KR101483180B1 - 성막 장치 - Google Patents

성막 장치 Download PDF

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Publication number
KR101483180B1
KR101483180B1 KR1020137017047A KR20137017047A KR101483180B1 KR 101483180 B1 KR101483180 B1 KR 101483180B1 KR 1020137017047 A KR1020137017047 A KR 1020137017047A KR 20137017047 A KR20137017047 A KR 20137017047A KR 101483180 B1 KR101483180 B1 KR 101483180B1
Authority
KR
South Korea
Prior art keywords
space
chamber
substrate
tray
film forming
Prior art date
Application number
KR1020137017047A
Other languages
English (en)
Korean (ko)
Other versions
KR20130087604A (ko
Inventor
요시카츠 사토
데츠히로 오노
히로키 오오조라
시게미츠 사토
Original Assignee
가부시키가이샤 아루박
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 아루박 filed Critical 가부시키가이샤 아루박
Publication of KR20130087604A publication Critical patent/KR20130087604A/ko
Application granted granted Critical
Publication of KR101483180B1 publication Critical patent/KR101483180B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020137017047A 2011-04-11 2011-10-25 성막 장치 KR101483180B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011087583 2011-04-11
JPJP-P-2011-087583 2011-04-11
PCT/JP2011/074502 WO2012140799A1 (ja) 2011-04-11 2011-10-25 成膜装置

Publications (2)

Publication Number Publication Date
KR20130087604A KR20130087604A (ko) 2013-08-06
KR101483180B1 true KR101483180B1 (ko) 2015-01-19

Family

ID=47008998

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137017047A KR101483180B1 (ko) 2011-04-11 2011-10-25 성막 장치

Country Status (5)

Country Link
JP (1) JP5596853B2 (ja)
KR (1) KR101483180B1 (ja)
CN (1) CN103283011B (ja)
TW (1) TWI498992B (ja)
WO (1) WO2012140799A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105849310B (zh) * 2013-12-23 2018-11-27 应用材料公司 用于在真空工艺期间保持基板的保持设备、用于在基板上沉积层的设备及用于输送保持设备的方法
TWI551530B (zh) * 2014-06-09 2016-10-01 All Ring Tech Co Ltd Material handling methods and devices
CN108138304A (zh) * 2015-10-25 2018-06-08 应用材料公司 用于在基板上真空沉积的设备和用于在真空沉积期间掩蔽基板的方法
CN109496350B (zh) * 2017-06-08 2023-02-17 株式会社爱发科 基板导向件及载体
JP2019119903A (ja) 2017-12-28 2019-07-22 キヤノントッキ株式会社 基板加熱装置及び成膜装置
CN114906617B (zh) * 2022-05-06 2024-03-12 浙江中科尚弘离子装备工程有限公司 一种多片大尺寸玻璃基板离子注入直线传送装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060088909A (ko) * 1998-11-17 2006-08-07 동경 엘렉트론 주식회사 진공 처리 시스템
JP2006263599A (ja) * 2005-03-24 2006-10-05 Toray Ind Inc ペースト分散装置およびペースト製造方法
KR20090117822A (ko) * 2007-04-16 2009-11-12 가부시키가이샤 아루박 콘베이어 및 성막 장치와 그 보수관리 방법
JP2010209434A (ja) * 2009-03-11 2010-09-24 Ulvac Japan Ltd 成膜装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002337028A (ja) * 2001-05-11 2002-11-26 Ntn Corp 微小部品供給装置
JP2008121806A (ja) * 2006-11-13 2008-05-29 Fukui Byora Co Ltd 弁軸の製造方法及びそれによって製造された弁軸
KR101290884B1 (ko) * 2007-12-06 2013-07-29 가부시키가이샤 알박 진공 처리 장치 및 기판 처리 방법
JP5222945B2 (ja) * 2008-08-29 2013-06-26 株式会社アルバック マグネトロンスパッタカソード及び成膜装置
JP2010244626A (ja) * 2009-04-07 2010-10-28 Alphana Technology Co Ltd ディスク駆動装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060088909A (ko) * 1998-11-17 2006-08-07 동경 엘렉트론 주식회사 진공 처리 시스템
JP2006263599A (ja) * 2005-03-24 2006-10-05 Toray Ind Inc ペースト分散装置およびペースト製造方法
KR20090117822A (ko) * 2007-04-16 2009-11-12 가부시키가이샤 아루박 콘베이어 및 성막 장치와 그 보수관리 방법
JP2010209434A (ja) * 2009-03-11 2010-09-24 Ulvac Japan Ltd 成膜装置

Also Published As

Publication number Publication date
CN103283011B (zh) 2016-02-03
KR20130087604A (ko) 2013-08-06
TWI498992B (zh) 2015-09-01
WO2012140799A1 (ja) 2012-10-18
JPWO2012140799A1 (ja) 2014-07-28
CN103283011A (zh) 2013-09-04
TW201241956A (en) 2012-10-16
JP5596853B2 (ja) 2014-09-24

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