KR101437215B1 - 임프린트 장치 및 물품 제조 방법 - Google Patents

임프린트 장치 및 물품 제조 방법 Download PDF

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Publication number
KR101437215B1
KR101437215B1 KR1020120022757A KR20120022757A KR101437215B1 KR 101437215 B1 KR101437215 B1 KR 101437215B1 KR 1020120022757 A KR1020120022757 A KR 1020120022757A KR 20120022757 A KR20120022757 A KR 20120022757A KR 101437215 B1 KR101437215 B1 KR 101437215B1
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South Korea
Prior art keywords
substrate
mold
cleaning
holding portion
holding
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Expired - Fee Related
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KR1020120022757A
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English (en)
Korean (ko)
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KR20120102014A (ko
Inventor
고헤이 와까바야시
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캐논 가부시끼가이샤
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C2037/90Measuring, controlling or regulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023Microembossing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0096Trouble-shooting during starting or stopping moulding or shaping apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/84Manufacture, treatment, or detection of nanostructure
    • Y10S977/887Nanoimprint lithography, i.e. nanostamp

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020120022757A 2011-03-07 2012-03-06 임프린트 장치 및 물품 제조 방법 Expired - Fee Related KR101437215B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011049604A JP5769451B2 (ja) 2011-03-07 2011-03-07 インプリント装置および物品の製造方法
JPJP-P-2011-049604 2011-03-07

Publications (2)

Publication Number Publication Date
KR20120102014A KR20120102014A (ko) 2012-09-17
KR101437215B1 true KR101437215B1 (ko) 2014-09-03

Family

ID=46794805

Family Applications (1)

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KR1020120022757A Expired - Fee Related KR101437215B1 (ko) 2011-03-07 2012-03-06 임프린트 장치 및 물품 제조 방법

Country Status (3)

Country Link
US (1) US8992206B2 (enExample)
JP (1) JP5769451B2 (enExample)
KR (1) KR101437215B1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5823938B2 (ja) * 2012-09-07 2015-11-25 株式会社東芝 モールド洗浄装置及びモールド洗浄方法
US20140239529A1 (en) * 2012-09-28 2014-08-28 Nanonex Corporation System and Methods For Nano-Scale Manufacturing
KR101911588B1 (ko) 2012-10-04 2018-10-24 다이니폰 인사츠 가부시키가이샤 임프린트 방법 및 임프린트 장치
JP6333039B2 (ja) 2013-05-16 2018-05-30 キヤノン株式会社 インプリント装置、デバイス製造方法およびインプリント方法
JP6120678B2 (ja) 2013-05-27 2017-04-26 キヤノン株式会社 インプリント方法、インプリント装置及びデバイス製造方法
JP6315904B2 (ja) 2013-06-28 2018-04-25 キヤノン株式会社 インプリント方法、インプリント装置及びデバイスの製造方法
JP6161450B2 (ja) * 2013-07-22 2017-07-12 キヤノン株式会社 インプリント装置、及びそれを用いたデバイス製造方法
JP5951566B2 (ja) * 2013-08-23 2016-07-13 株式会社東芝 モールド洗浄装置及びモールド洗浄方法
JP6234207B2 (ja) * 2013-12-18 2017-11-22 キヤノン株式会社 インプリント方法、インプリント装置および物品の製造方法
JP6313591B2 (ja) * 2013-12-20 2018-04-18 キヤノン株式会社 インプリント装置、異物除去方法及び物品の製造方法
JP6661397B2 (ja) * 2015-04-22 2020-03-11 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6702672B2 (ja) * 2015-09-03 2020-06-03 キヤノン株式会社 インプリント装置、物品の製造方法及び供給装置
JP6777977B2 (ja) * 2015-09-15 2020-10-28 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
KR102215539B1 (ko) * 2015-11-20 2021-02-16 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 리소그래피 장치를 작동시키는 방법
JP6603678B2 (ja) * 2016-02-26 2019-11-06 キヤノン株式会社 インプリント装置およびその動作方法ならびに物品製造方法
JP6894785B2 (ja) * 2017-07-12 2021-06-30 キヤノン株式会社 インプリント装置および物品製造方法
JP6942562B2 (ja) * 2017-08-25 2021-09-29 キヤノン株式会社 リソグラフィ装置、および物品の製造方法
JP7118674B2 (ja) * 2018-03-12 2022-08-16 キヤノン株式会社 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法
DE102018127807A1 (de) 2018-04-26 2019-10-31 Hanon Systems Vorrichtung und Verfahren zum thermischen Fügen insbesondere eines Wärmeübertragers für ein Kraftfahrzeug
JP7187180B2 (ja) 2018-05-31 2022-12-12 キヤノン株式会社 インプリント装置および物品の製造方法
JP7089420B2 (ja) * 2018-06-29 2022-06-22 キヤノン株式会社 基板処理装置、および物品製造方法
JP7401396B2 (ja) * 2020-06-04 2023-12-19 キヤノン株式会社 インプリント装置、物品の製造方法、及びインプリント装置のための測定方法

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US20080145773A1 (en) 2006-10-10 2008-06-19 Shih-Yuan Wang Imprint lithography apparatus and methods
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JP4179354B2 (ja) 2006-07-21 2008-11-12 セイコーエプソン株式会社 付箋紙供給装置および付箋紙プリンタ
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US20060162739A1 (en) 2005-01-21 2006-07-27 Nikon Corporation Cleaning chuck in situ
US20080145773A1 (en) 2006-10-10 2008-06-19 Shih-Yuan Wang Imprint lithography apparatus and methods
KR20090109116A (ko) * 2007-02-06 2009-10-19 캐논 가부시끼가이샤 임프린트 방법 및 임프린트 장치

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JP2012186390A (ja) 2012-09-27
JP5769451B2 (ja) 2015-08-26
KR20120102014A (ko) 2012-09-17
US8992206B2 (en) 2015-03-31
US20120228789A1 (en) 2012-09-13

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