in the Y-axis direction by the mounting table 21, it is described that, for example, the processing head 20 may be oriented. When the Z-axis direction moves, the mounting table 21 moves in the χγ direction, or the relative movement of the mounting head 20 to move the machining head 20 in the XYZ-axis direction so as to be appropriately combined is achieved. The projection lens 4 is fixed to the housing 2〇a. The fiber end face % of the optical fiber 3 is arranged in a conjugate relationship with the reference plane M of the space adjusting element 6 which will be described later, and is used to make the image of the fiber end face 3b illuminate the entire modulation domain of the spatial modulation element 6 In the present embodiment, the optical axis ρ and κ ζχ plane of the projection lens 4 are set in the oblique direction from the positive direction of the x-axis toward the negative direction toward the negative direction from the positive X-axis direction to the negative direction. The spatial modulation element 6 is formed by spatially modulating the laser light 61 projected by the projection lens 4, and is composed of a micro mirror array DMD. That is, the spatial modulation element 6 is as shown in FIG. 3 with respect to the reference. The plurality of micromirrors 6a' having a tilting angle and a tilting angle as shown in Fig. 4, extending in the rectangular and short sides of the long side 骹 short side η, extend to the long side and the short side The direction is arranged as the arrangement direction In the second dimension. 13 200932409 The rotation axis R of each micromirror 6a is as shown in Fig. 4, and the inclination angle of the long side in the reference plane 相对 relative to the modulation field is 0 (where 0 ι > 〇.), which is inclined with respect to the short side. Angle θ2 (where 0 2 > 〇., and (9 1 + β 1 = 90.). One example of the present embodiment uses 5 DMD of 12.10, = 0 2 = 45°. Space of this embodiment The modulation element 6 is formed in a rectangular shape with a short side of the growing side Wx, but may be a square. In this case, one of the four sides orthogonal to each other is set to a long side. When the other side is set to the short side, the following description is also true. Each of the micromirrors 6a of the spatial modulation element 6 is rotated by +12, for example, by a reference plane, in an on (〇N) state in accordance with an electrostatic electric field generated corresponding to a control signal from the control unit 22. , in the state of off (off), the reference plane turns a 12°. Hereinafter, the light reflected by the micro mirror 6& in the conduction state is referred to as conduction light (L〇〇' in Fig. 3 is referred to as the cut light by the micro mirror 6& The position of each of the micromirrors 6a can be expressed by (m, n) as the number m in the longitudinal direction and the row number n in the short-side direction (m, η is an integer equal to or greater than 〇). As shown in Fig. 5 and Fig. 5, the arrangement position of the modulation element 6 is arranged on the plane parallel to the χγ plane with respect to the negative side of the Ζ axis, 20 and the reference plane Μ, the modulation area The longitudinal direction is set to an inclination angle β corresponding to a plane including the optical axis parallel to the plane of the pupil. The angle β is an angle orthogonal to the rotation axis R of the micromirror 6a, and the present embodiment is 0 = 45. This embodiment The mirror 5 is disposed on the optical path of the laser beam 61, and the optical axis Pi of the laser light 61 is reflected in the direction of the optical axis P2, and the laser light 61 is set to be the normal to the reference plane 调 of the modulation element 6 between the air and the 200932409. The arrangement is incident at an angle 2α. Therefore, the conduction light 62 is reflected along the optical axis ρ3 along the normal to the reference plane μ. 10 15 ❹ 20 The state in which the spatial modulation element 6 is arranged in accordance with the direction of rotation 0 of the rotation axis 1? is as shown in Fig. 6 including the plane parallel to the ZX plane of the optical axes pl and ?2, and After the mirror 5 reflects, the incident surface S of the light incident on the axis of the laser beam 61 of the micromirror 6 & the optical axis p, p2 and the optical axis P3 of the reflected light 62 reflected by the micro mirror The illumination optical system 8 is spatially modulated by the spatial modulation element 6, and is an optical element group. The optical element group constitutes an image formed by the conduction light 62 reflected in a certain direction and is imaged at a magnification 々 on the substrate η. In the imaging optical system on the processed surface 11a, the imaging lens 8A is disposed on the side of the spatial modulation element 6, and the objective lens 8β is disposed on the substrate 11 side. In this embodiment, the objective lens 8 is multiplied by a plurality of magnifications. The ii (revolver) mechanism is switched to be switchable. Therefore, by switching the state of the objective lens 88 by rotating the converter mechanism, the magnification of the illumination optical system 8 can be changed. Unless otherwise stated, the objective lens 8B is omitted. Means to constitute The lens selected by the optical system 8 is selected. In the present embodiment, the optical axis P4 of the imaging lens 8A is disposed in parallel with the X-axis direction. The optical axis P5 of the objective lens 8B is disposed parallel to the Z-axis direction. Between the spatial modulation element 6 and the imaging lens 8A, there is a mirror 7 that can reflect the conduction light 62 to inject the light along the optical axis. Between the imaging lens 8A and the objective lens 8B, there is a reflective reflection. The light of the imaging lens 8A and the light incident on the optical axis Ps into the half mirror 9. Thus, the optical axes p4, p5 and the optical axes Ρι, p2, p3 lie on the same plane 15 200932409. That is, it is constructed from a laser light source! The tiny mirrors in the on state, such as reflections and through the illumination optics (4) 8, reach the same plane as the filaments &~& of the optical axis of the processed surface 丨la. Further, both the mirror 7 and the half mirror 9 are inclined around the γ axis. 5 The projection magnification point of the illumination optical system 8 can be appropriately set in accordance with the necessary processing accuracy on the processed surface 11a. For example, the WxH large _ small image of the entire modulation field becomes r χΗ on the processed surface Ua, and the magnification is the same. The imaging lens 8 is configured such that the light reflected by the cut light 63 is not incident. The observation light source 16 is for generating a light source for illuminating the observation light 7 in the processable area on the processed surface 11a, and is disposed on the side of the optical path between the half mirror 9 and the object lens 8B. square. On the optical path between the half mirror 9 and the objective lens 8B, and at a position opposed to the observation light source 16, the conductive light 62 reflected through the half mirror 9 is provided to pass the observation light 7 toward the objective lens. 8B reflected half mirror 14. Between the