KR101437215B1 - 임프린트 장치 및 물품 제조 방법 - Google Patents
임프린트 장치 및 물품 제조 방법 Download PDFInfo
- Publication number
- KR101437215B1 KR101437215B1 KR1020120022757A KR20120022757A KR101437215B1 KR 101437215 B1 KR101437215 B1 KR 101437215B1 KR 1020120022757 A KR1020120022757 A KR 1020120022757A KR 20120022757 A KR20120022757 A KR 20120022757A KR 101437215 B1 KR101437215 B1 KR 101437215B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- mold
- cleaning
- holding portion
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C2037/90—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0096—Trouble-shooting during starting or stopping moulding or shaping apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/887—Nanoimprint lithography, i.e. nanostamp
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011049604A JP5769451B2 (ja) | 2011-03-07 | 2011-03-07 | インプリント装置および物品の製造方法 |
| JPJP-P-2011-049604 | 2011-03-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120102014A KR20120102014A (ko) | 2012-09-17 |
| KR101437215B1 true KR101437215B1 (ko) | 2014-09-03 |
Family
ID=46794805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020120022757A Expired - Fee Related KR101437215B1 (ko) | 2011-03-07 | 2012-03-06 | 임프린트 장치 및 물품 제조 방법 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8992206B2 (enExample) |
| JP (1) | JP5769451B2 (enExample) |
| KR (1) | KR101437215B1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5823938B2 (ja) * | 2012-09-07 | 2015-11-25 | 株式会社東芝 | モールド洗浄装置及びモールド洗浄方法 |
| US20140239529A1 (en) * | 2012-09-28 | 2014-08-28 | Nanonex Corporation | System and Methods For Nano-Scale Manufacturing |
| KR101911588B1 (ko) | 2012-10-04 | 2018-10-24 | 다이니폰 인사츠 가부시키가이샤 | 임프린트 방법 및 임프린트 장치 |
| JP6333039B2 (ja) | 2013-05-16 | 2018-05-30 | キヤノン株式会社 | インプリント装置、デバイス製造方法およびインプリント方法 |
| JP6120678B2 (ja) | 2013-05-27 | 2017-04-26 | キヤノン株式会社 | インプリント方法、インプリント装置及びデバイス製造方法 |
| JP6315904B2 (ja) | 2013-06-28 | 2018-04-25 | キヤノン株式会社 | インプリント方法、インプリント装置及びデバイスの製造方法 |
| JP6161450B2 (ja) * | 2013-07-22 | 2017-07-12 | キヤノン株式会社 | インプリント装置、及びそれを用いたデバイス製造方法 |
| JP5951566B2 (ja) * | 2013-08-23 | 2016-07-13 | 株式会社東芝 | モールド洗浄装置及びモールド洗浄方法 |
| JP6234207B2 (ja) * | 2013-12-18 | 2017-11-22 | キヤノン株式会社 | インプリント方法、インプリント装置および物品の製造方法 |
| JP6313591B2 (ja) * | 2013-12-20 | 2018-04-18 | キヤノン株式会社 | インプリント装置、異物除去方法及び物品の製造方法 |
| JP6661397B2 (ja) * | 2015-04-22 | 2020-03-11 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品の製造方法 |
| JP6702672B2 (ja) * | 2015-09-03 | 2020-06-03 | キヤノン株式会社 | インプリント装置、物品の製造方法及び供給装置 |
| JP6777977B2 (ja) * | 2015-09-15 | 2020-10-28 | キヤノン株式会社 | インプリント装置、インプリント方法及び物品の製造方法 |
| KR102215539B1 (ko) * | 2015-11-20 | 2021-02-16 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치 및 리소그래피 장치를 작동시키는 방법 |
| JP6603678B2 (ja) * | 2016-02-26 | 2019-11-06 | キヤノン株式会社 | インプリント装置およびその動作方法ならびに物品製造方法 |
| JP6894785B2 (ja) * | 2017-07-12 | 2021-06-30 | キヤノン株式会社 | インプリント装置および物品製造方法 |
| JP6942562B2 (ja) * | 2017-08-25 | 2021-09-29 | キヤノン株式会社 | リソグラフィ装置、および物品の製造方法 |
