KR101406441B1 - 감광성 수지 조성물 - Google Patents

감광성 수지 조성물 Download PDF

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Publication number
KR101406441B1
KR101406441B1 KR1020127023631A KR20127023631A KR101406441B1 KR 101406441 B1 KR101406441 B1 KR 101406441B1 KR 1020127023631 A KR1020127023631 A KR 1020127023631A KR 20127023631 A KR20127023631 A KR 20127023631A KR 101406441 B1 KR101406441 B1 KR 101406441B1
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KR
South Korea
Prior art keywords
photosensitive resin
group
resin
compound
manufactured
Prior art date
Application number
KR1020127023631A
Other languages
English (en)
Korean (ko)
Other versions
KR20120123549A (ko
Inventor
노부히또 이또
가즈요시 요네다
마사오 아리마
Original Assignee
다이요 홀딩스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 다이요 홀딩스 가부시키가이샤 filed Critical 다이요 홀딩스 가부시키가이샤
Publication of KR20120123549A publication Critical patent/KR20120123549A/ko
Application granted granted Critical
Publication of KR101406441B1 publication Critical patent/KR101406441B1/ko

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/34—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain
    • C08G2261/342—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing only carbon atoms
    • C08G2261/3424—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing only carbon atoms non-conjugated, e.g. paracyclophanes or xylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
KR1020127023631A 2010-03-31 2011-03-30 감광성 수지 조성물 KR101406441B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2010-083420 2010-03-31
JP2010083420A JP5439254B2 (ja) 2010-03-31 2010-03-31 感光性樹脂組成物
PCT/JP2011/001925 WO2011122028A1 (ja) 2010-03-31 2011-03-30 感光性樹脂組成物

Publications (2)

Publication Number Publication Date
KR20120123549A KR20120123549A (ko) 2012-11-08
KR101406441B1 true KR101406441B1 (ko) 2014-06-13

Family

ID=44711783

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127023631A KR101406441B1 (ko) 2010-03-31 2011-03-30 감광성 수지 조성물

Country Status (5)

Country Link
JP (1) JP5439254B2 (zh)
KR (1) KR101406441B1 (zh)
CN (1) CN102792226B (zh)
TW (1) TWI420240B (zh)
WO (1) WO2011122028A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5611769B2 (ja) * 2010-10-29 2014-10-22 株式会社カネカ 新規な白色感光性樹脂組成物及びその利用
WO2013171888A1 (ja) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
JP5615415B2 (ja) * 2012-09-28 2014-10-29 太陽インキ製造株式会社 硬化性樹脂組成物、ソルダーレジスト形成用組成物、ドライフィルムおよびプリント配線板、並びに積層構造体及びその製造方法
JP5514356B2 (ja) * 2012-09-28 2014-06-04 太陽インキ製造株式会社 光硬化性樹脂組成物、プリント配線板、及び光硬化性樹脂組成物の製造方法
JP5514355B2 (ja) * 2012-09-28 2014-06-04 太陽インキ製造株式会社 光硬化性樹脂組成物、プリント配線板、及び光硬化性樹脂組成物の製造方法
EP2851391A1 (en) * 2013-09-23 2015-03-25 Anheuser-Busch InBev S.A. Thermoplastic polyester having enhanced barrier and impact properties
CN104516201A (zh) * 2013-09-30 2015-04-15 太阳油墨（苏州）有限公司 光固化性树脂组合物、干膜和固化物、以及印刷电路板
TWI536103B (zh) * 2014-05-08 2016-06-01 達興材料股份有限公司 感光性樹脂組合物、固化膜和電子元件
US20170082923A1 (en) * 2014-06-12 2017-03-23 Dic Corporation Photosensitive composition for permanent films, resist material and coating film
KR101788090B1 (ko) * 2014-11-28 2017-11-15 삼성에스디아이 주식회사 중합체, 유기막 조성물, 유기막, 및 패턴형성방법
JP6594054B2 (ja) * 2015-06-18 2019-10-23 太陽インキ製造株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6960078B2 (ja) * 2016-09-06 2021-11-05 株式会社スリーボンド 硬化性樹脂組成物、それを用いた燃料電池およびシール方法
JP7102093B2 (ja) * 2016-09-28 2022-07-19 味の素株式会社 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ
CN110527407B (zh) * 2019-08-08 2021-08-24 江西阪桥感光科技有限公司 一种低卤低硫感光阻焊材料及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009008921A (ja) 2007-06-28 2009-01-15 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント

Family Cites Families (9)

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JPH03249653A (ja) * 1990-02-27 1991-11-07 Konica Corp 感光性組成物
JP3731979B2 (ja) * 1997-07-29 2006-01-05 新中村化学工業株式会社 カリックスアレーン誘導体及びそれを含有する硬化性樹脂組成物
EP1327642A4 (en) * 2000-09-20 2006-07-19 Taiyo Ink Mfg Co Ltd CARBOXYLATED PHOTOSENSITIVE RESIN, THIS CONTAINING, ALKALI DEVELOPABLE, LIGHT-CURABLE / HEAT-CURABLE COMPOSITION, AND THEREOF HARDENED ARTICLE
JP2005300785A (ja) * 2004-04-09 2005-10-27 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性樹脂組成物及びその硬化塗膜
JP4595751B2 (ja) * 2005-08-30 2010-12-08 住友ベークライト株式会社 ビフェニルアラルキル変性フェノール樹脂及びその製造方法、これを含むエポキシ樹脂成形材料。
JP2008304849A (ja) * 2007-06-11 2008-12-18 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、および、プリント配線板の製造方法
JP5319132B2 (ja) * 2008-02-06 2013-10-16 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物
JP5043775B2 (ja) * 2008-08-07 2012-10-10 太陽ホールディングス株式会社 難燃性光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5301915B2 (ja) * 2008-08-07 2013-09-25 太陽ホールディングス株式会社 難燃性光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009008921A (ja) 2007-06-28 2009-01-15 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント

Also Published As

Publication number Publication date
WO2011122028A1 (ja) 2011-10-06
JP5439254B2 (ja) 2014-03-12
KR20120123549A (ko) 2012-11-08
TW201211680A (en) 2012-03-16
CN102792226B (zh) 2014-07-09
CN102792226A (zh) 2012-11-21
TWI420240B (zh) 2013-12-21
JP2011215375A (ja) 2011-10-27

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