observation light source 16 and the half mirror 14, a condensing lens 15 for condensing the observation light 70 into an illumination beam of an appropriate diameter is provided. The optical axis 聚 of the collecting lens 15 may be located on the plane in which the first pupil axis is located, or may be in the intersecting position. As the observation light source 16, for example, an appropriate light source such as xenon gas 20 or LED which generates visible light can be used. - The observation imaging lens 12 (photographing optical system) is disposed above the half mirror 9 and coaxial with the optical axis P5 of the objective lens 8B, and reflects the processed surface 11a illuminated by the observation light 7 On the other hand, the optical element is imaged on the imaging surface of the imaging element 13 (photographing unit) by the light collected by the transmissive lens 8B. According to 16 200932409, the optical axis P5 also serves as the second optical axis of the photographing unit from the surface to be processed via the photographing optical system. The photographic element 13 is a photoelectrically transducing image that has been imaged on the photographic surface, and is composed of, for example, a CCD or the like. In this embodiment, a cross is arranged along the arrangement direction of the long sides of the image plane along the long side of the side, and the short side h is arranged, and y pieces are arranged along the arrangement direction of the short sides, and the total arrangement is X xy. Light-receiving pixels (photoelectric conversion elements). The rotational position around the optical axis P5 of the photographing element 13 is adjusted so that the long side and the short side of the photographing surface are parallel to the long side and the short side 10 of the workable area on the surface 11a to be processed. However, in the present embodiment, the image processing unit 44, which will be described later, is configured to perform image processing for correcting the positional relationship between the image forming element 13 and the workable area on the processed surface 11a when the processing data is to be calculated. The adjustment accuracy of the rotational position around the optical axis P5 of the photographic element 13 is such that the long side and the short side of the photographic surface are parallel to the long side and the short side of the machinable area on the processed surface 11a. . In the present embodiment, the element 13 is formed in a rectangular shape having a short side h of the long side (10), but may be a square. In this case, the square of the two sides orthogonal to each other among the four sides is set to be long. If the other side is set to the short side, the following description of 2〇 is also true. The photographic element 13 is disposed in such a positional relationship with respect to the workable area, and thus can be projected on the photographic surface in a state where the magnification of the imaging optical system constituted by the objective lens 8B and the observation imaging lens η is appropriately set. The long side or the short side of the machinable field is consistent with, or substantially identical to, the long side of the photographic surface or the short side of the 200932409 side. In particular, in the case where the workable area and the aspect ratio of the photographic surface coincide, the respective long sides and short sides can be made uniform or substantially identical. In this case, it is assumed that the origin of each of the coordinates of each of the micromirrors 6a corresponding to the processable area coincides with the arrangement direction. The image signal that is photoelectrically converted by the photographic element 13 is sent to the control unit 22 that is electrically connected to the photographic element 13. The control unit 22 is for controlling the actor ' of the laser processing apparatus 1 ′, and as shown in FIG. 7 , the image accommodating unit 4 , the data storage unit 43 , the spatial modulation element driving unit 41 , the device control unit 42 , The image processing unit corrects the correction data record 10 and the memory unit 47. In the present embodiment, the device configuration of the control unit 22 is a combination of a computer composed of a CPU, a memory device, a wheel output unit, an external memory device, and the like, and a suitable hardware. 15 20 pages of this memory.卩43. The correction data storage unit 47 is realized by using the memory of the computer or the external subtraction device. In addition, other structures are implemented by a program corresponding to the respective control functions and processing functions of the coffee line. The image is obtained by the image signal obtained by the person _彡 element 13 is added to the second of the qlla: After the second-order image is sent to the display unit 3G composed of a screen or the like, the image material 150 is sent to the data storage unit 43 composed of the image memory and is turned on by the micro-mirrors 6a of the memory. / cut off
^間調變7L件軸部41係依據以影像處理部糾產生 加工資料，控制空間調變元件6 狀態者。 18 200932409 裝置控制部42係依據例如來自具有操作面板、鍵盤、 /月紙等適宜的操作輸入機構的使用者介面32的操作輸入， 控制雷射加工裝置100的動作者，且電性連接於影像納入部 4〇、空間調變元件驅動部41、加工頭移動機構31、雷射振 5盪器1、觀察用光源16，而建構成可控制各別的動作與動作 時序。 、 影像處理部44係叫出已記憶在資料記憶部43之影像資 料150而進行適宜之影像處理者，本實施樣態中具有缺陷抽 出部45與加工資料產生部46。 1〇 缺陷抽出部45對影像資料150進行缺陷抽出，而將加工 形狀-貝訊作為缺陷影像資料151，並送出至加工資料產生部 46者。 此缺陷抽出處理可使用眾所周知之任何缺陷抽出算 法。例如可取得業經取得之影像資料與已預先記憶之正常 15的被加工面lla之圖案影像資料的亮度差分，並可從以某一 門檻值將該差分資料予以二進位化之資料中抽出缺陷。 加工資料產生部46對應從缺陷抽出部45送出之加工形 狀資訊，而產生可控制空間調變元件6之各微小鏡6a之導通 /切斷之加工資料152(調變資料）以能對被加工面丨la照射 20導通光62者。 產生加工資料152時’本實施樣態建構成即便是攝影面 之相對於可加工領域之光軸p5周圍的旋轉位置偏移，而分 別的長邊及短邊變得不平行的情形下，亦可藉著先將逐旋 轉偏移量記憶在修正資料記憶部47，而能將攝影元件13所 19 200932409 =T_51予以旋轉變換，並進行旋轉位置的 Ί财生部46構成將_所取彳k 像第軸為中.旋轉變換的座標變換機構。 5 方法的一例 在此說明倍率 '旋轉、位置偏移之校準㈣ibrThe inter-modulation 7L-part shaft portion 41 controls the state of the spatial modulation element 6 in accordance with the correction of the processing data by the image processing unit. 18 200932409 The device control unit 42 controls the actor of the laser processing apparatus 100 based on an operation input from a user interface 32 having an appropriate operation input mechanism such as an operation panel, a keyboard, or a moon paper, and is electrically connected to the image. The accommodating unit 4, the spatial modulating element drive unit 41, the machining head moving mechanism 31, the laser oscillating device 1, and the observation light source 16 are configured to control individual operations and operation timings. The image processing unit 44 calls the image data 150 stored in the data storage unit 43 to perform appropriate image processing. In the present embodiment, the defect extracting unit 45 and the processed material generating unit 46 are provided. 1) The defect extracting unit 45 extracts the image data 150, and uses the processed shape-bein as the defective image data 151, and sends it to the processed data generating unit 46. This defect extraction process can use any well-known defect extraction algorithm. For example, it is possible to obtain a luminance difference between the image data obtained and the pattern image data of the processed surface 11a which has been memorized in advance, and extract the defect from the data which binarizes the difference data by a certain threshold value. The processing data generating unit 46 generates processing data 152 (modulation data) that can control the on/off of each of the micro mirrors 6a of the spatial modulation element 6 in accordance with the processed shape information sent from the defect extracting unit 45 to be processed. The face 丨la illuminates 20 light-passing 62. When the processing data 152 is generated, the present embodiment is constructed such that even if the long side and the short side of the photographic surface are shifted from the rotational position around the optical axis p5 of the workable area, the long side and the short side are not parallel. By first storing the rotation-by-rotation offset in the correction data storage unit 47, the imaging element 13 1932 32 = T_51 can be rotated and converted, and the Ί Ί Ί 进行 进行 进行 Ί Ί Ί A coordinate transformation mechanism like a rotation of the first axis. 5 Example of method Here, the magnification 'rotation, position offset calibration (4) ibr
