KR101342255B1 - 회로 접속 재료 및 이를 이용한 회로 부재의 접속 구조 - Google Patents

회로 접속 재료 및 이를 이용한 회로 부재의 접속 구조 Download PDF

Info

Publication number
KR101342255B1
KR101342255B1 KR1020127013954A KR20127013954A KR101342255B1 KR 101342255 B1 KR101342255 B1 KR 101342255B1 KR 1020127013954 A KR1020127013954 A KR 1020127013954A KR 20127013954 A KR20127013954 A KR 20127013954A KR 101342255 B1 KR101342255 B1 KR 101342255B1
Authority
KR
South Korea
Prior art keywords
circuit
connection material
circuit connection
film
resin
Prior art date
Application number
KR1020127013954A
Other languages
English (en)
Korean (ko)
Other versions
KR20120088782A (ko
Inventor
다카시 나카자와
고우지 고바야시
Original Assignee
히타치가세이가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히타치가세이가부시끼가이샤 filed Critical 히타치가세이가부시끼가이샤
Publication of KR20120088782A publication Critical patent/KR20120088782A/ko
Application granted granted Critical
Publication of KR101342255B1 publication Critical patent/KR101342255B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C08F222/1065—Esters of polycondensation macromers of alcohol terminated (poly)urethanes, e.g. urethane(meth)acrylates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F230/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
KR1020127013954A 2009-11-16 2010-11-15 회로 접속 재료 및 이를 이용한 회로 부재의 접속 구조 KR101342255B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009261000 2009-11-16
JPJP-P-2009-261000 2009-11-16
PCT/JP2010/070286 WO2011059084A1 (ja) 2009-11-16 2010-11-15 回路接続材料及びそれを用いた回路部材の接続構造

Publications (2)

Publication Number Publication Date
KR20120088782A KR20120088782A (ko) 2012-08-08
KR101342255B1 true KR101342255B1 (ko) 2013-12-16

Family

ID=43991737

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127013954A KR101342255B1 (ko) 2009-11-16 2010-11-15 회로 접속 재료 및 이를 이용한 회로 부재의 접속 구조

Country Status (6)

Country Link
JP (2) JP5518747B2 (zh)
KR (1) KR101342255B1 (zh)
CN (1) CN102598419B (zh)
BR (1) BR112012011692B1 (zh)
TW (1) TWI494402B (zh)
WO (1) WO2011059084A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013031702A1 (ja) * 2011-08-26 2013-03-07 旭化成イーマテリアルズ株式会社 太陽電池セル接続構造体の製造方法
JP6231256B2 (ja) * 2011-12-15 2017-11-15 デクセリアルズ株式会社 異方性導電接着剤、及び電子部品の接続方法
JP2013182823A (ja) * 2012-03-02 2013-09-12 Dexerials Corp 接続体の製造方法、及び異方性導電接着剤
JP6102105B2 (ja) * 2012-07-19 2017-03-29 日立化成株式会社 フィルム状回路接続材料及び回路接続構造体
KR102259384B1 (ko) * 2012-08-24 2021-06-02 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름의 제조 방법 및 이방성 도전 필름
TWI728136B (zh) 2012-08-24 2021-05-21 日商迪睿合股份有限公司 中間產物膜、異向性導電膜、連接構造體、及連接構造體之製造方法
JP2014192486A (ja) * 2013-03-28 2014-10-06 Dexerials Corp 回路部材の接続方法、及び接合体
KR20170093911A (ko) * 2015-03-23 2017-08-16 데쿠세리아루즈 가부시키가이샤 도전성 입자, 이방성 도전 접착제 및 접속 구조체
JP6631631B2 (ja) * 2015-09-04 2020-01-15 日立化成株式会社 接着剤組成物、異方導電性接着剤組成物、回路接続材料及び接続体
US20180175290A1 (en) * 2016-12-19 2018-06-21 Arm Ltd. Forming nucleation layers in correlated electron material devices
JP7446095B2 (ja) 2019-12-03 2024-03-08 デクセリアルズ株式会社 フィルム巻装体及び接続体の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009057612A1 (ja) * 2007-10-31 2009-05-07 Hitachi Chemical Company, Ltd. 回路接続材料及び回路部材の接続構造
JP2009111327A (ja) * 2007-10-12 2009-05-21 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路部材の接続構造