| JP7118674B2 (ja) * | 2018-03-12 | 2022-08-16 | キヤノン株式会社 | 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法 |
| DE102018127807A1 (de) | 2018-04-26 | 2019-10-31 | Hanon Systems | Vorrichtung und Verfahren zum thermischen Fügen insbesondere eines Wärmeübertragers für ein Kraftfahrzeug |
| JP7187180B2 (ja) | 2018-05-31 | 2022-12-12 | キヤノン株式会社 | インプリント装置および物品の製造方法 |
| JP7089420B2 (ja) * | 2018-06-29 | 2022-06-22 | キヤノン株式会社 | 基板処理装置、および物品製造方法 |
| JP7401396B2 (ja) * | 2020-06-04 | 2023-12-19 | キヤノン株式会社 | インプリント装置、物品の製造方法、及びインプリント装置のための測定方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060162739A1 (en) | 2005-01-21 | 2006-07-27 | Nikon Corporation | Cleaning chuck in situ |
| US20080145773A1 (en) | 2006-10-10 | 2008-06-19 | Shih-Yuan Wang | Imprint lithography apparatus and methods |
| KR20090109116A (ko) * | 2007-02-06 | 2009-10-19 | 캐논 가부시끼가이샤 | 임프린트 방법 및 임프린트 장치 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01103430A (ja) * | 1987-10-16 | 1989-04-20 | Kanegafuchi Chem Ind Co Ltd | スタンパおよびその製造方法 |
| IT214620Z2 (it) * | 1988-05-12 | 1990-05-09 | Fiat Auto Spa | Lastra detergente |
| US4998428A (en) * | 1989-08-17 | 1991-03-12 | General Motors Corporation | Method of cleaning stamping dies |
| US5137440A (en) * | 1991-01-28 | 1992-08-11 | The Andrew Jergens Co. | Brush cleaning mechanism for soap molding machines |
| JPH07130638A (ja) * | 1993-10-29 | 1995-05-19 | Canon Inc | 半導体製造装置 |
| JPH1098090A (ja) * | 1996-09-25 | 1998-04-14 | Canon Inc | 基板保持装置及び露光装置 |
| JP3586543B2 (ja) * | 1997-06-05 | 2004-11-10 | 株式会社サイネックス | 半導体モールド装置 |
| JP4630442B2 (ja) * | 2000-10-19 | 2011-02-09 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
| JP4769380B2 (ja) * | 2001-05-18 | 2011-09-07 | ルネサスエレクトロニクス株式会社 | クリーニング用シートおよびそれを用いた半導体装置の製造方法 |
| MY135800A (en) * | 2001-06-20 | 2008-06-30 | Matsushita Electric Industrial Co Ltd | Cleaning apparatus and cleaning method for magnetic transfer master or magnetic record reproducing apparatus using the same |
| AU2003217184A1 (en) * | 2002-01-11 | 2003-09-02 | Massachusetts Institute Of Technology | Microcontact printing |
| JP2003220371A (ja) * | 2002-01-30 | 2003-08-05 | Toyo Tire & Rubber Co Ltd | 金型洗浄方法及び洗浄装置 |
| JP4086651B2 (ja) * | 2002-12-24 | 2008-05-14 | キヤノン株式会社 | 露光装置及び基板保持装置 |
| JP4493005B2 (ja) * | 2004-01-14 | 2010-06-30 | 株式会社リコー | 画像形成装置、およびそのクリーニング方法 |
| JP4574240B2 (ja) * | 2004-06-11 | 2010-11-04 | キヤノン株式会社 | 加工装置、加工方法、デバイス製造方法 |
| GB2417251A (en) * | 2004-08-18 | 2006-02-22 | Nanofilm Technologies Int | Removing material from a substrate surface using plasma |
| JP4511591B2 (ja) * | 2004-09-28 | 2010-07-28 | 株式会社荏原製作所 | 基板洗浄装置及び洗浄部材の交換時期判定方法 |
| JP4179354B2 (ja) | 2006-07-21 | 2008-11-12 | セイコーエプソン株式会社 | 付箋紙供給装置および付箋紙プリンタ |
| JP2008194838A (ja) * | 2007-02-08 | 2008-08-28 | Sii Nanotechnology Inc | ナノインプリントリソグラフィーのモールド検査方法及び樹脂残渣除去方法 |
| JP5121549B2 (ja) * | 2008-04-21 | 2013-01-16 | 株式会社東芝 | ナノインプリント方法 |
