KR101483417B1 - 광전변환장치의 제조 방법 - Google Patents

광전변환장치의 제조 방법 Download PDF

Info

Publication number
KR101483417B1
KR101483417B1 KR20080119602A KR20080119602A KR101483417B1 KR 101483417 B1 KR101483417 B1 KR 101483417B1 KR 20080119602 A KR20080119602 A KR 20080119602A KR 20080119602 A KR20080119602 A KR 20080119602A KR 101483417 B1 KR101483417 B1 KR 101483417B1
Authority
KR
South Korea
Prior art keywords
semiconductor layer
single crystal
layer
crystal semiconductor
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR20080119602A
Other languages
English (en)
Korean (ko)
Other versions
KR20090056899A (ko
Inventor
푸미토 이사카
쇼 카토
코세이 네이
류 코마츠
아키히사 시모무라
코지 다이리키
Original Assignee
가부시키가이샤 한도오따이 에네루기 켄큐쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 한도오따이 에네루기 켄큐쇼 filed Critical 가부시키가이샤 한도오따이 에네루기 켄큐쇼
Publication of KR20090056899A publication Critical patent/KR20090056899A/ko
Application granted granted Critical
Publication of KR101483417B1 publication Critical patent/KR101483417B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/121The active layers comprising only Group IV materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00Individual photovoltaic cells, e.g. solar cells
    • H10F10/10Individual photovoltaic cells, e.g. solar cells having potential barriers
    • H10F10/17Photovoltaic cells having only PIN junction potential barriers
    • H10F10/174Photovoltaic cells having only PIN junction potential barriers comprising monocrystalline or polycrystalline materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/548Amorphous silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Photovoltaic Devices (AREA)
  • Electroluminescent Light Sources (AREA)
KR20080119602A 2007-11-30 2008-11-28 광전변환장치의 제조 방법 Expired - Fee Related KR101483417B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-310817 2007-11-30
JP2007310817 2007-11-30

Publications (2)

Publication Number Publication Date
KR20090056899A KR20090056899A (ko) 2009-06-03
KR101483417B1 true KR101483417B1 (ko) 2015-01-16

Family

ID=40459831

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20080119602A Expired - Fee Related KR101483417B1 (ko) 2007-11-30 2008-11-28 광전변환장치의 제조 방법

Country Status (4)

Country Link
US (1) US7985604B2 (enExample)
EP (1) EP2065946A2 (enExample)
JP (1) JP5248994B2 (enExample)
KR (1) KR101483417B1 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5248995B2 (ja) * 2007-11-30 2013-07-31 株式会社半導体エネルギー研究所 光電変換装置の製造方法
JP5572307B2 (ja) * 2007-12-28 2014-08-13 株式会社半導体エネルギー研究所 光電変換装置の製造方法
EP2075850A3 (en) * 2007-12-28 2011-08-24 Semiconductor Energy Laboratory Co, Ltd. Photoelectric conversion device and manufacturing method thereof
US20110018104A1 (en) * 2008-01-16 2011-01-27 Toru Nagashima METHOD FOR PRODUCING A LAMINATED BODY HAVING Al-BASED GROUP-III NITRIDE SINGLE CRYSTAL LAYER, LAMINATED BODY PRODUCED BY THE METHOD, METHOD FOR PRODUCING Al-BASED GROUP-III NITRIDE SINGLE CRYSTAL SUBSTRATE EMPLOYING THE LAMINATED BODY, AND ALUMINUM NITRIDE SINGLE CRYSTAL SUBSTRATE
US8017429B2 (en) * 2008-02-19 2011-09-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing photoelectric conversion device
JP5654206B2 (ja) * 2008-03-26 2015-01-14 株式会社半導体エネルギー研究所 Soi基板の作製方法及び該soi基板を用いた半導体装置
US8338218B2 (en) * 2008-06-26 2012-12-25 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device module and manufacturing method of the photoelectric conversion device module
JP5552276B2 (ja) * 2008-08-01 2014-07-16 株式会社半導体エネルギー研究所 Soi基板の作製方法
SG182208A1 (en) * 2008-12-15 2012-07-30 Semiconductor Energy Lab Manufacturing method of soi substrate and manufacturing method of semiconductor device
JP5706670B2 (ja) 2009-11-24 2015-04-22 株式会社半導体エネルギー研究所 Soi基板の作製方法
US8704083B2 (en) * 2010-02-11 2014-04-22 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and fabrication method thereof
KR101112494B1 (ko) * 2010-03-17 2012-03-13 한국과학기술원 광기전력 장치의 제조 방법
JP5755931B2 (ja) 2010-04-28 2015-07-29 株式会社半導体エネルギー研究所 半導体膜の作製方法、電極の作製方法、2次電池の作製方法、および太陽電池の作製方法
NO20100616A1 (no) * 2010-04-28 2011-10-31 Innotech Solar Asa Fremgangsmate og anordning for a fjerne en defekt fra en solcelle
US8173452B1 (en) * 2010-12-29 2012-05-08 Twin Creeks Technologies, Inc. Method to form a device by constructing a support element on a thin semiconductor lamina
WO2012092026A2 (en) * 2010-12-29 2012-07-05 Twin Creeks Technologies, Inc. A method and apparatus for forming a thin lamina
US8536448B2 (en) 2010-12-29 2013-09-17 Gtat Corporation Zener diode within a diode structure providing shunt protection
EP2659517A4 (en) * 2010-12-29 2017-10-25 Gtat Corporation A method to form a device by constructing a support element on a thin semiconductor lamina
US8435804B2 (en) 2010-12-29 2013-05-07 Gtat Corporation Method and apparatus for forming a thin lamina
US8268645B2 (en) 2010-12-29 2012-09-18 Twin Creeks Technologies, Inc. Method and apparatus for forming a thin lamina
JP2013058562A (ja) 2011-09-07 2013-03-28 Semiconductor Energy Lab Co Ltd 光電変換装置
US8916954B2 (en) * 2012-02-05 2014-12-23 Gtat Corporation Multi-layer metal support
US8841161B2 (en) 2012-02-05 2014-09-23 GTAT.Corporation Method for forming flexible solar cells
US8785294B2 (en) 2012-07-26 2014-07-22 Gtat Corporation Silicon carbide lamina
JP6459948B2 (ja) * 2015-12-15 2019-01-30 株式会社Sumco 半導体エピタキシャルウェーハの製造方法および固体撮像素子の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63196082A (ja) * 1987-02-10 1988-08-15 Toa Nenryo Kogyo Kk 太陽電池の製造方法
JPH1093122A (ja) * 1996-09-10 1998-04-10 Nippon Telegr & Teleph Corp <Ntt> 薄膜太陽電池の製造方法
JPH10335683A (ja) * 1997-05-28 1998-12-18 Ion Kogaku Kenkyusho:Kk タンデム型太陽電池およびその製造方法
JP2000150940A (ja) * 1998-11-18 2000-05-30 Denso Corp 半導体微粒子集合体及びその製造方法

