KR101417232B1 - 복수의 감지층들을 구비한 이미지 센서 - Google Patents

복수의 감지층들을 구비한 이미지 센서 Download PDF

Info

Publication number
KR101417232B1
KR101417232B1 KR1020117002504A KR20117002504A KR101417232B1 KR 101417232 B1 KR101417232 B1 KR 101417232B1 KR 1020117002504 A KR1020117002504 A KR 1020117002504A KR 20117002504 A KR20117002504 A KR 20117002504A KR 101417232 B1 KR101417232 B1 KR 101417232B1
Authority
KR
South Korea
Prior art keywords
layer
floating diffusion
sensor
pixels
charge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020117002504A
Other languages
English (en)
Korean (ko)
Other versions
KR20110036823A (ko
Inventor
크리스티안 알렉산드루 티바루스
존 피. 맥카르텐
조세프 알. 섬마
Original Assignee
옴니비젼 테크날러지스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 옴니비젼 테크날러지스 인코포레이티드 filed Critical 옴니비젼 테크날러지스 인코포레이티드
Publication of KR20110036823A publication Critical patent/KR20110036823A/ko
Application granted granted Critical
Publication of KR101417232B1 publication Critical patent/KR101417232B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/182Colour image sensors
    • H10F39/1825Multicolour image sensors having stacked structure, e.g. NPN, NPNPN or multiple quantum well [MQW] structures
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/17Colour separation based on photon absorption depth, e.g. full colour resolution obtained simultaneously at each pixel location
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/184Infrared image sensors
    • H10F39/1847Multispectral infrared image sensors having a stacked structure, e.g. NPN, NPNPN or multiple quantum well [MQW] structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/813Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/805Coatings
    • H10F39/8053Colour filters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/809Constructional details of image sensors of hybrid image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/811Interconnections

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
KR1020117002504A 2008-08-01 2009-07-13 복수의 감지층들을 구비한 이미지 센서 Active KR101417232B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/184,314 2008-08-01
US12/184,314 US8471939B2 (en) 2008-08-01 2008-08-01 Image sensor having multiple sensing layers
PCT/US2009/004051 WO2010014138A1 (en) 2008-08-01 2009-07-13 Image sensor having multiple sensing layers

Publications (2)

Publication Number Publication Date
KR20110036823A KR20110036823A (ko) 2011-04-11
KR101417232B1 true KR101417232B1 (ko) 2014-07-08

Family

ID=41170970

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117002504A Active KR101417232B1 (ko) 2008-08-01 2009-07-13 복수의 감지층들을 구비한 이미지 센서

Country Status (7)

