KR101398094B1 - 액정 디스플레이 및 어레이 기판 - Google Patents
액정 디스플레이 및 어레이 기판 Download PDFInfo
- Publication number
- KR101398094B1 KR101398094B1 KR1020120044639A KR20120044639A KR101398094B1 KR 101398094 B1 KR101398094 B1 KR 101398094B1 KR 1020120044639 A KR1020120044639 A KR 1020120044639A KR 20120044639 A KR20120044639 A KR 20120044639A KR 101398094 B1 KR101398094 B1 KR 101398094B1
- Authority
- KR
- South Korea
- Prior art keywords
- common electrode
- layer
- gate metal
- via hole
- transparent common
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 27
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 58
- 239000002184 metal Substances 0.000 claims abstract description 58
- 238000000034 method Methods 0.000 claims description 18
- 238000002161 passivation Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
- G02F1/134381—Hybrid switching mode, i.e. for applying an electric field with components parallel and orthogonal to the substrates
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Ceramic Engineering (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011201360379U CN202033562U (zh) | 2011-04-29 | 2011-04-29 | 液晶显示器阵列基板 |
CN201120136037.9 | 2011-04-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20120122961A KR20120122961A (ko) | 2012-11-07 |
KR101398094B1 true KR101398094B1 (ko) | 2014-05-22 |
Family
ID=44895853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020120044639A KR101398094B1 (ko) | 2011-04-29 | 2012-04-27 | 액정 디스플레이 및 어레이 기판 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8698149B2 (fr) |
EP (1) | EP2518558B1 (fr) |
JP (1) | JP6030333B2 (fr) |
KR (1) | KR101398094B1 (fr) |
CN (1) | CN202033562U (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102629060B (zh) * | 2012-02-22 | 2014-04-02 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法、显示装置 |
CN102769040B (zh) * | 2012-07-25 | 2015-03-04 | 京东方科技集团股份有限公司 | 薄膜晶体管、阵列基板及其制作方法、显示装置 |
CN103576401B (zh) * | 2012-08-10 | 2018-05-08 | 北京京东方光电科技有限公司 | 一种阵列基板及其制备方法、显示装置 |
CN103364987B (zh) * | 2013-07-19 | 2015-11-25 | 深圳市华星光电技术有限公司 | 一种阵列基板及显示面板 |
CN103715135B (zh) * | 2013-12-16 | 2016-04-06 | 京东方科技集团股份有限公司 | 一种过孔及其制作方法、阵列基板 |
CN103913916B (zh) * | 2014-04-04 | 2017-04-05 | 合肥鑫晟光电科技有限公司 | 一种阵列基板及其制造方法、液晶显示屏 |
CN104049392B (zh) * | 2014-06-10 | 2017-01-18 | 京东方科技集团股份有限公司 | 防止显示面板异常放电的装置和显示面板制备系统 |
KR102221845B1 (ko) * | 2014-08-27 | 2021-03-04 | 삼성디스플레이 주식회사 | 표시 기판 및 그의 제조방법 |
KR102232258B1 (ko) * | 2014-08-27 | 2021-03-29 | 삼성디스플레이 주식회사 | 표시 기판 및 그의 제조방법 |
KR102227519B1 (ko) * | 2014-08-27 | 2021-03-16 | 삼성디스플레이 주식회사 | 표시 기판 및 그의 제조방법 |
KR20160129783A (ko) * | 2015-04-30 | 2016-11-09 | 주식회사 엘지화학 | 액정 디스플레이 장치 및 이의 제조방법 |
CN107850811A (zh) * | 2015-05-06 | 2018-03-27 | 株式会社Lg化学 | 液晶显示装置 |