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4180618A (en) * 1977-07-27 1979-12-25 Corning Glass Works Thin silicon film electronic device
EP0193830A3 (en) * 1980-04-10 1986-10-01 Massachusetts Institute Of Technology Solar cell device incorporating plural constituent solar cells
JPS57160179A (en) * 1981-03-28 1982-10-02 Tdk Corp Photodiode device and manufacture thereof
JPH0644638B2 (ja) 1982-12-29 1994-06-08 圭弘 濱川 異質単位セル同士のスタック形光起電力素子
US4496788A (en) * 1982-12-29 1985-01-29 Osaka Transformer Co., Ltd. Photovoltaic device
US4633034A (en) * 1985-02-08 1986-12-30 Energy Conversion Devices, Inc. Photovoltaic device and method
EP0469630B1 (en) * 1990-08-03 2002-05-08 Canon Kabushiki Kaisha Process for preparing a semiconductor body
US5750000A (en) * 1990-08-03 1998-05-12 Canon Kabushiki Kaisha Semiconductor member, and process for preparing same and semiconductor device formed by use of same
CA2069038C (en) * 1991-05-22 1997-08-12 Kiyofumi Sakaguchi Method for preparing semiconductor member
JPH0644638A (ja) 1992-07-24 1994-02-18 Sony Corp 録音装置
JP3360919B2 (ja) * 1993-06-11 2003-01-07 三菱電機株式会社 薄膜太陽電池の製造方法,及び薄膜太陽電池
JP3381443B2 (ja) * 1995-02-02 2003-02-24 ソニー株式会社 基体から半導体層を分離する方法、半導体素子の製造方法およびsoi基板の製造方法
US5736431A (en) * 1995-02-28 1998-04-07 Semiconductor Energy Laboratory Co., Ltd. Method for producing thin film solar battery
JPH08255762A (ja) * 1995-03-17 1996-10-01 Nec Corp 半導体デバイスの製造方法
CN1132223C (zh) * 1995-10-06 2003-12-24 佳能株式会社 半导体衬底及其制造方法
EP0851513B1 (en) * 1996-12-27 2007-11-21 Canon Kabushiki Kaisha Method of producing semiconductor member and method of producing solar cell
JPH1197379A (ja) 1997-07-25 1999-04-09 Denso Corp 半導体基板及び半導体基板の製造方法
US6534380B1 (en) * 1997-07-18 2003-03-18 Denso Corporation Semiconductor substrate and method of manufacturing the same
JPH11163363A (ja) 1997-11-22 1999-06-18 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
US6331208B1 (en) * 1998-05-15 2001-12-18 Canon Kabushiki Kaisha Process for producing solar cell, process for producing thin-film semiconductor, process for separating thin-film semiconductor, and process for forming semiconductor
JP2000012864A (ja) * 1998-06-22 2000-01-14 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2000124092A (ja) * 1998-10-16 2000-04-28 Shin Etsu Handotai Co Ltd 水素イオン注入剥離法によってsoiウエーハを製造する方法およびこの方法で製造されたsoiウエーハ
JP2000349264A (ja) * 1998-12-04 2000-12-15 Canon Inc 半導体ウエハの製造方法、使用方法および利用方法
EP1039513A3 (en) * 1999-03-26 2008-11-26 Canon Kabushiki Kaisha Method of producing a SOI wafer
JP2001015721A (ja) * 1999-04-30 2001-01-19 Canon Inc 複合部材の分離方法及び薄膜の製造方法
US6387829B1 (en) * 1999-06-18 2002-05-14 Silicon Wafer Technologies, Inc. Separation process for silicon-on-insulator wafer fabrication
JP4452789B2 (ja) * 1999-09-01 2010-04-21 独立行政法人 日本原子力研究開発機構 シリコン系結晶薄板の製造方法および光電変換素子用基板の製造方法
JP2001160540A (ja) * 1999-09-22 2001-06-12 Canon Inc 半導体装置の製造方法、液相成長法及び液相成長装置、太陽電池