Country Link
US (1) US8471939B2 (enExample)
EP (1) EP2313927B1 (enExample)
JP (1) JP5562953B2 (enExample)
KR (1) KR101417232B1 (enExample)
CN (1) CN102089882B (enExample)
TW (1) TWI431766B (enExample)
WO (1) WO2010014138A1 (enExample)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100301437A1 (en) * 2009-06-01 2010-12-02 Kla-Tencor Corporation Anti-Reflective Coating For Sensors Suitable For High Throughput Inspection Systems
JP5146499B2 (ja) * 2009-08-08 2013-02-20 株式会社ニコン 固体撮像素子
US20110156197A1 (en) * 2009-12-31 2011-06-30 Tivarus Cristian A Interwafer interconnects for stacked CMOS image sensors
CN102792677B (zh) * 2010-03-08 2015-08-05 株式会社半导体能源研究所 半导体器件及其制造方法
CA2787911C (en) * 2010-06-01 2017-07-11 Boly Media Communications (Shenzhen) Co., Ltd. Multi-spectrum photosensitive devices and methods for sampling the same
JP2012015274A (ja) 2010-06-30 2012-01-19 Canon Inc 固体撮像装置、及び固体撮像装置の製造方法。
FR2966978B1 (fr) * 2010-11-03 2016-04-01 Commissariat Energie Atomique Detecteur de rayonnement visible et proche infrarouge
FR2966977B1 (fr) * 2010-11-03 2016-02-26 Commissariat Energie Atomique Detecteur de rayonnement visible et proche infrarouge
CN102256047B (zh) * 2011-07-28 2013-06-19 北京空间机电研究所 一种基于滤波的2×2数字binning系统
KR101399338B1 (ko) * 2011-08-08 2014-05-30 (주)실리콘화일 이중 감지 기능을 가지는 기판 적층형 이미지 센서
JP5999750B2 (ja) * 2011-08-25 2016-09-28 ソニー株式会社 撮像素子、撮像装置及び生体撮像装置
JP2013070030A (ja) * 2011-09-06 2013-04-18 Sony Corp 撮像素子、電子機器、並びに、情報処理装置
JP2013187475A (ja) * 2012-03-09 2013-09-19 Olympus Corp 固体撮像装置およびカメラシステム
US8686342B2 (en) * 2012-04-09 2014-04-01 Omnivision Technologies, Inc. Double-sided image sensor formed on a single semiconductor wafer die
JP6042636B2 (ja) * 2012-05-28 2016-12-14 オリンパス株式会社 固体撮像素子および固体撮像装置
JP2014022561A (ja) 2012-07-18 2014-02-03 Sony Corp 固体撮像装置、及び、電子機器
JP6128787B2 (ja) 2012-09-28 2017-05-17 キヤノン株式会社 半導体装置
JP2014099582A (ja) * 2012-10-18 2014-05-29 Sony Corp 固体撮像装置
JP2014199898A (ja) * 2013-03-11 2014-10-23 ソニー株式会社 固体撮像素子および製造方法、並びに、電子機器
JP6136669B2 (ja) * 2013-07-08 2017-05-31 株式会社ニコン 撮像装置
KR102065633B1 (ko) 2013-08-12 2020-01-13 삼성전자 주식회사 이미지 센서, 이의 동작 방법, 및 이를 포함하는 시스템
CN105975126A (zh) * 2013-09-29 2016-09-28 宸鸿科技(厦门)有限公司 触控面板及其制作方法
JP6177117B2 (ja) * 2013-12-10 2017-08-09 オリンパス株式会社 固体撮像装置、撮像装置、固体撮像装置の製造方法
US9347890B2 (en) 2013-12-19 2016-05-24 Kla-Tencor Corporation Low-noise sensor and an inspection system using a low-noise sensor
US9748294B2 (en) 2014-01-10 2017-08-29 Hamamatsu Photonics K.K. Anti-reflection layer for back-illuminated sensor
JP2015162604A (ja) * 2014-02-27 2015-09-07 株式会社東芝 Cmosイメージセンサ
US9410901B2 (en) 2014-03-17 2016-08-09 Kla-Tencor Corporation Image sensor, an inspection system and a method of inspecting an article
JP2015192015A (ja) * 2014-03-28 2015-11-02 オリンパス株式会社 固体撮像装置
US9438866B2 (en) 2014-04-23 2016-09-06 Omnivision Technologies, Inc. Image sensor with scaled filter array and in-pixel binning
US10211250B2 (en) * 2014-07-03 2019-02-19 Sony Semiconductor Solutions Corporation Solid-state image sensor electronic device
JP6218687B2 (ja) * 2014-07-17 2017-10-25 オリンパス株式会社 固体撮像装置および撮像装置
WO2016103315A1 (ja) * 2014-12-22 2016-06-30 オリンパス株式会社 固体撮像装置および撮像装置
JP6388669B2 (ja) * 2015-01-09 2018-09-12 オリンパス株式会社 固体撮像装置
US10163968B2 (en) * 2015-01-23 2018-12-25 Dartmouth College Multi-junction pixel image sensor with dielectric reflector between photodetection layers
US9860466B2 (en) 2015-05-14 2018-01-02 Kla-Tencor Corporation Sensor with electrically controllable aperture for inspection and metrology systems
US9686486B2 (en) * 2015-05-27 2017-06-20 Semiconductor Components Industries, Llc Multi-resolution pixel architecture with shared floating diffusion nodes
US10341592B2 (en) 2015-06-09 2019-07-02 Sony Semiconductor Solutions Corporation Imaging element, driving method, and electronic device
JP6607262B2 (ja) * 2016-01-08 2019-11-20 株式会社ニコン 撮像素子および撮像装置
US10778925B2 (en) 2016-04-06 2020-09-15 Kla-Tencor Corporation Multiple column per channel CCD sensor architecture for inspection and metrology
US10313622B2 (en) 2016-04-06 2019-06-04 Kla-Tencor Corporation Dual-column-parallel CCD sensor and inspection systems using a sensor
US10313609B2 (en) * 2016-04-14 2019-06-04 Qualcomm Incorporated Image sensors having pixel-binning with configurable shared floating diffusion
KR102524400B1 (ko) * 2016-07-04 2023-04-24 에스케이하이닉스 주식회사 하나의 컬러 필터 및 하나의 마이크로렌즈를 공유하는 다수 개의 포토다이오드들을 갖는 이미지 센서
KR102549621B1 (ko) * 2016-09-02 2023-06-28 삼성전자주식회사 반도체 장치
US9818791B1 (en) * 2016-10-04 2017-11-14 Omnivision Technologies, Inc. Stacked image sensor
JP2018081946A (ja) 2016-11-14 2018-05-24 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置およびその製造方法、並びに電子機器
JP7038494B2 (ja) * 2017-06-15 2022-03-18 ルネサスエレクトロニクス株式会社 固体撮像素子
US10468448B2 (en) * 2017-11-30 2019-11-05 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor image sensor and method for forming the same
JP7262011B2 (ja) * 2018-11-19 2023-04-21 パナソニックIpマネジメント株式会社 撮像装置及び撮像システム
US11114491B2 (en) 2018-12-12 2021-09-07 Kla Corporation Back-illuminated sensor and a method of manufacturing a sensor
US11463634B2 (en) 2020-04-07 2022-10-04 Caeleste Cvba Charge domain binning in a MOS pixel
US20240038814A1 (en) * 2020-12-28 2024-02-01 Sony Semiconductor Solutions Corporation Solid-state imaging device, method of manufacturing the same, and electronic device
US12205973B2 (en) 2021-01-14 2025-01-21 Imec Vzw Image sensor comprising stacked photo-sensitive devices
JPWO2023171008A1 (enExample) * 2022-03-09 2023-09-14
WO2024202539A1 (ja) * 2023-03-31 2024-10-03 ソニーセミコンダクタソリューションズ株式会社 光検出装置
WO2025047330A1 (ja) * 2023-08-31 2025-03-06 パナソニックIpマネジメント株式会社 撮像装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01151262A (ja) * 1987-12-09 1989-06-14 Fuji Photo Film Co Ltd 計測用イメージセンサー
JPH10284714A (ja) * 1997-04-07 1998-10-23 Toshiba Corp 固体撮像装置及びこれを用いた撮像システム
JP2001339057A (ja) * 2000-05-30 2001-12-07 Mitsumasa Koyanagi 3次元画像処理装置の製造方法
JP2006120921A (ja) * 2004-10-22 2006-05-11 Fuji Film Microdevices Co Ltd 光電変換膜積層型カラー固体撮像装置