^► /x.r _ J^► /x.r _ J
載置台21載置位置設定用的基板U，加工資料152作為 切換至未關摘示之咖等參„光源，位置設定用之 圖案設定為例如顯示可加工領域之外周的矩形，或是對應 可加工領域之中心位置的十字等幾何的圖案並對位置設 10定用之基板11之被加工面lla照射位置設定用圖案。 其次，以攝影元件13拍攝被加工面lla，並取得業經照 射位置設定用圖案之被加工面lla的影像。以影像處理部私 解析此影像之攝影面上的位置座標，檢測出攝影元件13對 攝影面之可加工領域的位置偏移，並算出攝影元件13的旋 15 轉量。 其次說明雷射加工裝置100的動作。The mounting table 21 mounts the substrate U for position setting, and the processed material 152 is switched to a light source such as a coffee that is not turned off, and the pattern for position setting is set to, for example, a rectangle showing the outer circumference of the processable area, or a corresponding processable A pattern such as a cross such as a cross at the center of the field is applied to the surface to be processed 11a of the substrate 11 for which the position is set to 10. The image forming device 11 is used to image the processed surface 11a, and the irradiation position is set. An image of the processed surface 11a of the pattern. The image processing unit privately analyzes the position coordinates of the image on the image surface, detects the positional deviation of the image pickup element 13 from the processable area of the image plane, and calculates the rotation of the image pickup element 13 Next, the operation of the laser processing apparatus 100 will be described.
以雷射加工裝置100進行雷射加工上，首先將基板"作 為被加工物並載置於載置台21。 其次以加工頭移動機構31移動加工頭2〇而設定最初的 20 加工位置，並取得被加工面Ua之可加工領域的影像。即， 點贵觀察用光源16使產生觀察用光70。觀察用光70之一部 分被半透鏡14反射，此反射光被對物透鏡8B聚光後照亮被 加工面Ua上的可加工領域。 以被加工面lla反射之反射光被對物透鏡8B聚光，一部 20 200932409 分透過半透鏡14。藉半透鏡9再透過一部分而被導入觀察用 成像透鏡12。射入觀察用成像透鏡12之光成像於攝影元件 13的攝影面。 攝影元件13將已成像之被加工面Ua的影像予以光電 5 轉換並送出至影像納入部4〇。 影像納入部4 0因應必要而對已送出之影像信號進行雜 訊去除、亮度修正等處理後於顯示部3〇顯示。又，因應控 制裝置4 2之控制信號而將適宜時序之影像信號轉換成影像 資料150，並記憶在資料記憶部43。如此一來，可取得被加 10工面Ua之可加工領域的影像。 接著，影像處理部44將已記憶在資料記憶部43之影像 貝料15 0讀出到缺陷抽出部4 5並進行缺陷抽出。判定已抽出 之缺陷的種類與大小等’在判斷了應修復加工之缺陷的情 形下，將其作為缺陷影像資料151並送出至加工資料產生部 15 46 〇In the laser processing by the laser processing apparatus 100, the substrate " is first placed on the mounting table 21 as a workpiece. Next, the machining head moving mechanism 31 moves the machining head 2 to set the first 20 machining positions, and obtains an image of the workable area of the machined surface Ua. That is, the observation light source 16 is caused to generate the observation light 70. A portion of the observation light 70 is reflected by the half mirror 14, which is condensed by the object lens 8B to illuminate the processable region on the processed surface Ua. The reflected light reflected by the processed surface 11a is condensed by the objective lens 8B, and a portion 20 200932409 is transmitted through the half mirror 14. The half lens 9 is further transmitted through a part of the lens to be introduced into the observation imaging lens 12. The light incident on the observation imaging lens 12 is imaged on the imaging surface of the imaging element 13. The photographing element 13 photoelectrically converts the image of the imaged surface Ua that has been imaged and sends it to the image incorporating portion 4A. The image incorporating unit 40 performs processing such as noise removal and brightness correction on the image signal that has been sent, and displays it on the display unit 3A. Further, the video signal of the appropriate timing is converted into the video data 150 in response to the control signal of the control device 42, and is stored in the data storage unit 43. In this way, an image of the machinable field to which the 10 work surface Ua is added can be obtained. Next, the image processing unit 44 reads the image material 15 0 stored in the data storage unit 43 to the defect extracting unit 45 and extracts the defect. It is judged that the type and size of the extracted defect are in the case where the defect of the repairing process is judged, and it is sent as the defective image data 151 to the processed data generating unit 15 46 〇
加工身料產生部46在必須進行缺陷影像資料151之旋 轉位置讀正處理的情形下，首先從修正資料記憶部彻 出修正資料，並進行缺陷影像資料151的旋轉移動。 錄態下’缺陷影像資料151之二次元配列方向與可加 °工領域之長邊及短邊的方向一致。 ，破加工面lla之可加卫領域與空間調變元件6之調 變項域因照射光學系統8而構成共補係，由於照射光學系 投影倍率為卜因此以將可加工領域上之位置座標設 马V/S倍而能對應空_變元件6之調變領域上的位置。 21 200932409 如此一來，加工位置產生部46從缺陷影像資料151，用 以對缺陷影像資料151所表示之被加工面na上的各位置照 射導通光62,而決定應控制成導通狀態之微小鏡以，並產 生用以驅動空間調變元件6之加工資料152以將此等微小鏡 5 6a设為導通狀態，而將其他微小鏡6a設為切斷狀態。例如 對應各微小鏡6a位置(m、n)產生加王資料⑸作為導通狀態 為1、切斷狀態為〇之數值所對應之表資料。 所產生之加工資料152送出至空間調變元件驅動部41。 空間調變元件驅動部41依據裝置控制部42之控制信號 1〇與已送出之加工資料丨52，控制空間調變元件6之各微^鏡 15 20When the processed body material generating unit 46 has to perform the correction processing of the rotational position of the defective image data 151, first, the corrected data is completely corrected from the corrected data storage unit, and the rotational movement of the defective image data 151 is performed. In the recorded state, the direction of the secondary element of the defective image data 151 is consistent with the direction of the long side and the short side of the addable field. The modulating field of the rupturable processing surface lla and the modulating field of the spatial modulating element 6 constitute a common compensation system by the illuminating optical system 8, and the projection magnification of the illuminating optical system is such that the position coordinates in the processable field are The horse is V/S times and can correspond to the position on the modulation field of the space_variable element 6. 21 200932409 In this manner, the processing position generating unit 46 is configured to irradiate the light to the respective positions on the processed surface na indicated by the defective image data 151 from the defective image data 151, and determine the micro mirror to be controlled to be in a conductive state. Then, the processing material 152 for driving the spatial modulation element 6 is generated to turn the micro mirrors 65a into an on state, and the other micromirrors 6a are turned off. For example, the position information (m, n) corresponding to each of the micromirrors 6a is generated as the data of the superimposition state (5) as the conduction state, and the state of the disconnection state is 〇. The generated processed material 152 is sent to the spatial modulation element drive unit 41. The spatial modulation element drive unit 41 controls each of the micro-mirrors 15 of the spatial modulation element 6 in accordance with the control signal 1 of the device control unit 42 and the processed data 52 that has been sent.