JP2001127313A (ja) * 1999-10-25 2001-05-11 Sony Corp 薄膜半導体素子およびその製造方法
JP3513592B2 (ja) * 2000-09-25 2004-03-31 独立行政法人産業技術総合研究所 太陽電池の製造方法
JP2002348198A (ja) 2001-05-28 2002-12-04 Nissin Electric Co Ltd 半導体素子エピタキシャル成長用基板及びその製造方法
US6818529B2 (en) * 2002-09-12 2004-11-16 Applied Materials, Inc. Apparatus and method for forming a silicon film across the surface of a glass substrate
JP2005268682A (ja) 2004-03-22 2005-09-29 Canon Inc 半導体基材及び太陽電池の製造方法
EP2002484A4 (en) * 2006-04-05 2016-06-08 Silicon Genesis Corp METHOD AND STRUCTURE FOR MANUFACTURING PHOTOVOLTAIC CELLS USING A LAYER TRANSFER PROCESS
JP2007310817A (ja) 2006-05-22 2007-11-29 Sharp Corp 追加認証方法及び認証装置
JP2008112847A (ja) * 2006-10-30 2008-05-15 Shin Etsu Chem Co Ltd 単結晶シリコン太陽電池の製造方法及び単結晶シリコン太陽電池
EP2135295A4 (en) * 2007-04-06 2014-05-21 Semiconductor Energy Lab Photovoltaic module and method for its production
EP2143146A1 (en) * 2007-04-13 2010-01-13 Semiconductor Energy Laboratory Co, Ltd. Photovoltaic device and method for manufacturing the same
JP5459899B2 (ja) * 2007-06-01 2014-04-02 株式会社半導体エネルギー研究所 半導体装置の作製方法
WO2009060808A1 (en) * 2007-11-09 2009-05-14 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and method for manufacturing the same
JP5315008B2 (ja) * 2007-11-16 2013-10-16 株式会社半導体エネルギー研究所 光電変換装置
JP5286046B2 (ja) * 2007-11-30 2013-09-11 株式会社半導体エネルギー研究所 光電変換装置の製造方法
JP5248995B2 (ja) * 2007-11-30 2013-07-31 株式会社半導体エネルギー研究所 光電変換装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63196082A (ja) * 1987-02-10 1988-08-15 Toa Nenryo Kogyo Kk 太陽電池の製造方法
JPH1093122A (ja) * 1996-09-10 1998-04-10 Nippon Telegr & Teleph Corp <Ntt> 薄膜太陽電池の製造方法
JPH10335683A (ja) * 1997-05-28 1998-12-18 Ion Kogaku Kenkyusho:Kk タンデム型太陽電池およびその製造方法
JP2000150940A (ja) * 1998-11-18 2000-05-30 Denso Corp 半導体微粒子集合体及びその製造方法

Also Published As

Publication number Publication date
KR20090056899A (ko) 2009-06-03
US20090142908A1 (en) 2009-06-04
JP5248994B2 (ja) 2013-07-31
EP2065946A2 (en) 2009-06-03
US7985604B2 (en) 2011-07-26
JP2009152566A (ja) 2009-07-09

Similar Documents

Publication Publication Date Title
KR101483417B1 (ko) 광전변환장치의 제조 방법
KR101608953B1 (ko) 광전 변환 장치 및 그 제조 방법
JP5248995B2 (ja) 光電変換装置の製造方法
US8008169B2 (en) Method for manufacturing photoelectric conversion device
US8338218B2 (en) Photoelectric conversion device module and manufacturing method of the photoelectric conversion device module
JP5315008B2 (ja) 光電変換装置
JP5286146B2 (ja) 光電変換装置の作製方法
US20090139558A1 (en) Photoelectric conversion device and manufacturing method thereof

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20171219

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20181226

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20200113

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20200113

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000