| JP2009141384A (ja) * | 2009-03-05 | 2009-06-25 | Oki Semiconductor Co Ltd | ウエハ載置台のクリーニング方法 |
| JP5173944B2 (ja) * | 2009-06-16 | 2013-04-03 | キヤノン株式会社 | インプリント装置及び物品の製造方法 |
| JP5443070B2 (ja) * | 2009-06-19 | 2014-03-19 | 東京エレクトロン株式会社 | インプリントシステム |
| JP2011146447A (ja) * | 2010-01-12 | 2011-07-28 | Canon Inc | インプリント装置及び物品の製造方法 |
| US8616873B2 (en) * | 2010-01-26 | 2013-12-31 | Molecular Imprints, Inc. | Micro-conformal templates for nanoimprint lithography |
| JP5576822B2 (ja) * | 2011-03-25 | 2014-08-20 | 富士フイルム株式会社 | モールドに付着した異物の除去方法 |
-
2011
- 2011-03-07 JP JP2011049604A patent/JP5769451B2/ja not_active Expired - Fee Related
-
2012
- 2012-03-06 KR KR1020120022757A patent/KR101437215B1/ko not_active Expired - Fee Related
- 2012-03-07 US US13/413,913 patent/US8992206B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060162739A1 (en) | 2005-01-21 | 2006-07-27 | Nikon Corporation | Cleaning chuck in situ |
| US20080145773A1 (en) | 2006-10-10 | 2008-06-19 | Shih-Yuan Wang | Imprint lithography apparatus and methods |
| KR20090109116A (ko) * | 2007-02-06 | 2009-10-19 | 캐논 가부시끼가이샤 | 임프린트 방법 및 임프린트 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012186390A (ja) | 2012-09-27 |
| JP5769451B2 (ja) | 2015-08-26 |
| KR20120102014A (ko) | 2012-09-17 |
| US8992206B2 (en) | 2015-03-31 |
| US20120228789A1 (en) | 2012-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101437215B1 (ko) | 임프린트 장치 및 물품 제조 방법 | |
| TWI631649B (zh) | 基板更換裝置、曝光裝置、基板更換方法、曝光方法、平面面板顯示器之製造方法、以及元件製造方法 | |
| US20130320589A1 (en) | Imprint apparatus and method of manufacturing article | |
| TWI509723B (zh) | 載體基板分離系統及方法 | |
| US9778565B2 (en) | Imprint apparatus and article manufacturing method | |
| CN105278238B (zh) | 压印装置及物品的制造方法 | |
| US20120007279A1 (en) | Holding device, imprint apparatus, and article manufacturing method | |
| JP5806501B2 (ja) | インプリント装置、及び、物品の製造方法 | |
| TWI896906B (zh) | 載台設備、微影設備及物品製造方法 | |
| TWI845700B (zh) | 微影設備的基板處置系統及其方法 | |
| KR100476287B1 (ko) | 페이스트 도포기 | |
| JP2015023151A (ja) | インプリント装置、インプリント方法、プログラム、インプリントシステム、それらを用いた物品の製造方法 | |
| KR102536705B1 (ko) | 임프린트 장치, 임프린트 방법 및 물품 제조 방법 | |
| TWI903583B (zh) | 軌道移動式電漿平坦化加工系統 | |
| US20250093788A1 (en) | Substrate holding apparatus, substrate processing apparatus, separation method, and article manufacturing method | |
| JP7762258B2 (ja) | 基板保持装置、基板処理装置、分離方法、および物品製造方法 | |
| JP2014148386A (ja) | 基材搬送装置 | |
| TWI770761B (zh) | 基板、微影裝置、用於裝載基板之方法、用於塗佈基板之背側表面之方法、用於提供摩擦切換之方法、及用於製造器件之方法 | |
| JP2024082116A (ja) | インプリント方法、インプリント装置及び物品の製造方法 | |
| JP2010051883A (ja) | 塗布装置及び塗布方法 | |
| JP2019009204A (ja) | ステージ装置、リソグラフィ装置および、物品製造方法 | |
| JP2025131588A (ja) | 基板保持装置、基板処理装置、基板保持方法、基板処理方法、および物品製造方法 | |
| KR20160007377A (ko) | 임프린트 장치 및 물품 제조 방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| FPAY | Annual fee payment |
Payment date: 20170725 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20180828 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20180828 |