其次，裝置控制部42對雷射振蘯器m出用以振盡 光的控制信號，並依據因應基板11而預先選擇之照 而從雷射振盪器振盪雷射光。雷射光之照射條件。射條件 波長、光輸出、振盪脈波寬度等。 ^ ]舉有 業經振盪之雷射光藉著結合透鏡2而光結合於“ 〇 光纖端面3a，並從光纖端面3b射出光強度分布約已1纖3之 之作為發散光的雷射光6〇。 自化 雷射光6 0藉著投影透鏡4而沿著光轴ρ ι前 射後沿著光轴P2前進而投影在空間調變元件6上。, 間調變元件6上之各微小鏡6a反射。 、後以二 以傾斜角已呈切斷狀態之微小鏡6a反射之 63(參照第3圖）反射至成像透鏡8人之1^八的範圍外。刀斷 以傾斜角已呈導通狀態之微小鏡6a反射之切晰光6 22 200932409 著光軸P3前進’在鏡7反射後沿著光軸P4前進，射入成像透 鏡8A並被聚光後到達半透鏡9而在半透鏡9反射。 在半透鏡9反射之導通光62沿著光軸P5前進，並藉著對 物透鏡8B而成像於被加工面iia。 5 ❹ 10 15 ❹ 20 如此一來，依據加工資料152之導通光62所構成之調變 領域的影像可投影在被加工面lla上。其結果導通光62照射 於被加工面11a之缺陷而可去除缺陷。 以上結束一次雷射加工。 此加工後，藉著攝影元件13再度取得被加工面lu的/Next, the device control unit 42 emits a control signal for vibrating the laser to the laser vibrator m, and oscillates the laser light from the laser oscillator in accordance with the pre-selected illumination of the substrate 11. Irradiation conditions of laser light. Shooting conditions Wavelength, light output, oscillating pulse width, etc. ^] The oscillating laser light is bonded to the "〇 fiber end face 3a by the coupling lens 2, and the laser light intensity distribution of about 1 fiber 3 is emitted from the fiber end face 3b as the divergent light of the laser light 6〇. The laser light 60 is projected by the projection lens 4 along the optical axis ρ and then projected along the optical axis P2 to be projected onto the spatial modulation element 6. The respective micromirrors 6a on the intermodulation element 6 are reflected. Then, 63 (see FIG. 3) reflected by the micromirror 6a which has been cut at a tilt angle is reflected outside the range of 1 to 8 of the imaging lens 8. The knife is turned into a small state with a tilt angle. The specular light reflected by the mirror 6a 6 22 200932409 The optical axis P3 advances 'after the mirror 7 reflects, proceeds along the optical axis P4, enters the imaging lens 8A, and is condensed to reach the half mirror 9 to be reflected by the half mirror 9. The conductive light 62 reflected by the half mirror 9 advances along the optical axis P5 and is imaged on the processed surface iia by the objective lens 8B. 5 ❹ 10 15 ❹ 20 As a result, the conductive light 62 is formed according to the processed material 152. The image of the modulated field can be projected on the processed surface 11a. As a result, the conductive light 62 is illuminated. Surface 11a of the defects can remove defects above the end of a laser processing. After this process, acquired by the imaging element is re-machined surface lu / 13
像，並因應必要而重複上述操作，若是有未去除部的話I 進行雷射加工，或是移動可加工領域而進行其他的^ 射加工。 叩珀 平面… I由於光軸Pi在同- 因此可將光路上之光學元件或光學裝置等光 配^於—平面上’容易達到光路之曲折、零件配置件 可^昇包含光學零件之保持構件等之各構造零’ 工與組裝的效率。 妁零件加 例如’各光學零件之光轴傾整 =想為爛圍)之調整’調整變得容易二=資 ”:之精度的零件加工亦僅將 以籍輛 加工即可，加工變得容易。 予％精度 向，於與排列之平面交又的方 面交又 因此，於妹ρι〜从排列之平 又的方向，可抑制來自加卫頭20之構造構件之突出千 23 200932409 可降低光軸P!〜P5於排列之平面的法線方向之加工頭20的 厚度’因此’可將裝置構造設成精簡的裝置。 [第2實施樣態] 說明本發明之第2實施樣態之雷射加工裝置。 5 第8圖包含表示本發明之第2實施樣態之雷射加工裝置 之概略構造之光軸之剖面的模式圖。第9八圖包含表示本發 明之第2實施樣態之雷射加工裝置之主要部分之外觀的正 面圖。第9B圖包含表示本發明之第2實施樣態之雷射加工裝 置之主要部分之外觀的上面圖。第1〇圖表示本發明之第2實 10施樣態之雷射加工裝置之控制單元之概略構造的機能方塊 圖。 本實施樣態之雷射加工裝置110具有由第1光學方塊 25、旋轉機構26(旋轉保持機構)及第2光學方塊27所構成之 加工頭24，取代上述第丨實施樣態之雷射加工裝置1〇〇的加 15工頭20，且具有控制單元23取代控制單元22。以下以與上 述第1實施樣態不同點為中心來說明。 第1光學方塊25係在上述第1實施樣態之加工頭2〇之 ，將投影透鏡4、鏡5、空間調變元件6、鏡7、成像透鏡 8A、半透鏡9、攝影元件13及觀察用成像透鏡12配置成與上 述第1實施樣態同樣的位置關係，並固定於筐體25a(保持構 件)者。 旋轉機構2 6係以其下端側將第〗光學方塊2 5保持成可 旋轉於光轴P5周圍的機構。本實施樣態以具有可控制旋轉 之馬達專的狀態而藉著來自使用者介面32之操作可旋轉 24 200932409 第1光學方塊25。 第2光學方塊27係在上述第1實施樣態之加工頭2〇之 中，將投影透鏡14、對物透鏡86、聚光透鏡15及觀察用光 源16配置成與上述第丨實施樣態同樣的位置關係，並固定於 5與第2光學方塊不同的筐體27a者，而將旋轉機構％保持於 筐體27a的上面側所構成。藉著加工頭移動機構31而保持成 對於載置台21於3個軸方向可相對移動。 如第10圖所示，控制單元23具有已將旋轉量算出部48 追加至影像處理部44之影像處理部44a，而取代上述第！實 1〇施樣態之控制單元22之影像處理部22，而且，裝置控制部 42建構成電性連接於旋轉機構％，並可控制旋轉機構％的 旋轉角。 旋轉篁算出部48係解析來自缺陷抽出部45之缺陷影像 資料151，並因應缺陷之大小或延伸存在方向而設定最適之 15攝影面之光軸ps周圍之旋轉角者。本實施樣態要求得包圍 缺陷影像資科151之缺陷部分的矩形，而算出此矩形之長邊 及知邊分别與攝影面之長邊及短邊平行之旋轉角。但是， 包圍缺陷部分之矩形可為朝向任意方向的矩形亦可限定 為例如各邊平行於X軸 、Y轴的矩形。 ：〇 以旋轉量算出部48算出之旋轉角被送出至裝置控制部 42 ’在必須旋轉的情形下，從裝置控制部42將對應旋轉角 之控制信號送出至旋轉機構。 其次說明雷射加工裝置110的作用。 第11 A圖、第11B圖係說明本發明之第2實施樣態之雷 25 200932409 射加工裝置之動作的圖式。 依據雷射加工裝置110，藉著旋轉機構26相對於第2光 學方塊27，即使第1光學方塊25於光轴Ps周圍旋轉光軸ρι 〜P5亦總是位於同一平面上。因此，可與上述第丨實施樣態 5同全同樣地進行雷射加工。 本實施樣態更藉著驅動旋轉機構26而將相對於基板11 - 之攝影元件13旋轉於光軸&周圍，能使被加工面Ua上之攝 影領域及對應於此之可加工領域旋轉。 如第11 A圖、第11B圖所示’考量例如基板"之長邊方 〇 10向配置於y軸方向，短邊方向配置於X轴方向。 此情形下如第11A圖所示，以使第1光學方塊25朝圖式 之順時鐘方向旋轉φ1 = 45。的狀態，而能成攝影元件13之 長邊方向與基板11之長邊方向呈平行。又，以使第1光學方 槐25朝圖式之逆時鐘方向旋轉02= 45。的狀態，而能成攝 15影70件13之短邊方向與基板11之長邊方向呈平行。 又，若是基板11之載置精度差，即使對預定位置旋轉 後載置的情形下，亦能以配合偏移量而旋轉第丨光學方塊25 ο 的情形，而在修正了基板u之偏移量的狀態下，能進行雷 射加工，因此能進行高精度的雷射加工。此偏移量例如可 0因影像處理部44A而檢測出影像資料150所包含之正常影像 ， 部分之圖案的方向性而求得。又，也可於顯示部3〇所顯示 之影像中，進行影像計測而求得。 要修復加工之基板11為矩形，很多是電路圖案等延伸 於沿著矩形之長邊、短邊的方向，因此以選擇如此的配置 26 200932409 的情形，例如顇先準備縱橫交替之兩種使用於缺陷抽出之 正常影像圖案，或是可因應必要而將一種旋轉90°使用， 因此，比較於因應任意的旋轉角而旋轉變換正常影像圖案 之後，進行缺陷抽出運算的情形’本實施樣態乃能迅速進 5 行運算處理。 