KR101483417B1 - 광전변환장치의 제조 방법 - Google Patents
광전변환장치의 제조 방법 Download PDFInfo
- Publication number
- KR101483417B1 KR101483417B1 KR20080119602A KR20080119602A KR101483417B1 KR 101483417 B1 KR101483417 B1 KR 101483417B1 KR 20080119602 A KR20080119602 A KR 20080119602A KR 20080119602 A KR20080119602 A KR 20080119602A KR 101483417 B1 KR101483417 B1 KR 101483417B1
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor layer
- single crystal
- layer
- crystal semiconductor
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/17—Photovoltaic cells having only PIN junction potential barriers
- H10F10/174—Photovoltaic cells having only PIN junction potential barriers comprising monocrystalline or polycrystalline materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Photovoltaic Devices (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2007-310817 | 2007-11-30 | ||
| JP2007310817 | 2007-11-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20090056899A KR20090056899A (ko) | 2009-06-03 |
| KR101483417B1 true KR101483417B1 (ko) | 2015-01-16 |
Family
ID=40459831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR20080119602A Expired - Fee Related KR101483417B1 (ko) | 2007-11-30 | 2008-11-28 | 광전변환장치의 제조 방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7985604B2 (enExample) |
| EP (1) | EP2065946A2 (enExample) |
| JP (1) | JP5248994B2 (enExample) |
| KR (1) | KR101483417B1 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5248995B2 (ja) * | 2007-11-30 | 2013-07-31 | 株式会社半導体エネルギー研究所 | 光電変換装置の製造方法 |
| JP5572307B2 (ja) * | 2007-12-28 | 2014-08-13 | 株式会社半導体エネルギー研究所 | 光電変換装置の製造方法 |
| EP2075850A3 (en) * | 2007-12-28 | 2011-08-24 | Semiconductor Energy Laboratory Co, Ltd. | Photoelectric conversion device and manufacturing method thereof |
| US20110018104A1 (en) * | 2008-01-16 | 2011-01-27 | Toru Nagashima | METHOD FOR PRODUCING A LAMINATED BODY HAVING Al-BASED GROUP-III NITRIDE SINGLE CRYSTAL LAYER, LAMINATED BODY PRODUCED BY THE METHOD, METHOD FOR PRODUCING Al-BASED GROUP-III NITRIDE SINGLE CRYSTAL SUBSTRATE EMPLOYING THE LAMINATED BODY, AND ALUMINUM NITRIDE SINGLE CRYSTAL SUBSTRATE |
| US8017429B2 (en) * | 2008-02-19 | 2011-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing photoelectric conversion device |
| JP5654206B2 (ja) * | 2008-03-26 | 2015-01-14 | 株式会社半導体エネルギー研究所 | Soi基板の作製方法及び該soi基板を用いた半導体装置 |
| US8338218B2 (en) * | 2008-06-26 | 2012-12-25 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device module and manufacturing method of the photoelectric conversion device module |
| JP5552276B2 (ja) * | 2008-08-01 | 2014-07-16 | 株式会社半導体エネルギー研究所 | Soi基板の作製方法 |
| SG182208A1 (en) * | 2008-12-15 | 2012-07-30 | Semiconductor Energy Lab | Manufacturing method of soi substrate and manufacturing method of semiconductor device |
| JP5706670B2 (ja) | 2009-11-24 | 2015-04-22 | 株式会社半導体エネルギー研究所 | Soi基板の作製方法 |
| US8704083B2 (en) * | 2010-02-11 | 2014-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and fabrication method thereof |
| KR101112494B1 (ko) * | 2010-03-17 | 2012-03-13 | 한국과학기술원 | 광기전력 장치의 제조 방법 |
| JP5755931B2 (ja) | 2010-04-28 | 2015-07-29 | 株式会社半導体エネルギー研究所 | 半導体膜の作製方法、電極の作製方法、2次電池の作製方法、および太陽電池の作製方法 |
| NO20100616A1 (no) * | 2010-04-28 | 2011-10-31 | Innotech Solar Asa | Fremgangsmate og anordning for a fjerne en defekt fra en solcelle |
| US8173452B1 (en) * | 2010-12-29 | 2012-05-08 | Twin Creeks Technologies, Inc. | Method to form a device by constructing a support element on a thin semiconductor lamina |
| WO2012092026A2 (en) * | 2010-12-29 | 2012-07-05 | Twin Creeks Technologies, Inc. | A method and apparatus for forming a thin lamina |
