KR101417232B1 - 복수의 감지층들을 구비한 이미지 센서 - Google Patents
복수의 감지층들을 구비한 이미지 센서 Download PDFInfo
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- KR101417232B1 KR101417232B1 KR1020117002504A KR20117002504A KR101417232B1 KR 101417232 B1 KR101417232 B1 KR 101417232B1 KR 1020117002504 A KR1020117002504 A KR 1020117002504A KR 20117002504 A KR20117002504 A KR 20117002504A KR 101417232 B1 KR101417232 B1 KR 101417232B1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
- H10F39/1825—Multicolour image sensors having stacked structure, e.g. NPN, NPNPN or multiple quantum well [MQW] structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/17—Colour separation based on photon absorption depth, e.g. full colour resolution obtained simultaneously at each pixel location
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/184—Infrared image sensors
- H10F39/1847—Multispectral infrared image sensors having a stacked structure, e.g. NPN, NPNPN or multiple quantum well [MQW] structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/813—Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8053—Colour filters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/809—Constructional details of image sensors of hybrid image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/184,314 | 2008-08-01 | ||
| US12/184,314 US8471939B2 (en) | 2008-08-01 | 2008-08-01 | Image sensor having multiple sensing layers |
| PCT/US2009/004051 WO2010014138A1 (en) | 2008-08-01 | 2009-07-13 | Image sensor having multiple sensing layers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110036823A KR20110036823A (ko) | 2011-04-11 |
| KR101417232B1 true KR101417232B1 (ko) | 2014-07-08 |
Family
ID=41170970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117002504A Active KR101417232B1 (ko) | 2008-08-01 | 2009-07-13 | 복수의 감지층들을 구비한 이미지 센서 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8471939B2 (enExample) |
| EP (1) | EP2313927B1 (enExample) |
| JP (1) | JP5562953B2 (enExample) |
| KR (1) | KR101417232B1 (enExample) |
| CN (1) | CN102089882B (enExample) |
| TW (1) | TWI431766B (enExample) |
| WO (1) | WO2010014138A1 (enExample) |
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| JP5146499B2 (ja) * | 2009-08-08 | 2013-02-20 | 株式会社ニコン | 固体撮像素子 |
| US20110156197A1 (en) * | 2009-12-31 | 2011-06-30 | Tivarus Cristian A | Interwafer interconnects for stacked CMOS image sensors |
| CN102792677B (zh) * | 2010-03-08 | 2015-08-05 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
| CA2787911C (en) * | 2010-06-01 | 2017-07-11 | Boly Media Communications (Shenzhen) Co., Ltd. | Multi-spectrum photosensitive devices and methods for sampling the same |
| JP2012015274A (ja) | 2010-06-30 | 2012-01-19 | Canon Inc | 固体撮像装置、及び固体撮像装置の製造方法。 |
| FR2966978B1 (fr) * | 2010-11-03 | 2016-04-01 | Commissariat Energie Atomique | Detecteur de rayonnement visible et proche infrarouge |
| FR2966977B1 (fr) * | 2010-11-03 | 2016-02-26 | Commissariat Energie Atomique | Detecteur de rayonnement visible et proche infrarouge |
| CN102256047B (zh) * | 2011-07-28 | 2013-06-19 | 北京空间机电研究所 | 一种基于滤波的2×2数字binning系统 |
| KR101399338B1 (ko) * | 2011-08-08 | 2014-05-30 | (주)실리콘화일 | 이중 감지 기능을 가지는 기판 적층형 이미지 센서 |
| JP5999750B2 (ja) * | 2011-08-25 | 2016-09-28 | ソニー株式会社 | 撮像素子、撮像装置及び生体撮像装置 |
| JP2013070030A (ja) * | 2011-09-06 | 2013-04-18 | Sony Corp | 撮像素子、電子機器、並びに、情報処理装置 |
| JP2013187475A (ja) * | 2012-03-09 | 2013-09-19 | Olympus Corp | 固体撮像装置およびカメラシステム |
| US8686342B2 (en) * | 2012-04-09 | 2014-04-01 | Omnivision Technologies, Inc. | Double-sided image sensor formed on a single semiconductor wafer die |
| JP6042636B2 (ja) * | 2012-05-28 | 2016-12-14 | オリンパス株式会社 | 固体撮像素子および固体撮像装置 |
| JP2014022561A (ja) | 2012-07-18 | 2014-02-03 | Sony Corp | 固体撮像装置、及び、電子機器 |
| JP6128787B2 (ja) | 2012-09-28 | 2017-05-17 | キヤノン株式会社 | 半導体装置 |
| JP2014099582A (ja) * | 2012-10-18 | 2014-05-29 | Sony Corp | 固体撮像装置 |
| JP2014199898A (ja) * | 2013-03-11 | 2014-10-23 | ソニー株式会社 | 固体撮像素子および製造方法、並びに、電子機器 |
| JP6136669B2 (ja) * | 2013-07-08 | 2017-05-31 | 株式会社ニコン | 撮像装置 |
| KR102065633B1 (ko) | 2013-08-12 | 2020-01-13 | 삼성전자 주식회사 | 이미지 센서, 이의 동작 방법, 및 이를 포함하는 시스템 |
| CN105975126A (zh) * | 2013-09-29 | 2016-09-28 | 宸鸿科技(厦门)有限公司 | 触控面板及其制作方法 |