又，本實施樣態中，影像處理部44A具有旋轉量算出部 ，因此如以下所述，也可依據被加工面11a上的缺陷大小 與方向而決定第1光學方塊25之旋轉量。 如第10圖所示’一旦缺陷影像資料從缺陷抽出部45送 1〇出至旋轉量算出部48 ’旋轉量算出部48將缺陷影像資料151 予以影像處理並算出包含缺陷部分的矩形。從此矩形之長 邊及短邊的方向算出該長邊及短邊與攝影元件13之長邊及 短邊分別呈平行的旋轉角。 角必1，並將第1光學方塊25旋轉0丨。又 例如第11A圖所示，從包圍缺陷3〇〇之矩形凡算出旋轉 Ο 從包圍缺陷301之矩形丁2算出旋轉角02 25旋轉0 2。For example, repeat the above operation if necessary. If there is an unremoved part, I perform laser processing or move the machinable area to perform other processing. The pupil plane...I because the optical axis Pi is the same - therefore, the optical component or the optical device on the optical path can be optically arranged on the plane to easily reach the zigzag of the optical path, and the component arrangement can be raised to the holding member including the optical component. Wait for each construction to zero the efficiency of work and assembly.妁Parts plus, for example, 'the optical axis of each optical component is tilted = want to be a bad circumference.' The adjustment is easy to adjust. 2: The accuracy of the part processing is only processed by the vehicle, and the processing becomes easy. In the direction of the intersection with the plane of the arrangement, the projection of the structural member from the Guard head 20 can be suppressed in the direction of the alignment of the Guard Head 20 200932409 can reduce the optical axis The thickness of the processing head 20 in the normal direction of the plane of the arrangement of P! to P5 can be set as a simplified device. [Second Embodiment] A laser of the second embodiment of the present invention will be described. Fig. 8 is a schematic view showing a cross section of an optical axis showing a schematic structure of a laser processing apparatus according to a second embodiment of the present invention. Fig. 9 is a diagram showing a second embodiment of the present invention. The front view of the main part of the laser processing apparatus. Fig. 9B is a top view showing the appearance of the main part of the laser processing apparatus according to the second embodiment of the present invention. The first drawing shows the second embodiment of the present invention. 10 control of the laser processing device A functional block diagram of a schematic structure of the unit. The laser processing apparatus 110 of the present embodiment has a processing head 24 composed of a first optical block 25, a rotating mechanism 26 (rotation holding mechanism), and a second optical block 27 instead of the above. The first embodiment of the laser processing apparatus 1 has a 15 forehead 20, and has a control unit 23 instead of the control unit 22. Hereinafter, a description will be given focusing on differences from the first embodiment. In the processing head 2 of the first embodiment described above, the projection lens 4, the mirror 5, the spatial modulation element 6, the mirror 7, the imaging lens 8A, the half mirror 9, the imaging element 13, and the observation imaging lens 12 are arranged. In the same positional relationship as in the first embodiment, it is fixed to the casing 25a (holding member). The rotating mechanism 26 holds the optical block 25 so as to be rotatable around the optical axis P5 with its lower end side. The first optical block 25 is rotated by the operation from the user interface 32 by the operation from the user interface 32. The second optical block 27 is in the first embodiment described above. Processing head 2〇 The projection lens 14, the objective lens 86, the condensing lens 15, and the observation light source 16 are disposed in the same positional relationship as the above-described second embodiment, and are fixed to the housing 27a different from the second optical square. The rotation mechanism % is held on the upper surface side of the casing 27a, and is held by the machining head moving mechanism 31 so as to be relatively movable in the three axial directions with respect to the mounting table 21. As shown in Fig. 10, the control unit 23 The image processing unit 22 that has added the rotation amount calculation unit 48 to the image processing unit 44a of the image processing unit 44 in place of the above-described first control unit 22, and the device control unit 42 is constructed to be electrically It is connected to the rotating mechanism % and can control the rotation angle of the rotating mechanism %. The rotation calculation unit 48 analyzes the defective image data 151 from the defect extraction unit 45, and sets the rotation angle around the optical axis ps of the optimum 15 imaging surface in accordance with the size of the defect or the direction in which the defect is present. In