KR101485659B1 - 반도체 장치 제조용 접착 시트 및 반도체 장치의 제조 방법 - Google Patents
반도체 장치 제조용 접착 시트 및 반도체 장치의 제조 방법 Download PDFInfo
- Publication number
- KR101485659B1 KR101485659B1 KR20130032085A KR20130032085A KR101485659B1 KR 101485659 B1 KR101485659 B1 KR 101485659B1 KR 20130032085 A KR20130032085 A KR 20130032085A KR 20130032085 A KR20130032085 A KR 20130032085A KR 101485659 B1 KR101485659 B1 KR 101485659B1
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive layer
- semiconductor device
- lead frame
- adhesive sheet
- adhesive
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Adhesive Tapes (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2012-070401 | 2012-03-26 | ||
JP2012070401A JP5937397B2 (ja) | 2012-03-26 | 2012-03-26 | 半導体装置製造用接着シート及び半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130109069A KR20130109069A (ko) | 2013-10-07 |
KR101485659B1 true KR101485659B1 (ko) | 2015-01-22 |
Family
ID=49363268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20130032085A KR101485659B1 (ko) | 2012-03-26 | 2013-03-26 | 반도체 장치 제조용 접착 시트 및 반도체 장치의 제조 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5937397B2 (zh) |
KR (1) | KR101485659B1 (zh) |
CN (1) | CN103360971B (zh) |
TW (1) | TWI494409B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106281190A (zh) * | 2016-08-29 | 2017-01-04 | 无锡万能胶粘剂有限公司 | 一种粘接力强的喷胶 |
US9972509B2 (en) * | 2016-09-12 | 2018-05-15 | Win Semiconductors Corp. | Anti-plasma adhesive tape and manufacturing method |
KR102576310B1 (ko) * | 2018-03-30 | 2023-09-07 | 린텍 가부시키가이샤 | 경화 봉지체의 휨 방지용 적층체, 및 경화 봉지체의 제조 방법 |
KR102576309B1 (ko) * | 2018-03-30 | 2023-09-07 | 린텍 가부시키가이샤 | 경화 봉지체의 휨 방지용 적층체, 및 경화 봉지체의 제조 방법 |
JP7187906B2 (ja) * | 2018-09-10 | 2022-12-13 | 昭和電工マテリアルズ株式会社 | 半導体装置の製造方法 |
KR20210146893A (ko) * | 2019-03-26 | 2021-12-06 | 린텍 가부시키가이샤 | 박리 시트 |
CN117511426B (zh) * | 2024-01-05 | 2024-04-12 | 深圳市长松科技有限公司 | 用于封装阻隔水气的薄膜、半导体薄膜封装方法及构造 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006278963A (ja) | 2005-03-30 | 2006-10-12 | Tomoegawa Paper Co Ltd | 半導体装置製造用接着シート及び半導体装置並びにその製造方法 |
JP2007123710A (ja) | 2005-10-31 | 2007-05-17 | Tomoegawa Paper Co Ltd | 半導体装置製造用接着シート及び半導体装置並びにその製造方法 |
JP2007123711A (ja) | 2005-10-31 | 2007-05-17 | Tomoegawa Paper Co Ltd | 半導体装置製造用接着シート及び半導体装置並びにその製造方法 |
JP2011236261A (ja) | 2010-05-06 | 2011-11-24 | Furukawa Electric Co Ltd:The | 半導体用接着フィルム及び半導体装置の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2839019B2 (ja) * | 1996-08-23 | 1998-12-16 | 日本電気株式会社 | 半導体装置の製造方法 |
JP3862569B2 (ja) * | 2002-01-16 | 2006-12-27 | キヤノン株式会社 | 帯電部材、画像形成装置及びプロセスカートリッジ |
KR100633849B1 (ko) * | 2002-04-03 | 2006-10-13 | 가부시키가이샤 도모에가와 세이시쇼 | 반도체 장치 제조용 접착 시트 |
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2012
- 2012-03-26 JP JP2012070401A patent/JP5937397B2/ja active Active
-
2013
- 2013-03-22 CN CN201310095364.8A patent/CN103360971B/zh active Active
- 2013-03-22 TW TW102110258A patent/TWI494409B/zh active
- 2013-03-26 KR KR20130032085A patent/KR101485659B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006278963A (ja) | 2005-03-30 | 2006-10-12 | Tomoegawa Paper Co Ltd | 半導体装置製造用接着シート及び半導体装置並びにその製造方法 |
JP2007123710A (ja) | 2005-10-31 | 2007-05-17 | Tomoegawa Paper Co Ltd | 半導体装置製造用接着シート及び半導体装置並びにその製造方法 |
JP2007123711A (ja) | 2005-10-31 | 2007-05-17 | Tomoegawa Paper Co Ltd | 半導体装置製造用接着シート及び半導体装置並びにその製造方法 |
JP2011236261A (ja) | 2010-05-06 | 2011-11-24 | Furukawa Electric Co Ltd:The | 半導体用接着フィルム及び半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103360971B (zh) | 2015-12-23 |
JP2013201402A (ja) | 2013-10-03 |
TW201350557A (zh) | 2013-12-16 |
TWI494409B (zh) | 2015-08-01 |
CN103360971A (zh) | 2013-10-23 |
JP5937397B2 (ja) | 2016-06-22 |
KR20130109069A (ko) | 2013-10-07 |
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