| US8536448B2 (en) | 2010-12-29 | 2013-09-17 | Gtat Corporation | Zener diode within a diode structure providing shunt protection |
| EP2659517A4 (en) * | 2010-12-29 | 2017-10-25 | Gtat Corporation | A method to form a device by constructing a support element on a thin semiconductor lamina |
| US8435804B2 (en) | 2010-12-29 | 2013-05-07 | Gtat Corporation | Method and apparatus for forming a thin lamina |
| US8268645B2 (en) | 2010-12-29 | 2012-09-18 | Twin Creeks Technologies, Inc. | Method and apparatus for forming a thin lamina |
| JP2013058562A (ja) | 2011-09-07 | 2013-03-28 | Semiconductor Energy Lab Co Ltd | 光電変換装置 |
| US8916954B2 (en) * | 2012-02-05 | 2014-12-23 | Gtat Corporation | Multi-layer metal support |
| US8841161B2 (en) | 2012-02-05 | 2014-09-23 | GTAT.Corporation | Method for forming flexible solar cells |
| US8785294B2 (en) | 2012-07-26 | 2014-07-22 | Gtat Corporation | Silicon carbide lamina |
| JP6459948B2 (ja) * | 2015-12-15 | 2019-01-30 | 株式会社Sumco | 半導体エピタキシャルウェーハの製造方法および固体撮像素子の製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63196082A (ja) * | 1987-02-10 | 1988-08-15 | Toa Nenryo Kogyo Kk | 太陽電池の製造方法 |
| JPH1093122A (ja) * | 1996-09-10 | 1998-04-10 | Nippon Telegr & Teleph Corp <Ntt> | 薄膜太陽電池の製造方法 |
| JPH10335683A (ja) * | 1997-05-28 | 1998-12-18 | Ion Kogaku Kenkyusho:Kk | タンデム型太陽電池およびその製造方法 |
| JP2000150940A (ja) * | 1998-11-18 | 2000-05-30 | Denso Corp | 半導体微粒子集合体及びその製造方法 |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4180618A (en) * | 1977-07-27 | 1979-12-25 | Corning Glass Works | Thin silicon film electronic device |
| EP0193830A3 (en) * | 1980-04-10 | 1986-10-01 | Massachusetts Institute Of Technology | Solar cell device incorporating plural constituent solar cells |
| JPS57160179A (en) * | 1981-03-28 | 1982-10-02 | Tdk Corp | Photodiode device and manufacture thereof |
| JPH0644638B2 (ja) | 1982-12-29 | 1994-06-08 | 圭弘 濱川 | 異質単位セル同士のスタック形光起電力素子 |
| US4496788A (en) * | 1982-12-29 | 1985-01-29 | Osaka Transformer Co., Ltd. | Photovoltaic device |
| US4633034A (en) * | 1985-02-08 | 1986-12-30 | Energy Conversion Devices, Inc. | Photovoltaic device and method |
| EP0469630B1 (en) * | 1990-08-03 | 2002-05-08 | Canon Kabushiki Kaisha | Process for preparing a semiconductor body |
| US5750000A (en) * | 1990-08-03 | 1998-05-12 | Canon Kabushiki Kaisha | Semiconductor member, and process for preparing same and semiconductor device formed by use of same |
| CA2069038C (en) * | 1991-05-22 | 1997-08-12 | Kiyofumi Sakaguchi | Method for preparing semiconductor member |
| JPH0644638A (ja) | 1992-07-24 | 1994-02-18 | Sony Corp | 録音装置 |
| JP3360919B2 (ja) * | 1993-06-11 | 2003-01-07 | 三菱電機株式会社 | 薄膜太陽電池の製造方法,及び薄膜太陽電池 |
| JP3381443B2 (ja) * | 1995-02-02 | 2003-02-24 | ソニー株式会社 | 基体から半導体層を分離する方法、半導体素子の製造方法およびsoi基板の製造方法 |
| US5736431A (en) * | 1995-02-28 | 1998-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Method for producing thin film solar battery |
| JPH08255762A (ja) * | 1995-03-17 | 1996-10-01 | Nec Corp | 半導体デバイスの製造方法 |
| CN1132223C (zh) * | 1995-10-06 | 2003-12-24 | 佳能株式会社 | 半导体衬底及其制造方法 |
| EP0851513B1 (en) * | 1996-12-27 | 2007-11-21 | Canon Kabushiki Kaisha | Method of producing semiconductor member and method of producing solar cell |
| JPH1197379A (ja) | 1997-07-25 | 1999-04-09 | Denso Corp | 半導体基板及び半導体基板の製造方法 |
| US6534380B1 (en) * | 1997-07-18 | 2003-03-18 | Denso Corporation | Semiconductor substrate and method of manufacturing the same |
| JPH11163363A (ja) | 1997-11-22 | 1999-06-18 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| US6331208B1 (en) * | 1998-05-15 | 2001-12-18 | Canon Kabushiki Kaisha | Process for producing solar cell, process for producing thin-film semiconductor, process for separating thin-film semiconductor, and process for forming semiconductor |