this embodiment, a rectangle enclosing the defective portion of the defective image subject 151 is required, and a rotation angle of the long side and the known side of the rectangle parallel to the long side and the short side of the photographic surface is calculated. However, the rectangle surrounding the defective portion may be a rectangle oriented in any direction or may be defined as, for example, a rectangle whose sides are parallel to the X-axis and the Y-axis. : The rotation angle calculated by the rotation amount calculation unit 48 is sent to the device control unit 42'. When it is necessary to rotate, the device control unit 42 sends a control signal corresponding to the rotation angle to the rotation mechanism. Next, the action of the laser processing apparatus 110 will be described. 11A and 11B are views showing the operation of the second embodiment of the present invention. According to the laser processing apparatus 110, the rotating optical mechanism 26 is always on the same plane with respect to the second optical block 27 even if the first optical block 25 rotates the optical axes ρι to P5 around the optical axis Ps. Therefore, laser processing can be performed in the same manner as in the above-described third embodiment. In this embodiment, the image pickup element 13 with respect to the substrate 11 - is rotated around the optical axis & by the drive rotation mechanism 26, and the field of photographing on the surface Ua to be processed and the fieldable area corresponding thereto can be rotated. As shown in Figs. 11A and 11B, the long side of the substrate, for example, the substrate, is arranged in the y-axis direction, and the short-side direction is arranged in the X-axis direction. In this case, as shown in Fig. 11A, the first optical block 25 is rotated by φ1 = 45 in the clockwise direction of the drawing. The state of the longitudinal direction of the photographic element 13 is parallel to the longitudinal direction of the substrate 11. Further, the first optical lens 25 is rotated by 02 = 45 in the counterclockwise direction of the drawing. The state of the film can be photographed. The short side direction of the 70-piece 70 member 13 is parallel to the longitudinal direction of the substrate 11. Further, if the placement accuracy of the substrate 11 is poor, even if the predetermined position is rotated and placed, the second optical block 25 can be rotated by the offset amount, and the offset of the substrate u can be corrected. In the state of the quantity, laser processing is possible, so high-precision laser processing can be performed. This offset can be determined, for example, by the image processing unit 44A detecting the normal image included in the image data 150 and the directivity of the partial pattern. Further, it is also possible to perform video measurement on the image displayed on the display unit 3A. The substrate 11 to be repaired is rectangular, and many circuit patterns and the like extend in the direction along the long side and the short side of the rectangle. Therefore, in the case of selecting such a configuration 26 200932409, for example, two types of vertical and horizontal alternates are used. The normal image pattern extracted by the defect may be rotated by 90° as necessary. Therefore, the case of performing the defect extraction operation after rotating the normal image pattern in response to an arbitrary rotation angle 'this embodiment is capable of Quickly enter 5 rows of arithmetic processing. Further, in the present embodiment, since the image processing unit 44A has the rotation amount calculating unit, the amount of rotation of the first optical block 25 can be determined in accordance with the size and direction of the defect on the surface 11a to be processed, as will be described later. As shown in Fig. 10, the defective image data is sent from the defect extracting unit 45 to the rotation amount calculating unit 48. The rotation amount calculating unit 48 performs image processing on the defective image data 151 and calculates a rectangle including the defective portion. From the direction of the long side and the short side of the rectangle, the rotation angles at which the long side and the short side are parallel to the long side and the short side of the photographic element 13 are calculated. The corner must be 1, and the first optical block 25 is rotated by 0 。. Further, for example, as shown in Fig. 11A, the rotation is calculated from the rectangle surrounding the defect 3〇〇, and the rotation angle 02 25 is rotated by 0 from the rectangular shape 2 surrounding the defect 301.