CN107407846B (zh) * | 2015-05-08 | 2021-10-29 | 株式会社Lg化学 | 薄膜晶体管基底和包括其的显示装置 |
US10989946B2 (en) * | 2019-02-21 | 2021-04-27 | Innolux Corporation | Electronic modulating device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4624737A (en) * | 1984-08-21 | 1986-11-25 | Seiko Instruments & Electronics Ltd. | Process for producing thin-film transistor |
KR100190023B1 (ko) * | 1996-02-29 | 1999-06-01 | 윤종용 | 박막트랜지스터-액정표시장치 및 그 제조방법 |
KR100307385B1 (ko) * | 1997-03-05 | 2001-12-15 | 구본준, 론 위라하디락사 | 액정표시장치의구조및그제조방법 |
KR20060074325A (ko) * | 2004-12-27 | 2006-07-03 | 삼성전자주식회사 | 어레이 기판 및 이를 갖는 표시장치 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6259119B1 (en) * | 1997-12-18 | 2001-07-10 | Lg. Philips Lcd Co, Ltd. | Liquid crystal display and method of manufacturing the same |
KR100975734B1 (ko) * | 2003-09-08 | 2010-08-12 | 엘지디스플레이 주식회사 | 횡전계방식 액정 표시 장치용 어레이 기판 및 그 제조 방법 |
KR20060079040A (ko) * | 2004-12-31 | 2006-07-05 | 엘지.필립스 엘시디 주식회사 | 프린지 필드 스위칭 타입의 박막 트랜지스터 기판 및 그제조 방법 |
JP4801569B2 (ja) * | 2005-12-05 | 2011-10-26 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
JP2007226175A (ja) | 2006-01-26 | 2007-09-06 | Epson Imaging Devices Corp | 液晶装置及び電子機器 |
KR100978263B1 (ko) * | 2006-05-12 | 2010-08-26 | 엘지디스플레이 주식회사 | 액정표시장치 및 그 제조방법 |
JP4407677B2 (ja) * | 2006-08-11 | 2010-02-03 | エプソンイメージングデバイス株式会社 | 横電界方式の液晶表示パネル |
KR101274706B1 (ko) * | 2008-05-16 | 2013-06-12 | 엘지디스플레이 주식회사 | 액정표시장치 및 그 제조방법 |
WO2011043440A1 (fr) * | 2009-10-08 | 2011-04-14 | シャープ株式会社 | Dispositif d'affichage à cristaux liquides et son procédé de fabrication |
-
2011
- 2011-04-29 CN CN2011201360379U patent/CN202033562U/zh not_active Expired - Lifetime
-
2012
- 2012-04-27 US US13/457,825 patent/US8698149B2/en active Active
- 2012-04-27 EP EP12166015.3A patent/EP2518558B1/fr active Active
- 2012-04-27 KR KR1020120044639A patent/KR101398094B1/ko active IP Right Grant
- 2012-05-01 JP JP2012104483A patent/JP6030333B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4624737A (en) * | 1984-08-21 | 1986-11-25 | Seiko Instruments & Electronics Ltd. | Process for producing thin-film transistor |
KR100190023B1 (ko) * | 1996-02-29 | 1999-06-01 | 윤종용 | 박막트랜지스터-액정표시장치 및 그 제조방법 |
KR100307385B1 (ko) * | 1997-03-05 | 2001-12-15 | 구본준, 론 위라하디락사 | 액정표시장치의구조및그제조방법 |
KR20060074325A (ko) * | 2004-12-27 | 2006-07-03 | 삼성전자주식회사 | 어레이 기판 및 이를 갖는 표시장치 |
Also Published As
Publication number | Publication date |
---|---|
EP2518558B1 (fr) | 2016-08-24 |
JP2012234179A (ja) | 2012-11-29 |
US8698149B2 (en) | 2014-04-15 |
US20120273789A1 (en) | 2012-11-01 |
EP2518558A2 (fr) | 2012-10-31 |
EP2518558A3 (fr) | 2013-04-17 |
KR20120122961A (ko) | 2012-11-07 |
CN202033562U (zh) | 2011-11-09 |
JP6030333B2 (ja) | 2016-11-24 |
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