KR101490429B1 - 저항 메모리 소자 및 그 형성 방법 - Google Patents

저항 메모리 소자 및 그 형성 방법 Download PDF

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KR101490429B1
KR101490429B1 KR20080022447A KR20080022447A KR101490429B1 KR 101490429 B1 KR101490429 B1 KR 101490429B1 KR 20080022447 A KR20080022447 A KR 20080022447A KR 20080022447 A KR20080022447 A KR 20080022447A KR 101490429 B1 KR101490429 B1 KR 101490429B1
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stud
cell
bit line
memory element
substrate
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KR20090097361A (ko
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유경창
오재희
박정훈
김형준
임동원
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삼성전자주식회사
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Priority to KR20080022447A priority Critical patent/KR101490429B1/ko
Priority to US12/273,140 priority patent/US8384060B2/en
Priority to TW098105699A priority patent/TWI505285B/zh
Priority to JP2009056472A priority patent/JP5544104B2/ja
Priority to CN200910127436.6A priority patent/CN101533849B/zh
Publication of KR20090097361A publication Critical patent/KR20090097361A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/841—Electrodes
    • H10N70/8413—Electrodes adapted for resistive heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8825—Selenides, e.g. GeSe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828—Tellurides, e.g. GeSbTe

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  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Semiconductor Memories (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR20080022447A 2008-03-11 2008-03-11 저항 메모리 소자 및 그 형성 방법 Active KR101490429B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR20080022447A KR101490429B1 (ko) 2008-03-11 2008-03-11 저항 메모리 소자 및 그 형성 방법
US12/273,140 US8384060B2 (en) 2008-03-11 2008-11-18 Resistive memory device
TW098105699A TWI505285B (zh) 2008-03-11 2009-02-23 電阻性記憶體器件及形成該器件之方法
JP2009056472A JP5544104B2 (ja) 2008-03-11 2009-03-10 抵抗メモリ素子及びその形成方法
CN200910127436.6A CN101533849B (zh) 2008-03-11 2009-03-11 电阻式存储器器件及其形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20080022447A KR101490429B1 (ko) 2008-03-11 2008-03-11 저항 메모리 소자 및 그 형성 방법

Publications (2)

Publication Number Publication Date
KR20090097361A KR20090097361A (ko) 2009-09-16
KR101490429B1 true KR101490429B1 (ko) 2015-02-11

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Country Link
US (1) US8384060B2 (https=)
JP (1) JP5544104B2 (https=)
KR (1) KR101490429B1 (https=)
CN (1) CN101533849B (https=)
TW (1) TWI505285B (https=)

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US8441060B2 (en) * 2008-10-01 2013-05-14 Panasonic Corporation Nonvolatile memory element and nonvolatile memory device incorporating nonvolatile memory element
JP5696378B2 (ja) * 2010-06-15 2015-04-08 ソニー株式会社 記憶装置の製造方法
US9240405B2 (en) * 2011-04-19 2016-01-19 Macronix International Co., Ltd. Memory with off-chip controller
KR20130059913A (ko) * 2011-11-29 2013-06-07 에스케이하이닉스 주식회사 상변화 메모리 장치 및 그의 제조방법
US8796855B2 (en) * 2012-01-13 2014-08-05 Freescale Semiconductor, Inc. Semiconductor devices with nonconductive vias
KR101829351B1 (ko) 2012-04-23 2018-03-29 삼성전자주식회사 반도체 소자의 제조방법
US8737121B2 (en) * 2012-05-23 2014-05-27 International Business Machines Corporation Drift-insensitive or invariant material for phase change memory
KR101934783B1 (ko) 2012-07-02 2019-01-03 삼성전자주식회사 상변화 메모리 장치의 제조 방법
TWI508278B (zh) * 2013-03-13 2015-11-11 旺宏電子股份有限公司 半導體元件及其製造方法
US9741918B2 (en) 2013-10-07 2017-08-22 Hypres, Inc. Method for increasing the integration level of superconducting electronics circuits, and a resulting circuit
US9514977B2 (en) 2013-12-17 2016-12-06 Kabushiki Kaisha Toshiba Semiconductor device and manufacturing method thereof
KR20150110999A (ko) 2014-03-24 2015-10-05 에스케이하이닉스 주식회사 전자 장치 및 그 제조 방법
KR102527669B1 (ko) 2016-08-11 2023-05-02 삼성전자주식회사 가변 저항 메모리 장치 및 그 제조 방법
KR102308779B1 (ko) * 2017-04-10 2021-10-05 삼성전자주식회사 이종 컨택들을 구비하는 집적 회로 및 이를 포함하는 반도체 장치
KR102343847B1 (ko) * 2017-04-25 2021-12-28 삼성전자주식회사 3차원 반도체 메모리 장치
FR3066038B1 (fr) 2017-05-05 2020-01-24 Stmicroelectronics (Crolles 2) Sas Memoire a changement de phase
US20190115392A1 (en) * 2017-10-16 2019-04-18 International Business Machines Corporation Access device and phase change memory combination structure in backend of line (beol)
KR20190055660A (ko) * 2017-11-15 2019-05-23 에스케이하이닉스 주식회사 크로스-포인트 어레이 장치 및 이의 제조 방법
CN109728024A (zh) * 2018-12-29 2019-05-07 上海新储集成电路有限公司 一种基于绝缘体上硅工艺的相变存储器结构
KR102653729B1 (ko) * 2019-12-12 2024-04-03 에스케이하이닉스 주식회사 전자 장치 및 그 제조 방법
JP2021150573A (ja) * 2020-03-23 2021-09-27 キオクシア株式会社 半導体記憶装置
US11289130B2 (en) 2020-08-20 2022-03-29 Macronix International Co., Ltd. Memory device

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Also Published As

Publication number Publication date
US20090230376A1 (en) 2009-09-17
JP2009218597A (ja) 2009-09-24
TW200943312A (en) 2009-10-16
US8384060B2 (en) 2013-02-26
KR20090097361A (ko) 2009-09-16
CN101533849A (zh) 2009-09-16
CN101533849B (zh) 2013-04-17
JP5544104B2 (ja) 2014-07-09
TWI505285B (zh) 2015-10-21

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