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4438455A (en) * 1981-12-15 1984-03-20 Fuji Photo Film Co., Ltd. Solid-state color imager with three layer four story structure
US4677289A (en) * 1984-11-12 1987-06-30 Kabushiki Kaisha Toshiba Color sensor
JP2617798B2 (ja) 1989-09-22 1997-06-04 三菱電機株式会社 積層型半導体装置およびその製造方法
DE19737561C1 (de) * 1997-08-28 1999-04-15 Forschungszentrum Juelich Gmbh Mehrfarbensensor
US6693670B1 (en) * 1999-07-29 2004-02-17 Vision - Sciences, Inc. Multi-photodetector unit cell
JP4031901B2 (ja) 2000-07-19 2008-01-09 株式会社東芝 固体撮像装置
KR20050043754A (ko) * 2001-11-05 2005-05-11 미츠마사 코야나기 고체 영상센서 및 그 제조방법
JP2003298038A (ja) * 2002-04-05 2003-10-17 Canon Inc 光電変換素子及びそれを用いた固体撮像装置
US6933489B2 (en) 2002-05-10 2005-08-23 Hamamatsu Photonics K.K. Back illuminated photodiode array and method of manufacturing the same
US6646318B1 (en) * 2002-08-15 2003-11-11 National Semiconductor Corporation Bandgap tuned vertical color imager cell
US7154157B2 (en) * 2002-12-30 2006-12-26 Intel Corporation Stacked semiconductor radiation sensors having color component and infrared sensing capability
US7339216B1 (en) * 2003-01-31 2008-03-04 Foveon, Inc. Vertical color filter sensor group array with full-resolution top layer and lower-resolution lower layer
JP4075678B2 (ja) * 2003-05-06 2008-04-16 ソニー株式会社 固体撮像素子
CN100407433C (zh) 2003-05-23 2008-07-30 浜松光子学株式会社 光检测装置
US7214999B2 (en) 2003-10-31 2007-05-08 Motorola, Inc. Integrated photoserver for CMOS imagers
JP4046067B2 (ja) 2003-11-04 2008-02-13 ソニー株式会社 固体撮像素子の製造方法
US20050109917A1 (en) * 2003-11-26 2005-05-26 Wong Hon-Sum P. Multi-spectral imaging with almost-full fill-factor using 3D pixels
JP4186851B2 (ja) 2004-03-18 2008-11-26 ヤマハ株式会社 演奏情報表示装置およびプログラム
JP2005268479A (ja) 2004-03-18 2005-09-29 Fuji Film Microdevices Co Ltd 光電変換膜積層型固体撮像装置
KR100598015B1 (ko) * 2005-02-07 2006-07-06 삼성전자주식회사 공유 구조 상보성 금속 산화막 반도체 액티브 픽셀 센서어레이의 레이 아웃
US7271025B2 (en) * 2005-07-12 2007-09-18 Micron Technology, Inc. Image sensor with SOI substrate
FR2888989B1 (fr) 2005-07-21 2008-06-06 St Microelectronics Sa Capteur d'images
JP4984634B2 (ja) * 2005-07-21 2012-07-25 ソニー株式会社 物理情報取得方法および物理情報取得装置
US8139130B2 (en) 2005-07-28 2012-03-20 Omnivision Technologies, Inc. Image sensor with improved light sensitivity
JP2007059517A (ja) * 2005-08-23 2007-03-08 Fujifilm Corp 光電変換膜、光電変換素子、及び撮像素子、並びに、これらに電場を印加する方法
KR100775058B1 (ko) * 2005-09-29 2007-11-08 삼성전자주식회사 픽셀 및 이를 이용한 이미지 센서, 그리고 상기 이미지센서를 포함하는 이미지 처리 시스템
JP2007228460A (ja) 2006-02-27 2007-09-06 Mitsumasa Koyanagi 集積センサを搭載した積層型半導体装置
US7419844B2 (en) * 2006-03-17 2008-09-02 Sharp Laboratories Of America, Inc. Real-time CMOS imager having stacked photodiodes fabricated on SOI wafer
JP4130211B2 (ja) 2006-05-31 2008-08-06 三洋電機株式会社 撮像装置
US8049256B2 (en) 2006-10-05 2011-11-01 Omnivision Technologies, Inc. Active pixel sensor having a sensor wafer connected to a support circuit wafer
KR100825808B1 (ko) * 2007-02-26 2008-04-29 삼성전자주식회사 후면 조명 구조의 이미지 센서 및 그 이미지 센서 제조방법
US8106426B2 (en) * 2008-02-04 2012-01-31 Sharp Laboratories Of America, Inc. Full color CMOS imager filter
US7893468B2 (en) * 2008-05-30 2011-02-22 International Business Machines Corporation Optical sensor including stacked photodiodes