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63308880A (ja) * 1987-06-11 1988-12-16 Sony Chem Corp 異方性導電接着体
JP2905121B2 (ja) * 1995-07-19 1999-06-14 ソニーケミカル株式会社 異方性導電接着フィルム
JPH0955279A (ja) * 1995-08-10 1997-02-25 Hitachi Chem Co Ltd 電極の接続方法および該方法で得た電極の接続構造
JP3738655B2 (ja) * 2000-03-31 2006-01-25 ソニーケミカル株式会社 異方性導電接着材料及び接続方法
JP2003100367A (ja) * 2001-09-20 2003-04-04 Denso Corp 導電性接着剤、この接着剤を用いた回路基板間の接続方法および回路基板間の接続構造
JP2005071817A (ja) * 2003-08-25 2005-03-17 Asahi Kasei Electronics Co Ltd 異方導電性フィルム
JP2005197032A (ja) * 2004-01-05 2005-07-21 Asahi Kasei Electronics Co Ltd 異方導電性フィルム
KR101013260B1 (ko) * 2004-06-09 2011-02-09 히다치 가세고교 가부시끼가이샤 회로접속재료 및 회로부재의 접속 구조
JP2006108523A (ja) * 2004-10-08 2006-04-20 Hitachi Chem Co Ltd 異方性導電フィルムを用いた電気部品の接続方法
JP4860163B2 (ja) * 2005-02-15 2012-01-25 積水化学工業株式会社 導電性微粒子の製造方法
WO2009048070A1 (ja) * 2007-10-12 2009-04-16 Hitachi Chemical Company, Ltd. 回路接続材料及びそれを用いた回路部材の接続構造
JP2009242508A (ja) * 2008-03-31 2009-10-22 Asahi Kasei E-Materials Corp 接着剤及び接合体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009111327A (ja) * 2007-10-12 2009-05-21 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路部材の接続構造
WO2009057612A1 (ja) * 2007-10-31 2009-05-07 Hitachi Chemical Company, Ltd. 回路接続材料及び回路部材の接続構造

Also Published As

Publication number Publication date
JP2013138013A (ja) 2013-07-11
WO2011059084A1 (ja) 2011-05-19
CN102598419A (zh) 2012-07-18
JPWO2011059084A1 (ja) 2013-04-04
JP5716763B2 (ja) 2015-05-13
JP5518747B2 (ja) 2014-06-11
BR112012011692A2 (pt) 2018-03-27
TW201134904A (en) 2011-10-16
KR20120088782A (ko) 2012-08-08
BR112012011692B1 (pt) 2020-11-17
TWI494402B (zh) 2015-08-01
CN102598419B (zh) 2015-04-29

Similar Documents

Publication Publication Date Title
KR101342255B1 (ko) 회로 접속 재료 및 이를 이용한 회로 부재의 접속 구조
KR100732017B1 (ko) 회로접속재료, 이것을 이용한 필름상 회로접속재료,회로부재의 접속구조 및 그 제조방법
KR100559153B1 (ko) 전극의 접속방법, 그것에 사용되는 표면처리 배선판 및접착필름 및 전극의 접속구조
KR20100119830A (ko) 회로 접속 재료 및 회로 부재의 접속 구조
JP7107231B2 (ja) 接着剤フィルム
JP2017073386A (ja) 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
US11355469B2 (en) Connection structure and method for producing same
JP5176139B2 (ja) 回路接続材料及びそれを用いた回路部材の接続構造
KR101071039B1 (ko) 회로 접속 재료 및 그것을 이용한 회로 부재의 접속 구조
KR20100039419A (ko) 회로 부재의 접속 구조
JP2003323813A (ja) 回路接続材料及びそれを用いた回路端子の接続構造
JP4945881B2 (ja) 回路接続用支持体付接着剤、及びそれを用いた回路接続構造体
US11242472B2 (en) Adhesive film
US20210017427A1 (en) Adhesive film
JP2009275079A (ja) 回路接続材料及びそれを用いた回路部材の接続構造
US20230002644A1 (en) Connector production method and adhesive film
JP2006111806A (ja) 回路接続材料及びそれを用いた回路接続構造体
JP2008111091A (ja) 接着剤フィルム及び回路接続材料

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20161205

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20171201

Year of fee payment: 5