KR101434923B1 - 고체 전해 컨덴서 - Google Patents
고체 전해 컨덴서 Download PDFInfo
- Publication number
- KR101434923B1 KR101434923B1 KR1020120117884A KR20120117884A KR101434923B1 KR 101434923 B1 KR101434923 B1 KR 101434923B1 KR 1020120117884 A KR1020120117884 A KR 1020120117884A KR 20120117884 A KR20120117884 A KR 20120117884A KR 101434923 B1 KR101434923 B1 KR 101434923B1
- Authority
- KR
- South Korea
- Prior art keywords
- foil
- lead
- rectangular parallelepiped
- plate portion
- exposed portion
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 82
- 239000007787 solid Substances 0.000 title claims abstract description 74
- 239000011888 foil Substances 0.000 claims abstract description 179
- 238000004804 winding Methods 0.000 claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 22
- 239000007784 solid electrolyte Substances 0.000 claims description 19
- 238000003466 welding Methods 0.000 claims description 12
- 238000005304 joining Methods 0.000 claims description 6
- 238000002679 ablation Methods 0.000 claims description 3
- 241000276425 Xiphophorus maculatus Species 0.000 claims 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 abstract 1
- 229910001416 lithium ion Inorganic materials 0.000 abstract 1
- 239000000126 substance Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 16
- 239000010410 layer Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 239000000835 fiber Substances 0.000 description 8
- 229920001940 conductive polymer Polymers 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000007800 oxidant agent Substances 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- -1 organic acid salt Chemical class 0.000 description 3
- FLDCSPABIQBYKP-UHFFFAOYSA-N 5-chloro-1,2-dimethylbenzimidazole Chemical compound ClC1=CC=C2N(C)C(C)=NC2=C1 FLDCSPABIQBYKP-UHFFFAOYSA-N 0.000 description 2
- 239000001741 Ammonium adipate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 235000019293 ammonium adipate Nutrition 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- WHRAZOIDGKIQEA-UHFFFAOYSA-L iron(2+);4-methylbenzenesulfonate Chemical compound [Fe+2].CC1=CC=C(S([O-])(=O)=O)C=C1.CC1=CC=C(S([O-])(=O)=O)C=C1 WHRAZOIDGKIQEA-UHFFFAOYSA-L 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- 229920000128 polypyrrole Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000002467 phosphate group Chemical class [H]OP(=O)(O[H])O[*] 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/022—Electrolytes; Absorbents
- H01G9/025—Solid electrolytes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
- H01G9/151—Solid electrolytic capacitors with wound foil electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210313661.0 | 2012-08-29 | ||
CN201210313661.0A CN103632848B (zh) | 2012-08-29 | 2012-08-29 | 固体电解电容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20140029080A KR20140029080A (ko) | 2014-03-10 |
KR101434923B1 true KR101434923B1 (ko) | 2014-08-27 |
Family
ID=50213778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020120117884A KR101434923B1 (ko) | 2012-08-29 | 2012-10-23 | 고체 전해 컨덴서 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5562396B2 (ja) |
KR (1) | KR101434923B1 (ja) |
CN (1) | CN103632848B (ja) |
TW (1) | TWI486984B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104377039B (zh) * | 2014-11-06 | 2017-08-25 | 中国振华(集团)新云电子元器件有限责任公司 | 一种避免钽电容器损耗角正切值超差的方法 |
KR102359893B1 (ko) * | 2015-06-11 | 2022-02-07 | 김형철 | 노면 정보 제공 장치 및 방법, 컴퓨터가 읽을 수 있는 프로그램이 기록된 기록 매체 |
TWI674600B (zh) * | 2016-03-31 | 2019-10-11 | 日商日本貴彌功股份有限公司 | 電極箔、捲繞型的電容器、電極箔的製造方法及捲繞型電容器的製造方法 |
JP6724881B2 (ja) * | 2017-10-20 | 2020-07-15 | 株式会社村田製作所 | 固体電解コンデンサの製造方法、及び、固体電解コンデンサ |
JP7200825B2 (ja) * | 2019-05-15 | 2023-01-10 | 株式会社デンソー | 半導体装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004095817A (ja) | 2002-08-30 | 2004-03-25 | Matsushita Electric Ind Co Ltd | 電解コンデンサ |
JP2008300502A (ja) | 2007-05-30 | 2008-12-11 | Daikin Ind Ltd | フィルムコンデンサ、及びその配置構造 |
JP2009194263A (ja) | 2008-02-18 | 2009-08-27 | Sanyo Electric Co Ltd | 固体電解コンデンサの製造方法 |
JP2010251436A (ja) | 2009-04-14 | 2010-11-04 | Elna Co Ltd | 固体電解コンデンサおよびその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4509100A (en) * | 1983-01-03 | 1985-04-02 | Sprague Electric Company | Low inductance wound capacitor |
JPS614421U (ja) * | 1984-06-12 | 1986-01-11 | マルコン電子株式会社 | チツプ型アルミ電解コンデンサ |
JP2004254354A (ja) * | 2003-02-18 | 2004-09-09 | Fujitsu General Ltd | リラクタンスモータ |
JP4318490B2 (ja) * | 2003-06-09 | 2009-08-26 | 三洋電機株式会社 | 固体電解コンデンサ |
CN101527203A (zh) * | 2009-02-19 | 2009-09-09 | 富士通多媒体部品(苏州)有限公司 | 固体电解电容器及其制造方法 |
CN202905476U (zh) * | 2012-08-29 | 2013-04-24 | 尼吉康株式会社 | 固体电解电容器 |
-
2012
- 2012-08-29 CN CN201210313661.0A patent/CN103632848B/zh not_active Expired - Fee Related
- 2012-10-16 TW TW101138134A patent/TWI486984B/zh active
- 2012-10-22 JP JP2012232853A patent/JP5562396B2/ja not_active Expired - Fee Related
- 2012-10-23 KR KR1020120117884A patent/KR101434923B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004095817A (ja) | 2002-08-30 | 2004-03-25 | Matsushita Electric Ind Co Ltd | 電解コンデンサ |
JP2008300502A (ja) | 2007-05-30 | 2008-12-11 | Daikin Ind Ltd | フィルムコンデンサ、及びその配置構造 |
JP2009194263A (ja) | 2008-02-18 | 2009-08-27 | Sanyo Electric Co Ltd | 固体電解コンデンサの製造方法 |
JP2010251436A (ja) | 2009-04-14 | 2010-11-04 | Elna Co Ltd | 固体電解コンデンサおよびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103632848A (zh) | 2014-03-12 |
KR20140029080A (ko) | 2014-03-10 |
TW201409508A (zh) | 2014-03-01 |
JP5562396B2 (ja) | 2014-07-30 |
CN103632848B (zh) | 2016-08-03 |
JP2014049742A (ja) | 2014-03-17 |
TWI486984B (zh) | 2015-06-01 |
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FPAY | Annual fee payment |
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