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01151262A (ja) * 1987-12-09 1989-06-14 Fuji Photo Film Co Ltd 計測用イメージセンサー
JPH10284714A (ja) * 1997-04-07 1998-10-23 Toshiba Corp 固体撮像装置及びこれを用いた撮像システム
JP2001339057A (ja) * 2000-05-30 2001-12-07 Mitsumasa Koyanagi 3次元画像処理装置の製造方法
JP2006120921A (ja) * 2004-10-22 2006-05-11 Fuji Film Microdevices Co Ltd 光電変換膜積層型カラー固体撮像装置

Also Published As

Publication number Publication date
KR20110036823A (ko) 2011-04-11
TW201013910A (en) 2010-04-01
JP5562953B2 (ja) 2014-07-30
CN102089882B (zh) 2013-07-24
EP2313927B1 (en) 2015-12-02
EP2313927A1 (en) 2011-04-27
CN102089882A (zh) 2011-06-08
US8471939B2 (en) 2013-06-25
TWI431766B (zh) 2014-03-21
WO2010014138A1 (en) 2010-02-04
US20100026865A1 (en) 2010-02-04
JP2011530165A (ja) 2011-12-15

Similar Documents

Publication Publication Date Title
KR101417232B1 (ko) 복수의 감지층들을 구비한 이미지 센서
US20240049484A1 (en) Solid-state imaging element, production method thereof, and electronic device
US7781716B2 (en) Stacked image sensor with shared diffusion regions in respective dropped pixel positions of a pixel array
TWI742573B (zh) 固體攝像元件及其製造方法以及電子機器
KR101414662B1 (ko) 다수의 센서층들을 갖는 이미지 센서와 이의 동작 및 제조 방법
US7838956B2 (en) Back illuminated sensor with low crosstalk
US9699393B2 (en) Imaging systems for infrared and visible imaging with patterned infrared cutoff filters
CN108810430B (zh) 一种成像系统及其形成方法
CN207731929U (zh) 图像传感器以及成像系统

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20110131

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
N231 Notification of change of applicant
PN2301 Change of applicant

Patent event date: 20110714

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20120409

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20130529

Patent event code: PE09021S01D

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20131128

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20140519

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20140630

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20140630

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
FPAY Annual fee payment

Payment date: 20170330

Year of fee payment: 4

PR1001 Payment of annual fee

Payment date: 20170330

Start annual number: 4

End annual number: 4

FPAY Annual fee payment

Payment date: 20180329

Year of fee payment: 5

PR1001 Payment of annual fee

Payment date: 20180329

Start annual number: 5

End annual number: 5

FPAY Annual fee payment

Payment date: 20190327

Year of fee payment: 6

PR1001 Payment of annual fee

Payment date: 20190327

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20200324

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 20210329

Start annual number: 8

End annual number: 8

PR1001 Payment of annual fee

Payment date: 20230327

Start annual number: 10

End annual number: 10

PR1001 Payment of annual fee

Payment date: 20240320

Start annual number: 11

End annual number: 11