KR101360622B1 - 화학 기계적 연마 패드 - Google Patents

화학 기계적 연마 패드 Download PDF

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Publication number
KR101360622B1
KR101360622B1 KR1020070050490A KR20070050490A KR101360622B1 KR 101360622 B1 KR101360622 B1 KR 101360622B1 KR 1020070050490 A KR1020070050490 A KR 1020070050490A KR 20070050490 A KR20070050490 A KR 20070050490A KR 101360622 B1 KR101360622 B1 KR 101360622B1
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KR
South Korea
Prior art keywords
polishing
polymer
polymer matrix
polishing pad
phase
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KR1020070050490A
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English (en)
Korean (ko)
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KR20070114019A (ko
Inventor
메리 조 컬프
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
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Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Publication of KR20070114019A publication Critical patent/KR20070114019A/ko
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Publication of KR101360622B1 publication Critical patent/KR101360622B1/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020070050490A 2006-05-25 2007-05-23 화학 기계적 연마 패드 Active KR101360622B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/442,077 US7445847B2 (en) 2006-05-25 2006-05-25 Chemical mechanical polishing pad
US11/442,077 2006-05-25

Publications (2)

Publication Number Publication Date
KR20070114019A KR20070114019A (ko) 2007-11-29
KR101360622B1 true KR101360622B1 (ko) 2014-02-07

Family

ID=38622487

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070050490A Active KR101360622B1 (ko) 2006-05-25 2007-05-23 화학 기계적 연마 패드

Country Status (7)

Country Link
US (1) US7445847B2 (https=)
JP (1) JP5346446B2 (https=)
KR (1) KR101360622B1 (https=)
CN (1) CN100540225C (https=)
DE (1) DE102007024459A1 (https=)
FR (1) FR2901499B1 (https=)
TW (1) TWI418443B (https=)

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US20100035529A1 (en) * 2008-08-05 2010-02-11 Mary Jo Kulp Chemical mechanical polishing pad
JP5846714B2 (ja) * 2009-04-06 2016-01-20 ニッタ・ハース株式会社 研磨パッド
US8697239B2 (en) * 2009-07-24 2014-04-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multi-functional polishing pad
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TWI431080B (zh) 2009-10-13 2014-03-21 Ｌｇ化學公司 化學機械拋光之漿料組成物及拋光方法
JP5606083B2 (ja) * 2010-01-29 2014-10-15 日本発條株式会社 独泡ウレタンシート及びその製造方法
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
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JP2012240192A (ja) 2011-05-24 2012-12-10 Rohm & Haas Co 向上した品質の多スペクトル硫化亜鉛
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US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
JP6004966B2 (ja) * 2013-02-22 2016-10-12 株式会社クラレ 研磨パッドおよび研磨方法
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
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WO2016158348A1 (ja) * 2015-03-30 2016-10-06 ニッタ・ハース株式会社 研磨パッド
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JP6389497B2 (ja) * 2016-11-09 2018-09-12 株式会社Kri 可撓性を有する透明耐熱フィルム
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Also Published As

Publication number Publication date
DE102007024459A1 (de) 2007-11-29
US7445847B2 (en) 2008-11-04
CN100540225C (zh) 2009-09-16
US20070275226A1 (en) 2007-11-29
FR2901499B1 (fr) 2010-09-03
JP5346446B2 (ja) 2013-11-20
KR20070114019A (ko) 2007-11-29
FR2901499A1 (fr) 2007-11-30
TW200806431A (en) 2008-02-01
JP2007313641A (ja) 2007-12-06
CN101077570A (zh) 2007-11-28
TWI418443B (zh) 2013-12-11

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