| JP2000012864A (ja) * | 1998-06-22 | 2000-01-14 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JP2000124092A (ja) * | 1998-10-16 | 2000-04-28 | Shin Etsu Handotai Co Ltd | 水素イオン注入剥離法によってsoiウエーハを製造する方法およびこの方法で製造されたsoiウエーハ |
| JP2000349264A (ja) * | 1998-12-04 | 2000-12-15 | Canon Inc | 半導体ウエハの製造方法、使用方法および利用方法 |
| EP1039513A3 (en) * | 1999-03-26 | 2008-11-26 | Canon Kabushiki Kaisha | Method of producing a SOI wafer |
| JP2001015721A (ja) * | 1999-04-30 | 2001-01-19 | Canon Inc | 複合部材の分離方法及び薄膜の製造方法 |
| US6387829B1 (en) * | 1999-06-18 | 2002-05-14 | Silicon Wafer Technologies, Inc. | Separation process for silicon-on-insulator wafer fabrication |
| JP4452789B2 (ja) * | 1999-09-01 | 2010-04-21 | 独立行政法人 日本原子力研究開発機構 | シリコン系結晶薄板の製造方法および光電変換素子用基板の製造方法 |
| JP2001160540A (ja) * | 1999-09-22 | 2001-06-12 | Canon Inc | 半導体装置の製造方法、液相成長法及び液相成長装置、太陽電池 |
| JP2001127313A (ja) * | 1999-10-25 | 2001-05-11 | Sony Corp | 薄膜半導体素子およびその製造方法 |
| JP3513592B2 (ja) * | 2000-09-25 | 2004-03-31 | 独立行政法人産業技術総合研究所 | 太陽電池の製造方法 |
| JP2002348198A (ja) | 2001-05-28 | 2002-12-04 | Nissin Electric Co Ltd | 半導体素子エピタキシャル成長用基板及びその製造方法 |
| US6818529B2 (en) * | 2002-09-12 | 2004-11-16 | Applied Materials, Inc. | Apparatus and method for forming a silicon film across the surface of a glass substrate |
| JP2005268682A (ja) | 2004-03-22 | 2005-09-29 | Canon Inc | 半導体基材及び太陽電池の製造方法 |
| EP2002484A4 (en) * | 2006-04-05 | 2016-06-08 | Silicon Genesis Corp | METHOD AND STRUCTURE FOR MANUFACTURING PHOTOVOLTAIC CELLS USING A LAYER TRANSFER PROCESS |
| JP2007310817A (ja) | 2006-05-22 | 2007-11-29 | Sharp Corp | 追加認証方法及び認証装置 |
| JP2008112847A (ja) * | 2006-10-30 | 2008-05-15 | Shin Etsu Chem Co Ltd | 単結晶シリコン太陽電池の製造方法及び単結晶シリコン太陽電池 |
| EP2135295A4 (en) * | 2007-04-06 | 2014-05-21 | Semiconductor Energy Lab | Photovoltaic module and method for its production |
| EP2143146A1 (en) * | 2007-04-13 | 2010-01-13 | Semiconductor Energy Laboratory Co, Ltd. | Photovoltaic device and method for manufacturing the same |
| JP5459899B2 (ja) * | 2007-06-01 | 2014-04-02 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| WO2009060808A1 (en) * | 2007-11-09 | 2009-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and method for manufacturing the same |
| JP5315008B2 (ja) * | 2007-11-16 | 2013-10-16 | 株式会社半導体エネルギー研究所 | 光電変換装置 |
| JP5286046B2 (ja) * | 2007-11-30 | 2013-09-11 | 株式会社半導体エネルギー研究所 | 光電変換装置の製造方法 |
| JP5248995B2 (ja) * | 2007-11-30 | 2013-07-31 | 株式会社半導体エネルギー研究所 | 光電変換装置の製造方法 |
-
2008
- 2008-11-18 JP JP2008294261A patent/JP5248994B2/ja not_active Expired - Fee Related
- 2008-11-26 US US12/324,065 patent/US7985604B2/en not_active Expired - Fee Related
- 2008-11-26 EP EP08020573A patent/EP2065946A2/en not_active Withdrawn
- 2008-11-28 KR KR20080119602A patent/KR101483417B1/ko not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63196082A (ja) * | 1987-02-10 | 1988-08-15 | Toa Nenryo Kogyo Kk | 太陽電池の製造方法 |
| JPH1093122A (ja) * | 1996-09-10 | 1998-04-10 | Nippon Telegr & Teleph Corp <Ntt> | 薄膜太陽電池の製造方法 |
| JPH10335683A (ja) * | 1997-05-28 | 1998-12-18 | Ion Kogaku Kenkyusho:Kk | タンデム型太陽電池およびその製造方法 |
| JP2000150940A (ja) * | 1998-11-18 | 2000-05-30 | Denso Corp | 半導体微粒子集合体及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090056899A (ko) | 2009-06-03 |
| US20090142908A1 (en) | 2009-06-04 |
| JP5248994B2 (ja) | 2013-07-31 |
| EP2065946A2 (en) | 2009-06-03 |
| US7985604B2 (en) | 2011-07-26 |
| JP2009152566A (ja) | 2009-07-09 |
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