| JP6177117B2 (ja) * | 2013-12-10 | 2017-08-09 | オリンパス株式会社 | 固体撮像装置、撮像装置、固体撮像装置の製造方法 |
| US9347890B2 (en) | 2013-12-19 | 2016-05-24 | Kla-Tencor Corporation | Low-noise sensor and an inspection system using a low-noise sensor |
| US9748294B2 (en) | 2014-01-10 | 2017-08-29 | Hamamatsu Photonics K.K. | Anti-reflection layer for back-illuminated sensor |
| JP2015162604A (ja) * | 2014-02-27 | 2015-09-07 | 株式会社東芝 | Cmosイメージセンサ |
| US9410901B2 (en) | 2014-03-17 | 2016-08-09 | Kla-Tencor Corporation | Image sensor, an inspection system and a method of inspecting an article |
| JP2015192015A (ja) * | 2014-03-28 | 2015-11-02 | オリンパス株式会社 | 固体撮像装置 |
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| JP6388669B2 (ja) * | 2015-01-09 | 2018-09-12 | オリンパス株式会社 | 固体撮像装置 |
| US10163968B2 (en) * | 2015-01-23 | 2018-12-25 | Dartmouth College | Multi-junction pixel image sensor with dielectric reflector between photodetection layers |
| US9860466B2 (en) | 2015-05-14 | 2018-01-02 | Kla-Tencor Corporation | Sensor with electrically controllable aperture for inspection and metrology systems |
| US9686486B2 (en) * | 2015-05-27 | 2017-06-20 | Semiconductor Components Industries, Llc | Multi-resolution pixel architecture with shared floating diffusion nodes |
| US10341592B2 (en) | 2015-06-09 | 2019-07-02 | Sony Semiconductor Solutions Corporation | Imaging element, driving method, and electronic device |
| JP6607262B2 (ja) * | 2016-01-08 | 2019-11-20 | 株式会社ニコン | 撮像素子および撮像装置 |
| US10778925B2 (en) | 2016-04-06 | 2020-09-15 | Kla-Tencor Corporation | Multiple column per channel CCD sensor architecture for inspection and metrology |
| US10313622B2 (en) | 2016-04-06 | 2019-06-04 | Kla-Tencor Corporation | Dual-column-parallel CCD sensor and inspection systems using a sensor |
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| KR102524400B1 (ko) * | 2016-07-04 | 2023-04-24 | 에스케이하이닉스 주식회사 | 하나의 컬러 필터 및 하나의 마이크로렌즈를 공유하는 다수 개의 포토다이오드들을 갖는 이미지 센서 |
| KR102549621B1 (ko) * | 2016-09-02 | 2023-06-28 | 삼성전자주식회사 | 반도체 장치 |
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| JP2018081946A (ja) | 2016-11-14 | 2018-05-24 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置およびその製造方法、並びに電子機器 |
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| US10468448B2 (en) * | 2017-11-30 | 2019-11-05 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor image sensor and method for forming the same |
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| JPH01151262A (ja) * | 1987-12-09 | 1989-06-14 | Fuji Photo Film Co Ltd | 計測用イメージセンサー |
| JPH10284714A (ja) * | 1997-04-07 | 1998-10-23 | Toshiba Corp | 固体撮像装置及びこれを用いた撮像システム |
| JP2001339057A (ja) * | 2000-05-30 | 2001-12-07 | Mitsumasa Koyanagi | 3次元画像処理装置の製造方法 |
| JP2006120921A (ja) * | 2004-10-22 | 2006-05-11 | Fuji Film Microdevices Co Ltd | 光電変換膜積層型カラー固体撮像装置 |
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-
2008
- 2008-08-01 US US12/184,314 patent/US8471939B2/en active Active
-
2009
- 2009-07-13 EP EP09788904.2A patent/EP2313927B1/en active Active
- 2009-07-13 WO PCT/US2009/004051 patent/WO2010014138A1/en not_active Ceased
- 2009-07-13 KR KR1020117002504A patent/KR101417232B1/ko active Active
- 2009-07-13 CN CN200980127273XA patent/CN102089882B/zh active Active
- 2009-07-13 JP JP2011521091A patent/JP5562953B2/ja active Active
- 2009-07-31 TW TW098125958A patent/TWI431766B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01151262A (ja) * | 1987-12-09 | 1989-06-14 | Fuji Photo Film Co Ltd | 計測用イメージセンサー |
| JPH10284714A (ja) * | 1997-04-07 | 1998-10-23 | Toshiba Corp | 固体撮像装置及びこれを用いた撮像システム |
| JP2001339057A (ja) * | 2000-05-30 | 2001-12-07 | Mitsumasa Koyanagi | 3次元画像処理装置の製造方法 |
| JP2006120921A (ja) * | 2004-10-22 | 2006-05-11 | Fuji Film Microdevices Co Ltd | 光電変換膜積層型カラー固体撮像装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110036823A (ko) | 2011-04-11 |
| TW201013910A (en) | 2010-04-01 |
| JP5562953B2 (ja) | 2014-07-30 |
| CN102089882B (zh) | 2013-07-24 |
| EP2313927B1 (en) | 2015-12-02 |
| EP2313927A1 (en) | 2011-04-27 |
| CN102089882A (zh) | 2011-06-08 |
| US8471939B2 (en) | 2013-06-25 |
| TWI431766B (zh) | 2014-03-21 |
| WO2010014138A1 (en) | 2010-02-04 |
| US20100026865A1 (en) | 2010-02-04 |
| JP2011530165A (ja) | 2011-12-15 |
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