如此不僅藉著旋轉量算出邹48而 。又，如第11B圖所示， 02,並將第1光學方塊 自動地算出第1光學 27 200932409 方塊之旋轉量’操作者可一面參照顯示部3〇所顯示之缺陷 的影像且一面能透過使用者介面32而以手動來指示。 上述說明中，已以例子說明了為了產生空間調變元件 之調變資料，而具有可拍攝被加工面之影像之攝影部的情 5形，惟，例如也可設成對應被加工物而以資料職予加工形 狀的情形下，不具有如此攝影部的構造。 又，上述說明中’已說明了對以攝影部取得之影像施 予影像處理，並進行被加工面之缺陷抽出，而依據已抽出 之缺陷的資訊算出用以去除缺陷部分之調變資料，進行空 H)間調變元件之調變控制情形的例子，惟，本發明祇要是依 據資料將被加工物施行形狀加工的裝置，則加工對象即不 限缺陷。 如上所述，在加工對象非缺陷時，也可建構成不具有 抽出被加工面之缺陷的影像處理部。 15 又，上述第2實施樣態之說明中，說明了旋轉機構26 藉裝置控制部42而旋轉驅動情形的例子，然而，旋轉機構 %也可建構成以機械性旋轉系統等構成而能以手動旋轉。 此情形下，旋轉機構26與裝置控制部42不必須電性連接。 又，旋轉量算出部48亦可檢測出旋轉偏移量並變更成顯示 2〇部30顯示偏移量。但是，在不須以影像處理部料檢測出旋 轉偏移量的情形下，亦可建構成使用第丨實施樣態之控制單 元22以取代控制單元23。 又，上述第2實施樣態在例如於照射光學系統8之中途 設置可變焦距變倍部等，將照射光學系統8之倍率設得比攝 28 200932409 5 影光學系統的倍率高，而於顯示部30所顯示之視野内具有 以空間調變元件6決定之矩形照射領域的情形亦有效。此情 形下，照射光學系統8之倍率高而可使用空間調變元件6之 寬廣面積，因此，能量損失少，且能配合缺陷為縱長或橫 長形狀來進行修正。 以上說明了本發明之較佳實施例，惟，本發明並非僅 限定於此等實施例。祇要是在不脫離本發明之宗旨的範圍 内，乃能作構造之附加、省略、置換及其他變更。本發明 ❹ 不為前述的說明所限定，而僅為所附之申請專利範圍所限 10 定。 【闽式簡單說明J 第1圖表示本發明之第1實施樣態之雷射加工裝置之概 略構造，且係包含光軸之剖面的模式圖。 第2A圖表示本發明之第1實施樣態之雷射加工裝置之 15 主要部分之外觀的正面圖。 ❹ 第2 B圖表示本發明之第1實施樣態之雷射加工裝置之 主要部分之外觀的側面圖。 第3圖表示本發明之第1實施樣態之包含雷射加工裝置 之空間調變元件之光軸之剖面的剖面圖。 20 第4圖表示本發明之第1實施樣態之雷射加工裝置之空 間調變元件的模式圖。 第5A圖表示從正面觀看本發明之第1實施樣態之雷射 加工裝置之空間調變元件附近的模式圖。 第5B圖表示從第5A圖之C方向觀看本發明之第1實施 29 200932409 樣態之雷射加工裝置之空間調變元件的模式圖。 第6圖表示本發明之第1實施樣態之雷射加工裝置之空 間調變元件之基準面與射入面之位置關係的立體圖。 第7圖表示本發明之第1實施樣態之雷射加工裝置之控 5 制單元之概略構造的機能方塊圖。 第8圖包含表示本發明之第2實施樣態之雷射加工裝置 之概略構造之光轴之剖面的模式圖。 第9A圖包含表示本發明之第2實施樣態之雷射加工裝 置之主要部分之外觀的正面圖。 10 第9B圖包含表示本發明之第2實施樣態之雷射加工裝 置之主要部分之外觀的上面圖。 第10圖表示本發明之第2實施樣態之雷射加工裝置之 控制單元之概略構造的機能方塊圖。 第11A圖係說明本發明之第2實施樣態之雷射加工裝置 15 之動作的圖式。 第11B圖係說明本發明之第2實施樣態之雷射加工裝置 之動作的圖式。 第12圖表示雷射加工裝置之主要部分之構造之一例的 立體圖。 20 第13A圖係從第12圖之A方向觀看的正面圖。 第13B圖係從第12圖之B方向觀看的側面圖。 【主要元件符號說明】 1…雷射振蘯器 3…光纖 2_··結合透鏡 3a、3b··.光纖端面 30 200932409 4…投影透鏡 5…鏡 6···空間調變元件 6a…微小鏡 7…鏡 8…照射光學系統 8A…成像透鏡 8B…對物透鏡 9…半透鏡 11…勒反 11 a.··被加工面 12…觀察用成像透鏡 13…攝影元件 14…半透鏡 15…聚光透鏡 16…觀察用光源 20".加工頭 20a…筐體 21…載置台 22、23···控制單元 30…顯示部 31…加工頭移動機構 32···使用者介面 40…影像納入部 41…空間調變元件驅動部 42…裝置控制部 43…資料記憶部 44…影像處理部 45…缺陷抽出部 46··.力a工資料產生部 47…修正資料記憶部 60…雷射光 6l···雷射光 62…導通光 63…切斷光 70…觀察用光 100…雷射加工裝置 p^iV"光轴 31So not only by the amount of rotation, Zou 48 is calculated. Further, as shown in FIG. 11B, 02, and the first optical block automatically calculates the amount of rotation of the first optical 27 200932409 square. The operator can refer to the image of the defect displayed on the display unit 3 while being able to use the image. The interface is 32 and is indicated manually. In the above description, the shape of the image capturing unit that can capture the image of the processed surface has been described by way of example. However, for example, it may be configured to correspond to the workpiece. In the case where the data is processed into a shape, the structure of the photographing unit is not provided. Further, in the above description, it has been described that the image processing is performed on the image obtained by the photographing unit, and the defect of the processed surface is extracted, and the modulated data for removing the defective portion is calculated based on the information of the extracted defect. An example of the case of the modulation control of the intermodulation element of the space H), however, the present invention is not limited to the defect as long as it is a device for performing shape processing on the workpiece according to the data. As described above, when the object to be processed is not defective, it is also possible to construct an image processing unit that does not have the defect of extracting the surface to be processed. Further, in the above description of the second embodiment, an example in which the rotation mechanism 26 is rotationally driven by the device control unit 42 has been described. However, the rotation mechanism % may be configured to be configured by a mechanical rotation system or the like. Rotate. In this case, the rotation mechanism 26 and the device control unit 42 are not necessarily electrically connected. Further, the rotation amount calculation unit 48 can also detect the rotation shift amount and change the display offset amount to the display unit 30. However, in the case where it is not necessary to detect the rotational shift amount by the image processing unit, the control unit 22 using the second embodiment may be constructed instead of the control unit 23. Further, in the second embodiment, for example, a variable focal length zooming unit or the like is provided in the middle of the illumination optical system 8, and the magnification of the illumination optical system 8 is set to be higher than the magnification of the optical system 28 200932409 5 It is also effective to have a rectangular illumination field determined by the spatial modulation element 6 in the field of view displayed by the unit 30. In this case, since the magnification of the illuminating optical system 8 is high and the wide area of the spatial modulating element 6 can be used, the energy loss is small, and the defect can be corrected by the lengthwise or horizontally long shape. The preferred embodiments of the present invention have been described above, but the present invention is not limited to the embodiments. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the invention. The present invention is not limited by the foregoing description, but is only limited by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a schematic configuration of a laser processing apparatus according to a first embodiment of the present invention, and showing a cross section of an optical axis. Fig. 2A is a front elevational view showing the appearance of a main portion of a laser processing apparatus according to a first embodiment of the present invention. Fig. 2B is a side view showing the appearance of a main part of the laser processing apparatus according to the first embodiment of the present invention. Fig. 3 is a cross-sectional view showing a cross section of an optical axis of a spatial modulation element including a laser processing apparatus according to a first embodiment of the present invention. Fig. 4 is a schematic view showing a space modulating element of the laser processing apparatus according to the first embodiment of the present invention. Fig. 5A is a schematic view showing the vicinity of a spatial modulation element of the laser processing apparatus according to the first embodiment of the present invention as seen from the front. Fig. 5B is a schematic view showing the spatial modulation element of the laser processing apparatus of the first embodiment 29 200932409 of the present invention viewed from the C direction of Fig. 5A. Fig. 6 is a perspective view showing the positional relationship between the reference surface and the incident surface of the space modulating element of the laser processing apparatus according to the first embodiment of the present invention. Fig. 7 is a functional block diagram showing a schematic configuration of a control unit of the laser processing apparatus according to the first embodiment of the present invention. Fig. 8 is a schematic view showing a cross section of an optical axis showing a schematic structure of a laser processing apparatus according to a second embodiment of the present invention. Fig. 9A is a front elevational view showing the appearance of a main part of a laser processing apparatus showing a second embodiment of the present invention. Fig. 9B is a top view showing the appearance of a main part of the laser processing apparatus showing the second embodiment of the present invention. Figure 10 is a functional block diagram showing a schematic configuration of a control unit of a laser processing apparatus according to a second embodiment of the present invention. Fig. 11A is a view for explaining the operation of the laser processing apparatus 15 of the second embodiment of the present invention. Fig. 11B is a view for explaining the operation of the laser processing apparatus according to the second embodiment of the present invention. Fig. 12 is a perspective view showing an example of the configuration of a main part of the laser processing apparatus. 20 Fig. 13A is a front view as seen from the direction A of Fig. 12. Fig. 13B is a side view as seen from the direction B of Fig. 12. [Description of main component symbols] 1...Laser vibrator 3...Fiber optic 2_·· Combined lens 3a, 3b··. Fiber end face 30 200932409 4...Projection lens 5...Mirror 6···Space modulation element 6a...Micro mirror 7...mirror 8...illumination optical system 8A...imaging lens 8B...object lens 9...half lens 11...inverted 11 a.·processed surface 12...imaging lens 13 for observation...photographic element 14...half lens 15...poly Optical lens 16... Observation light source 20" Processing head 20a... Housing 21... Mounting table 22, 23... Control unit 30... Display unit 31... Processing head moving mechanism 32···User interface 40... Image injecting unit 41... Spatial modulation element drive unit 42: Device control unit 43: Data storage unit 44: Image processing unit 45: Defect extraction unit 46··. Force data generation unit 47... Correction data storage unit 60... Laser light 6l· · Laser light 62... Conduction light 63... Cut light 70... Observation light 100... Laser processing device p^iV" Optical axis 31
Claims (1)
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| JP2007120812A JP5086687B2 (en) | 2007-05-01 | 2007-05-01 | Laser processing equipment |
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| KR (1) | KR101523293B1 (en) |
| CN (1) | CN101298117B (en) |
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| JP5301955B2 (en) * | 2008-11-13 | 2013-09-25 | オリンパス株式会社 | Defect correction device |
| JP5346690B2 (en) * | 2009-05-26 | 2013-11-20 | オリンパス株式会社 | Laser irradiation device |
| DE102010020183B4 (en) * | 2010-05-11 | 2013-07-11 | Precitec Kg | Laser cutting head and method for cutting a workpiece by means of a laser cutting head |
| TWI573650B (en) * | 2011-12-16 | 2017-03-11 | 應用材料股份有限公司 | Radiation source and beam combiner for combining coherent beams |
| CN102608875A (en) * | 2012-03-27 | 2012-07-25 | 深圳市华星光电技术有限公司 | Glass substrate carved number repairing method and glass substrate carved number repairing device based on repairing cabinet |
| CN103203541B (en) * | 2013-02-04 | 2015-05-13 | 张立国 | Laser machining device |
| CN104375383B (en) * | 2013-08-13 | 2017-08-29 | 上海微电子装备有限公司 | Focusing-levelling detection device and method for lithographic equipment |
| JP6321932B2 (en) * | 2013-09-24 | 2018-05-09 | 株式会社小糸製作所 | Vehicle headlamp |
| CN104227243A (en) * | 2014-09-11 | 2014-12-24 | 深圳英诺激光科技有限公司 | Laser deep processing equipment and processing method for hard material |
| CN106141457B (en) * | 2016-07-19 | 2018-01-12 | 张立国 | A kind of laser drilling system and method for drilling holes |
| CN106735875B (en) * | 2017-02-20 | 2019-01-18 | 湖北工业大学 | A kind of laser flexible micro-machining system and method based on LCD space light modulator |
| CN107824968A (en) * | 2017-11-08 | 2018-03-23 | 深圳泰德激光科技有限公司 | Laser welding device with CCD vision positioning function |
| JP7402814B2 (en) * | 2018-10-30 | 2023-12-21 | 浜松ホトニクス株式会社 | Laser processing head and laser processing equipment |
| CN111098043A (en) * | 2020-01-19 | 2020-05-05 | 中国科学院宁波材料技术与工程研究所 | Water-guided laser processing device and processing system |
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| CN2220936Y (en) * | 1995-04-07 | 1996-02-28 | 中国科学院长春光学精密机械研究所 | Novel laser phototypesetter |
| JPH09206965A (en) * | 1996-01-26 | 1997-08-12 | Keyence Corp | Laser marking device |
| JP2006227198A (en) * | 2005-02-16 | 2006-08-31 | Olympus Corp | Laser machining apparatus |
| TWI367800B (en) * | 2005-06-17 | 2012-07-11 | Olympus Corp | Laser beam machining method and apparatus |
| JP4429974B2 (en) * | 2005-06-17 | 2010-03-10 | オリンパス株式会社 | Laser processing method and apparatus |
| JP4947933B2 (en) * | 2005-07-26 | 2012-06-06 | オリンパス株式会社 | Laser repair device |
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| JP5086687B2 (en) | 2012-11-28 |
| KR20080097340A (en) | 2008-11-05 |
| TWI405633B (en) | 2013-08-21 |
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